JPS62212Y2 - - Google Patents
Info
- Publication number
- JPS62212Y2 JPS62212Y2 JP14302280U JP14302280U JPS62212Y2 JP S62212 Y2 JPS62212 Y2 JP S62212Y2 JP 14302280 U JP14302280 U JP 14302280U JP 14302280 U JP14302280 U JP 14302280U JP S62212 Y2 JPS62212 Y2 JP S62212Y2
- Authority
- JP
- Japan
- Prior art keywords
- reflective frame
- light
- emitting diode
- light emitting
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000149 argon plasma sintering Methods 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
【考案の詳細な説明】
本考案は薄くて安価であり、しかも均一に発光
する発光ダイオード平面ランプに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a light emitting diode flat lamp that is thin, inexpensive, and emits light uniformly.
従来発光ダイオードを用いて制御板表示や押釦
面表示をする発光ダイオード平面ランプにおいて
は、第１図ａに示すような反射枠型と、同図ｂに
示すような導光体型があつた。反射枠型は、透明
板又は薄板１６に発光ダイオード１８を載置し、
反射枠１２で覆うものであるが、その電極１７，
１７に透明電極を用いると、高価な上発光ダイオ
ードの載置が困難なので、普通の銅箔等を用いて
いたが、このためにその電極１７，１７が影とな
つて表示される。また導光体型はランプ２８の上
に末広がりの導光体３０をかぶせ、頂面に光散乱
膜２１を設けるものであるが、光散乱剤等を導光
体３０に混練すると表示面での光量を著しく減少
するので混練できず、光散乱膜２１のみでは表示
面を均一な明るさに保てない。さらにいずれの方
法でも発光ダイオードは小さいので大きな面積を
照らそうとすると底面から表示面までの距離が大
きくなつてしまう。これは平面ランプが大きくな
るというだけではなく、明るさは距離の自乗に反
比例するので、豆球等に比べて表示は極端に暗く
みえる。 Conventional light-emitting diode flat lamps that use light-emitting diodes to display on a control board or on a push button surface include a reflective frame type as shown in FIG. 1a and a light guiding type as shown in FIG. 1b. The reflective frame type has a light emitting diode 18 mounted on a transparent plate or thin plate 16,
Although it is covered with a reflective frame 12, its electrodes 17,
If a transparent electrode is used for the electrode 17, it is expensive and it is difficult to mount a light emitting diode, so an ordinary copper foil or the like is used, but for this reason, the electrodes 17, 17 are displayed as shadows. In addition, the light guide type covers the lamp 28 with a light guide 30 that widens toward the end, and a light scattering film 21 is provided on the top surface, but if a light scattering agent or the like is mixed into the light guide 30, the amount of light on the display surface will be reduced. The light scattering film 21 alone cannot maintain uniform brightness on the display surface. Furthermore, in either method, the light emitting diode is small, so if you try to illuminate a large area, the distance from the bottom surface to the display surface will increase. This is not only because the flat lamp becomes larger, but also because the brightness is inversely proportional to the square of the distance, so the display appears extremely dark compared to a miniature lamp or the like.
本考案はこのような欠点を改めるためになされ
たもので、以下、実施例に基づいて本考案を詳細
に説明する。 The present invention has been made to overcome these drawbacks, and the present invention will be described in detail below based on examples.
第２図は本考案の実施例を示す断面図で、１は
白色樹脂成型品からなる反射枠で、上方には希望
する表示の大きさ、形状をした開口部２を有し、
下方には上方よりも小さい面積の開口部３を有し
ている。４はアルミニウム箔５と保護薄板６とか
らなる鏡面板で、反射枠１の下部の開口部３を覆
うように底面に貼付されている。７，７は銅、鉄
などからなるリード線で、反射枠１の略中央部ま
で突出している。このため必要に応じて反射枠１
は上下に分割できる構造にしておいてもよい。８
はガリウム燐（GaP）等の発光ダイオードで、リ
ード線７の略先端部に下向きに載置されており金
属細線９等で配線が施こされている。１０は、ア
ルミニウム、白色顔料等からなる光散乱剤１１，
１１…を混練したエポキシ等の透明又は着色透明
又は半透明の透光性樹脂で、反射枠１の内部に充
填されている。尚図示してないが、必要に応じて
反射枠１の上方の開口部２を覆う保護シート又は
光散乱シート又は着色シートを設けてもよいが、
このシートによつて光が吸収されないように留意
すべきである。 FIG. 2 is a sectional view showing an embodiment of the present invention, in which 1 is a reflective frame made of a white resin molded product, and an opening 2 having a desired display size and shape is provided above.
The lower part has an opening 3 having a smaller area than the upper part. Reference numeral 4 denotes a mirror plate consisting of an aluminum foil 5 and a protective thin plate 6, which is attached to the bottom of the reflective frame 1 so as to cover the opening 3 at the bottom. Reference numerals 7, 7 are lead wires made of copper, iron, etc., which protrude almost to the center of the reflective frame 1. For this reason, if necessary, reflector frame 1
may be structured so that it can be divided into upper and lower parts. 8
is a light emitting diode made of gallium phosphide (GaP) or the like, which is placed facing downward approximately at the tip of the lead wire 7, and is wired with a thin metal wire 9 or the like. 10 is a light scattering agent 11 made of aluminum, white pigment, etc.
The inside of the reflective frame 1 is filled with a transparent or colored transparent or translucent translucent resin such as epoxy mixed with 11. Although not shown, a protective sheet, a light scattering sheet, or a colored sheet may be provided to cover the opening 2 above the reflective frame 1 if necessary.
Care should be taken that no light is absorbed by this sheet.
本考案の発光ダイオード平面ランプはこのよう
な構造から成つているので、発光ダイオード８の
光は光散されながら鏡面板４に至り、ここで反射
されて再び拡散されながら上方に指向し表示面に
至る。鏡面仕上の反射枠反射面と異なり鏡面板４
は乱板射が少ない（樹脂成型品の反射枠は乱反射
や光吸収がさけられない）ため、この平面ランプ
は鏡面板４が疑似光源となり、全体を薄くしても
表示面で均一な発光となる。しかも全体が薄いと
各光路は短かいので明るくなる。さらに発光ダイ
オード８をささえるものはリード線７であるから
組立てやすいばかりでなく、中央に位置出来るの
で、光散乱によつてその影を消すことができる。
また樹脂反射枠をメツキする等で本考案と同等の
効果を上げることができるが、鏡面板４が安価な
のに比べ、この方法は４乃至10倍に高価となる。
尚、上述の例において、リード線７，７は真一文
字に配置されているが、これに限られるものでな
く、例えば２本のリード線を貫通させて、それに
またがるように発光ダイオードを取付てもよく、
又発光ダイオード８も複数個用いてもよく、特に
異なる発光色の発光ダイオードを用いると一層用
途が広がる。 Since the light-emitting diode flat lamp of the present invention has such a structure, the light from the light-emitting diode 8 is scattered while reaching the mirror plate 4, where it is reflected and diffused again while being directed upward and onto the display surface. reach. Unlike the mirror-finished reflective frame reflective surface, the mirror-finished plate 4
Since there is little scattered radiation (resin-molded reflective frames cannot avoid diffused reflection and light absorption), the mirror plate 4 of this flat lamp serves as a pseudo light source, and even if the overall thickness is made thinner, uniform light emission can be achieved on the display surface. Become. Moreover, if the whole is thin, each optical path will be short, so it will be bright. Furthermore, since the light emitting diode 8 is supported by the lead wire 7, it is not only easy to assemble, but also can be positioned in the center, so that its shadow can be eliminated by light scattering.
Although the same effect as the present invention can be achieved by plating the resin reflective frame, etc., this method is 4 to 10 times more expensive than the mirror plate 4, which is inexpensive.
In the above example, the lead wires 7, 7 are arranged in a straight line, but the arrangement is not limited to this. For example, the two lead wires may be passed through and a light emitting diode may be mounted so as to straddle them. Good too,
Further, a plurality of light emitting diodes 8 may be used, and in particular, the use of light emitting diodes of different colors will further expand the range of uses.
以上の如く本考案は、上下に開口部を有する反
射枠と、その反射枠の少なくとも略中央部に突出
する複数のリード線と、反射枠の略中央部におい
てリード線の下方に載置固着され配線が施こされ
た発光ダイオードと、反射枠の下方開口部を覆う
鏡面板と、反射枠の内部に充填され光散乱剤を混
練した透光性樹脂とを具備した発光ダイオードの
平面ランプであるから、薄くて高輝度に且均一に
発光し、しかも安価である。 As described above, the present invention includes a reflective frame having openings at the top and bottom, a plurality of lead wires protruding from at least approximately the center of the reflective frame, and a plurality of lead wires placed and fixed below the lead wires at approximately the center of the reflective frame. A light emitting diode flat lamp comprising a light emitting diode with wiring, a mirror plate covering the lower opening of a reflective frame, and a translucent resin filled inside the reflective frame and kneaded with a light scattering agent. Therefore, it is thin, emits light with high brightness and uniformly, and is inexpensive.
第１図abは従来の平面ランプの断面図、第２
図は本考案の発光ダイオード平面ランプの断面図
である。
１……反射枠、３……下方開口部、４……鏡面
板、７，７……リード線、８……発光ダイオー
ド、１０……透光性樹脂、１１，１１……光散乱
剤。
Figure 1 ab is a cross-sectional view of a conventional flat lamp;
The figure is a cross-sectional view of the light emitting diode flat lamp of the present invention. DESCRIPTION OF SYMBOLS 1... Reflection frame, 3... Lower opening, 4... Mirror plate, 7, 7... Lead wire, 8... Light emitting diode, 10... Transparent resin, 11, 11... Light scattering agent.
Claims (1)
その反射枠の少なくとも略中央部に突出する複数
のリード線と、反射枠の略中央部においてリード
線の下方に載置固着され配線が施こされた発光ダ
イオードと、反射枠の下方開口部を覆う鏡面板
と、反射枠の内部に充填され光散乱剤を混練した
透光性樹脂とを具備した事を特徴とした発光ダイ
オードの平面ランプ。 A reflective frame made of white resin and having openings at the top and bottom;
A plurality of lead wires protrude at least approximately at the center of the reflective frame, a light emitting diode placed and fixed below the lead wires at approximately the center of the reflective frame, and wired, and a lower opening of the reflective frame. A light emitting diode flat lamp characterized by comprising a mirror plate for covering and a translucent resin filled inside the reflective frame and kneaded with a light scattering agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14302280U JPS62212Y2 (en) | 1980-10-06 | 1980-10-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14302280U JPS62212Y2 (en) | 1980-10-06 | 1980-10-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5766565U JPS5766565U (en) | 1982-04-21 |
| JPS62212Y2 true JPS62212Y2 (en) | 1987-01-07 |
Family
ID=29502788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14302280U Expired JPS62212Y2 (en) | 1980-10-06 | 1980-10-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62212Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005055676A (en) * | 2003-08-05 | 2005-03-03 | Sekisui Jushi Co Ltd | Light-emitting display device, signature, and road sign |
-
1980
- 1980-10-06 JP JP14302280U patent/JPS62212Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5766565U (en) | 1982-04-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0246424A (en) | Surface light emitting device | |
| JPH0711704U (en) | Indicator light | |
| JPH10125959A (en) | Side-emission chip led | |
| WO2001006175A1 (en) | Method of forming flat light and diffuse pattern | |
| JPS62212Y2 (en) | ||
| JPH0451493Y2 (en) | ||
| JPH0432775Y2 (en) | ||
| JP5797945B2 (en) | LED lamp | |
| JP2001286373A (en) | Mirror with illuminating device | |
| JP2000035347A (en) | Meter structure | |
| JPH0134822Y2 (en) | ||
| JPH06312600A (en) | Light emitting decorative implement | |
| JP2629985B2 (en) | Light emitting diode | |
| JP3527178B2 (en) | LED unit for signal lights | |
| CN220269254U (en) | Blue lamp | |
| JP2544236Y2 (en) | Light emitting diode lamp | |
| JPS5967673A (en) | Light emitting diode for surface illumination | |
| JPS6328456Y2 (en) | ||
| JPH11121808A (en) | Device for led display | |
| JPH036937Y2 (en) | ||
| CN113078253B (en) | Art exhibition lighting device | |
| JP2005149848A (en) | Illumination device using light-emitting diode | |
| JPS604215Y2 (en) | Light emitting diode matrix display | |
| JPH04206103A (en) | Lighting fixture | |
| JPH0434609Y2 (en) |