JPS62213136A - Stepper and repeater - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION 1. DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a step and repeat device used to perform some action on a substantially planar component. Such a component is characterized in that it has a rectangular array arranged on a flat surface,
It can be one of many things. The device can be used to perform repetitive actions on components arranged in series. Examples of step and repeat devices include microprocessor-wafer probes, printed circuit manufacturing devices, laser trimmers, and devices for hybrid circuit manufacturing.

Prior Art and Its Page 11 A wafer probe device is required to move and accurately position the wafer relative to a probe head. Once the wafer is placed, it is lifted into contact with the probe. The conventional apparatus includes a first bed that is precisely movable in a first dimension, a second bed that is mounted on the first bed and that is precisely movable in a second dimension that is perpendicular to the first dimension, and a second bed that is precisely movable in a second dimension. It has a support placed on top. The support is raised by a lift mechanism when the wafer is brought into contact with the probe.

The lift mechanism is fairly complex due to the need to accurately raise the entire wafer for lowering onto the wafer. The position of the wafer is observed using a microscope. The design difficulty lies in locating the microscope, bed, and lift mechanism within knee and eye distance of a seated user.

According to the present invention, a support for supporting a workpiece including a component and a lifting device are provided, the support being coupled by an arm to a mechanism for moving the support in a two-dimensional direction, and the support being coupled to a mechanism for moving the support in two dimensions, an arm is rotatably coupled to the mechanism at a position remote from the support, and the lift 1-device is capable of moving the support perpendicular to the two-dimensional direction and about the rotatable coupling; An electronically multioperable step and repeat device is provided, characterized in that the step and repeat device is characterized in that:

The lifting device may be separate from the mechanism.

Preferably, the mechanism is not located below the microscope in order to reduce the length of the device between the user's knees and eyes.

Significant benefits are obtained by eliminating the need to overlap the mechanisms described above. The lifting device can be of simple and lightweight construction. The mechanism need not necessarily include a rigid and fairly heavy bed to support the lifting device. The mechanism can be hidden under a dust cover, but the bed moving with the workpiece is difficult to cover. Hiding the mechanism reduces noise. The means for performing certain actions on the workpiece, such as wafer handling equipment, laser marking equipment, probes, line width measuring equipment, etc., are simplified. The device is easy to manufacture, resulting in reduced costs.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention will now be described in more detail with reference to embodiments shown in the accompanying drawings.

The device shown (dimensions not necessarily exact) has an arm (
2) with a support (1) arranged at one end to support the workpiece. Arm (2) is support (1)
It is rotatably supported by a hinge (3) located at a distance from. The rotation is about a horizontal axis, allowing the wafer to be moved vertically into contact with the probe. The workpiece can be secured to the support by applying reduced pressure by means of a suction device.

A counterbalance (4) is arranged so that the arm (2) and the support (1) can rotate around the center of gravity.

This allows the arm to have a simple and inexpensive sheet metal structure. As an alternative to this counterbalance, a spring can also be used to reduce the inertia of the device. A motor (5) drives a concealed chain loop (not shown) which is connected to the chuck or receiver of the support (1) to the pan (6). The chuck (6) is rotatable about a vertical axis <2).

The motor (5) acts as a means for adjusting the respective displacement (θ) of the workpiece fixed on the chuck (6).

The hinge (3) is connected to a mechanism that allows the arm and support to move in two mutually perpendicular directions (x and y).

The block (7) from which the hinge (3) depends is arranged so that it can slide in the X-axis direction on a precisely machined bar (8). A ball screw (9) driven by a motor (10) engages a ball nut in the block (7) and drives the block (7) along the bar (8). End support (11) of bar (8), (
12) Precisely machined bars (13), (14)
They are each arranged slidably in the y-axis direction on the top.

Bars (13), (14) are provided perpendicularly to bar (8). A ball screw (15) and chain drive (16) driven by a motor (17) drives the end support (11).

(xly) The mechanism is placed on four precisely machined supports (18).

Rotation of the chuck (6) around the Z-axis is controlled by a lift mechanism (19). Lift mechanism (19)
is like a screw device driven by a drive belt (20) and a motor (2). Chuck (6)
is simply placed on the lift mechanism and is not attached to it.

The advantages of the invention are clear when considering the assembly stage of the device.

First, four mutually planar length boats or mounts (18) are formed by machining a base plate (not shown). Previous devices with beds extending in the X and Y axes required the entire base plate to be machined to support its entire weight.

Shafts (13) and (14) parallel to each other are connected to the installation part (
18) through an inexpensive recirculating ball bushing connected to 18). The shafts (13), (4) are easily positioned using gauges.

The crossbar (8) is mounted on the end supports (11), (12) between the bars (13), (14). A cross table was suspended from the ceiling.

The arm (2) is mounted on the bar (8). Bar (8)
The squareness of the wafer mounted on the support (1)
This can be easily verified by using an exactly perpendicular grid.

Maintenance of the X1y mechanism is supported (1)
It will not be a hindrance. In contrast, in conventional devices this advantage was not available because the support was placed on the x1y mechanism.

The lightweight construction of the x,y mechanism allows the use of lightweight recirculating ball screws for the device. Previous devices used more expensive ball screws or leadscrews.

The present invention can be applied to manufacturing equipment for wafer probes, weather trimmers, other composite circuits, and other electronic components.

In addition to the above configuration, the apparatus may include a microprocessor-based control system, an edge sensor for detecting the edge of the wafer being tested, and a marker for marking defective chips with ink. can. In use, the apparatus is coupled to a host computer system for testing the tips coupled to the contacts of the probe.

The control system allows the user to manually and automatically control the position of the chuck with microscopically perceivable precision regarding the height and orientation of the chuck. The control system includes three subsystems: a main subsystem and two motor control subsystems. The main subsystem is responsible for operating the user system interface, such as the keyboard and display unit (VDU) display. The operation of the motor control subsystem that operates the motor is controlled by the main subsystem. The main subsystem also communicates with the host computer, controls the host computer interface, and controls the edge detection device and chip markers.

The motor control subsystem communicates with the host computer and issues signals to activate each motor. Acceleration and deceleration of the motor as well as protection functions are controlled by these subsystems. The keyboard at the user system interface may include the following keys:

1) DISP - This key starts and stops the system.

ii>HOME--This key returns to the ")-(OME" stage or load position.

iii>PAUSE - This key causes the operator to pause or pause a function.

1V) VAC - This key allows the operator to turn on and off the circuit that maintains or releases the vacuum.

l LCL - This key allows the operator to shut down the host computer when the device malfunctions or malfunctions.

vi) MARK - This key has several functions based on sub-functions that are used when a question arises.

vii) CONT - This key allows the operator to continue operation after a 'PAUSED' keystroke.

viii) DEL - This key allows the operator to delete previously entered data.

1X) ENTER - This key allows the operator to enter a selected function or subfunction, or to terminate a series of data presentations.

x) "Numer ic" - These keys allow the operator to enter numerical data to select or modify index size, Z-axis lift parameters, etc.

The host system communicates with each motor control subsystem along 26 buses.

The bus (local bus) includes:

Data 0ut - Line 4 of binary-encoded decimal data
Main data in (Data In) Line 4 of binary coded decimal data
Status In - Peripheral equipment (
4 lines for displaying the status of the co-processor (Status 0ut) - 4 lines for displaying the status of the central processing unit (main-processor) Drive select out (Drive 5 select)
0ut) - share the bus at any time
Up to 8 peripheral bags @ (co-processo
8 line reference power supply that allows rs > -
The data passed along the two lines local bus which are combined to produce a logic voltage of =QV to 5■ has two main types of values.

i) Absolute position data (for two axes) ii
) Conditional stop position ("5top *hen" pos
tiondata) data (for the two axes) The host computer communication system enables control and allows setting or modification of wafer parameters remotely, ie on-line, of the system.

Information exchange via either of the two communication systems falls into two categories:

i) The PaSSiVe JD?Land command does not cause a change in position after the command is executed.

The ATE/Tester interface facilitates the user to couple the probe system and the test system.

The system's auxiliary ports include a monitor for the edge detection system, and three ink applicators (one kerdrive).
) enable activation of the circuit.

A password protection system prevents accidental or unauthorized disclosure of the data contained on the device.

This device detects the edge of the wafer and
2. Collaborate with measures to minimize the time it takes to place a chip on a chip.

The conventional means for this is to use two probes known as edge sensors, such as break setting switches.
It is to be used as an intersecting assembly.

The switch opens when there is contact with the wafer. Opening of the contacts indicates that a probe fixture has been secured onto the wafer. A break in which the contacts remain closed indicates that the probe has advanced beyond the edge of the wafer. This wafer
Advancement past the edge advances the stage one index size in the y-axis direction.

A preferred embodiment of the device according to the invention is provided with the ability to test and determine the position of the entire device with respect to the position of the preceding device.

To determine whether the system requires an increase or decrease in left-right position, and to determine the overall length of devices to be probed in a row, the system first detects the probes in each of the four quadrants of the wafer. Determine which part of the back of the room is located.

The four quadrants are determined as follows.

A: The upper part of the center, which corresponds to the time between 9 o'clock and 12 o'clock on the clock face. B: The upper cloth part of the center, which corresponds to between 12 o'clock and 3 o'clock on the clock face. C: The 1st left part of the center, where the clock face is. The part corresponding to between 6 o'clock and 9 o'clock on D. The lower cloth part in the center. The part corresponding to between 3 o'clock and 6 o'clock on the clock face.

If the stage is in quadrant A relative to the object to be secured by the probe and the direction of movement is to the left, no calculations are required until quadrant B is reached.

If the direction of movement is right, then when an edge is predicted to the next rightward index, the stage must advance one index and shorten the column from the left.

If the stage is in quadrant B with respect to the position of the object to be fixed by the probe and the direction of movement is to the right, no calculations are needed until quadrant A is reached. If the direction of movement is left, then when an edge is predicted to the next leftward index, the stage must advance one index and shorten the column from the right.

If the stage is in quadrant C with respect to the object position to be fixed by the probe and the direction of movement is to the left, no calculations are required until the quadrant is reached. If the direction of movement is right, then when an edge is predicted at the next rightward index, the stage must advance one index and the columns must be incremented from the left.

If the stage is in a quadrant with respect to the position of the object to be fixed by the probe and the direction of movement is to the right, no calculations are required until quadrant C is reached. If the direction of movement is to the left, then when an edge is predicted at the next index to the left, the stage must advance one index and the columns must be incremented from the right.

The basic method for determining the next proceeding position includes the following questions.

a) Is the stage placed to the left or right of the center? b) Which direction is the stage moving? C) Judging from a) and b) above, is the length of the row increasing or decreasing? In most cases the system will already know the direction of movement and will only need to calculate a) and C).

Below are examples of the two algorithms required.

co ord 1ef: ; ; cheek lel co-ordinitrsH
if error move to next for
ri9htok 1eft a: call 1ndex 1eft H1ndex
1eftok 1tfts ffiDI/ al, 0ffh Xok f
lagleft-Mochishoichi: 011 al, 0ffh Hset fla
gset lefjjiil-al jjq 1ft-failj3 pos-neLquad+ P・s)olirigo d: 1ef fail 1 1ef-fail-Skip-1x left rail 1a: endof-sli ce no left fail 2 wealth call calc next-tight
He@rrectleft fail 2 x: call 1ndex dov; do mouth 1e
ft fail 2a: 1ef fail 3: call cale next-right; c
orrectleft fail 3at call 1ndex 1eft 1 do mouth 1
eft-fail-skipj: ! IOV al, O; set chan9e
direetj.

jmp 1eft-test-end; 1o
op backco-ord-riot: wealth ok-rich-al call 1ndex-riot + 1nep
x rightok-ri octopus: mval, 0ffh Hok flag
tighI-test-end+ CQI al, 0ffh; sel fl
agset right-fail-at jmp right-fail-2; pos-neg-quad-right:pos Jo
s Juajrightx9p 5hort oL-r
j%t-a H1aop passedf15ht
-fail-1: right-failja: end-of-slice-right: right-
fail-2: call cale-next-1eft; c
orrectrightgoaij2-x: right-fail-2a: vIghden-fail-3+ call caler+exert; co
rrect, tight-fail-3as ゆ-cal-upt do cal dawaH')mp TaTa6-6o i ((r
ad) K (rad) −(deB-ckw) X
(6pst-dounlJ Yu (all 1r: public das-fit, up-fro do endfro fok down a: call 1ndex rkkIni doguchisha---; m0w al, Drfh
Hak fla+3dcw-test-end+ clIPal, 0ffh B set fla
gset 6□) all-at jq down-fai13 posJos-quad-m1+Tl+pos-neg
-quad6oVns These algorithms determine where a point on the wafer is located with respect to the object to be fixed by the probe. Since the die or device to be tested is always about two directions, the software places the die within the theoretical wafer area.
It is necessary to determine the dimensions to ensure a good fit.

The edges of the wafer are typically slightly non-circular for two reasons.

i) Those with "flat" parts are used for orientation and processing.

ii) The edges of the wafer are chamfered.

According to the apparatus of the present invention, various difficulties caused by non-circular wafers are overcome by making the following assumptions. That is, flat areas on the wafer are treated as supplementary to the dimensions determined by industry standards, and chamfers are used to remove part of the part to be tested from the complete device at the periphery of the wafer. Treat it as a thing.

This problem is solved by a method similar to the algorithm described above, which calculates whether one and a half devices can fit into the space remaining on the wafer. Using this method eliminates the need for multiple edge sensors and avoids the lack of completeness of the check that can occur in conventional equipment with wafers of proper aspect ratio.

The tips of the probe card are generally arranged so that they lie in a common plane. Three reasons were found for probe card failure.

i) lack of planarity between the wafer surface and the object to be secured by the probe caused by mechanical misalignment of the workpiece holder relative to the chuck surface; To create uniform stress on the probe. In most cases, this is caused by excessive travel when using conventional edge detection techniques.

1ii) When using a chuck with improper lifting action, such as one that is already dead, i.e. when using a solenoid actuated chuck lift mechanism. this is,
When applied to wafers and probes, it creates excessive instantaneous force, which can cause probe tip switch bounce (SWitCh).
l) Quince) J causes unpredictable contact-related phenomena that dramatically affect parametric test results.

The present invention solves these problems as follows.

Providing an edge detection device as described above eliminates the risk of probing a defective device.

By restricting the edge detection circuit to use only the height sensing function (detecting the arrival of the wafer facing the wafer), the chuck can be lifted to the required height and the probe It doesn't bounce things that should stick.

The mechanical precision of the chuck lift mechanism is unique [
[l-lift (platter-1ift) obtained by J-pusher assembly. This allows for small chuck lift increases to accommodate any small taper in the wafer due to the cutting or slicing process.

The chuck lift in the system described above is approximately 6.3X 10-'ctn (0,0002
This can be done with an accuracy of 5 inches). With such precise chuck lift, reliable and accurate probe force can be maintained.

The apparatus may be capable of storing the height at the last position at which the wafer was detected.

Increase the allowable width of the wafer taper by +1.27X10-1~
-1, 27x 10-3as (±0.0005 inch)
By performing the search as follows, it is possible to eliminate the possibility of damage to the object to be fixed by the probe due to malfunction of the edge sensor.

The defective device has a diameter of 7.6X 10-2on (0,0
marked by an ink dot up to 30 inches).

Other problems arise due to moving the tip of the object to be fixed by the probe past the ink dot.

The ink dot device is 2.0X10-” arp(0,0
08 inches) to 2.3X10-”cm (0,009
inches) above the wafer surface, the probe tip may be coated with marking ink. In this case, partial or total electrical isolation may occur between the test system and the device to be tested.

To solve this problem, it has the ability to remember whether a device was marked (inked) or not during the next indexing proceeding to the neighboring device. If the device being handled has ink on it, the chuck is lowered a preprogrammed amount to remove the obstructing "pile" of ink. If the device passes the test, the chuck is lowered the required amount to ensure that the probe tip interacts with the clean side of the wafer.

Yet another problem is that the life of the object to be secured by the probe is unduly accelerated due to edge sensor malfunction. To solve this problem, physical points are installed in the chuck lift cycle. At this point, the edge sensor is adapted to open and close.

If the edge sensor does not perform the predetermined opening/closing motion, the chuck system will cease operation and the operator will be notified that a problem has occurred. This prevents further damage to the object to be secured by the probe and to the wafer under test.

The step and repeat device system software is
It has an internal local bus that is not accessed by users.

This local bus is physically formed as described above. The local bus supports one controller interface and two motor control peripheral processors.

The local bus interface facilitates reading and writing information to selected peripheral processors at any mutually convenient time. This convenient "time" is ascertained by the main processor which polls free and busy lines.

The main processor has the ability to initiate the current location of one or all applicable peripheral processors or buses (including 0 to 16500).

The main processor also has the ability to interrogate (read) the position of the stage at any point of travel.

Main processor at desired position (0-16500)
The peripheral processors can be commanded to move to positions on their respective axes by sending them as destruction commands.

The main processor can easily send a single 4-bit command to the peripheral processor, which is translated as shown below.

0000: Rotate r main clockwise quickly 0001: Rotate r main at h゛! ! 0010: Rotate the "r main" clockwise slowly 0011: Send the "r main" one step clockwise 0100: Rotate the "r auxiliary" clockwise until it stops 0101: r auxiliary " is sent one step clockwise 0110: The next data is the absolute position 0111:
The following data indicates the absolute destination 1000: Rotate r main quickly counterclockwise 1001 Rotate r main counterclockwise at medium speed 1010: Rotate r main counterclockwise 1011: Slowly rotate "r main" one step counterclockwise 1100: Rotate "r auxiliary" counterclockwise until it stops 1101: Send "r auxiliary" one step counterclockwise 1110: r main ” drive the axis to the limit “n 99” 1111: Drive the “r auxiliary” axis to the limit “n''

[Brief explanation of drawings]

The figure is a perspective view showing one embodiment of the device of the present invention. (1)...Support, (2) Arm, (3)...hinge, (6)...Chuck or plate, (13), (14)...bar, (19)...Lift device. (that's all)

Claims (1)

Claims: (1) A support and a lifting device for supporting a workpiece including a component, the support being coupled to a mechanism for moving the support in two dimensions by an arm, the arm is pivotally coupled to the mechanism at a location remote from the support, and the lifting device is adapted to move the support perpendicular to the two-dimensional direction and about the pivotable coupling. An electronically multioperable step and repeat device, characterized in that: 2. The step and repeat device of claim 1, wherein the lifting device is remote from the mechanism and is adapted to move the support. The invention further comprises an object to be fixed by a probe brought into contact with the workpiece, and the rotation axis of the arm, the contact position with the workpiece, and the object to be fixed by the probe are arranged in a common horizontal plane. Paragraph 1 or 2
Step and repeat devices as described in Section. (4) an object to be fixed by a probe that contacts successively arranged devices on the wafer; Claims 1, 2 or 3, comprising a device for automatically moving the support and a device for positioning the entire series of devices arranged on the wafer. Step and repeat devices as described in Section. (5) The step according to claim 4, further comprising a safety device to prevent the object to be fixed by the probe from coming into contact with any imperfect devices at the edge of the wafer. and repeat equipment. (6) comprising an edge sensor for detecting the position of the edge of the wafer, and a safety device for determining whether the edge sensor has previously detected an edge of the wafer if no edge is detected; 6. A step and repeat device according to claim 5, wherein the safety device is adapted to prevent movement of the support if an edge is to be detected. (7) further comprising a memory for storing the vertical position of the device in contact with the object to be fixed by the probe, and a device for calculating possible vertical positions of the successively arranged devices; Claim No. 5
7. Step and repeat device according to paragraph 6. (8) The device further includes a marker for adding a mark to a rejected device, and a device for calculating and storing the position of the mark and preventing the ring of the probe from coming into contact with the marker. Claim 5,
Step and repeat device according to clause 6 or 7. (9) Divide the wafer into four quadrants, determine the position of the object to be fixed by the probe with respect to the four quadrants, determine the position of the end of the row of devices on the wafer, and Claim 4, wherein the entire device arranged in a row on the wafer is positioned by: calculating the position of a starting point of the row; and calculating the length of the row of devices. 9. The step and repeat device according to any one of clauses 8 to 8.