JPS6221532U - - Google Patents
Info
- Publication number
- JPS6221532U JPS6221532U JP1985097192U JP9719285U JPS6221532U JP S6221532 U JPS6221532 U JP S6221532U JP 1985097192 U JP1985097192 U JP 1985097192U JP 9719285 U JP9719285 U JP 9719285U JP S6221532 U JPS6221532 U JP S6221532U
- Authority
- JP
- Japan
- Prior art keywords
- joined
- chip
- sectional area
- cross
- current path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000014759 maintenance of location Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の原理図を兼ねる一実施例の説
明図、第２図は本考案の別の実施例の説明図、第
３図は従来例の説明図、第４図ａ，ｂ，ｃは本考
案の作用の説明図を示す。
明図、第２図は本考案の別の実施例の説明図、第
３図は従来例の説明図、第４図ａ，ｂ，ｃは本考
案の作用の説明図を示す。
Claims (1)
- 【実用新案登録請求の範囲】 全体でＵ字型の電流路を形成して成り、導電と
保持を兼ねる一対の導電部と、Ｕ字型の底部にお
いて接合される発熱チツプ部を有する加熱素子に
おいて、 前記チツプ部のワイヤをおさえる部分の電流路
と交わる断面積を、前記導電部と接合する部分の
断面積より小さくするとともに、 チツプ部の電流線方向で見た長さを前記Ｕ字型
の底部における上側と下側であまり変えない様に
両導電部と接合される接合部のチツプ部側を構成
するチツプ部のりんかくを４辺形の一部又は円の
一部を成す様に形成して成ることを特長とするワ
イヤボンデイング用は発熱チツプ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985097192U JPH039331Y2 (ja) | 1985-06-26 | 1985-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985097192U JPH039331Y2 (ja) | 1985-06-26 | 1985-06-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6221532U true JPS6221532U (ja) | 1987-02-09 |
| JPH039331Y2 JPH039331Y2 (ja) | 1991-03-08 |
Family
ID=30963888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985097192U Expired JPH039331Y2 (ja) | 1985-06-26 | 1985-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH039331Y2 (ja) |
-
1985
- 1985-06-26 JP JP1985097192U patent/JPH039331Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH039331Y2 (ja) | 1991-03-08 |