JPS6221036Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a cylindrical magazine for accommodating a plurality of chip-shaped electronic components arranged and stacked inside the magazine, and particularly relates to improvements in shape and structure.

FIG. 1 is a partially cutaway perspective view of a magazine in which chip-shaped electronic components are housed, which is an interesting prior art of this invention. Referring to FIG. 1, a plurality of chip-shaped electronic components 2, . A stopper 3 is fitted into the opening of the magazine 1 to close it. This stopper 3 is intended to prevent the chip-shaped electronic components 2 stored in the magazine 1 from spilling out, and also to move within the magazine 1 when electronic components are inserted into the magazine 1. In some cases, spaces for accommodating a predetermined amount of electronic components 2 are sequentially created depending on the situation, thereby facilitating the storage of electronic components 2 in an aligned state.

FIG. 2 is a cross-sectional view for explaining a typical conventional example of the internal shape of the magazine 1. FIG. 3 is a perspective view for explaining the configuration of a typical chip-shaped electronic component 2. FIG. As shown in FIG. 2, the inner wall 4 of the conventional magazine 1 has a rectangular cross section, and all four sides thereof are linear. On the other hand, the chip-shaped electronic component 2 is, for example, a multilayer ceramic capacitor, and has external electrode surfaces 5, 5 formed on a pair of opposing end surfaces, respectively.
These are formed, for example, by dipping into electrode paint, so that when pulled up they extend to a certain common surface of the chip. Such a chip-shaped electronic component 2 is directly soldered to a suitable wiring board via the external electrode surfaces 5, 5, and is thereby electrically and mechanically connected to the wiring board. be. As for the structure of such a chip-shaped electronic component 2, since the external electrode surfaces 5, 5 are formed by the dipping method as described above, the end surfaces inevitably have a convex rounded surface due to the surface tension of the electrode paint. There are many parts with external electrode surfaces 5, 5.
It should be noted that there is always an exposed ceramic portion 6 due to the state of formation. This means that when this chip-shaped electronic component 2 is stored in the magazine 1,
This is because it causes problems as described below.

FIG. 4, FIG. 5, and FIG. 6 are cross-sectional views of the magazine 1, respectively, for explaining the conventional problems;
They are a cross-sectional view and a longitudinal cross-sectional view.

Referring to FIG. 4, the chip-shaped electronic component 2 is positioned in the magazine 1 such that the exposed ceramic portion 6 and the inner wall 4 are in contact with each other. In this state, the exposed ceramic portion 6, which has a relatively rough surface, is in contact with the inner wall 4, so the frictional resistance when the chip-shaped electronic component 2 moves within the magazine 1 is large. movement cannot be performed smoothly. Moreover, since the chip-shaped electronic component 2 cannot be moved unless a strong force is applied, the surface of the chip-shaped electronic component 2 is scratched, leading to quality deterioration and a decrease in commercial value.

Referring to FIG. 5, the positional state of the chip-shaped electronic component 2 within the magazine 1 is as follows:
and are in point or line contact. Therefore,
The force applied to move the chip-shaped electronic component 2 is concentrated in one point or in a very narrow area, making it easy to get stuck and causing an increase in the force required to move it.

Furthermore, as is clear from a comparison between FIG. 4 and FIG. 5, the chip-shaped electronic component 2 changes from a state in which one corner portion is in contact with the magazine inner wall 4 to another corner portion in contact with the magazine inner wall 4. It is possible to freely rotate (rotate with the axis of rotation facing the axis of the magazine 1) until it comes into contact with the magazine 1. As a result, the chip-shaped electronic components 2 wobble inside the magazine 1, and as shown in FIG.
A state in which the two are in contact occurs. In this state, a force F is applied to move the chip-shaped electronic component 2.
When this force F is applied, this force F is dispersed into forces f, .

Therefore, the main purpose of this invention is to solve the above-mentioned problems, namely, to create such an internal structure in which chip-shaped electronic components can move smoothly in the magazine and there is less rattling of the chip-shaped electronic components. An object of the present invention is to provide a magazine for storing stacked electronic components having a shape.

This idea consists of stacking and storing chip-shaped electronic components.
This is a rectangular cylindrical magazine for sliding chip-shaped electronic components in a stacked state within the magazine, and has the following features. That is, each of the four inner wall surfaces of the magazine is characterized by being formed with a concave radius surface when viewed in cross section.

Other objects and features of this invention will become clearer from the detailed description given below with reference to the drawings.

FIG. 7 is a cross-sectional view showing an embodiment of this invention. FIG. 8 is a plan view showing the shape of the chip-shaped electronic component 2 stored in the magazine 7 of FIG.
FIG. 9 is a cross-sectional view showing a state in which the chip-shaped electronic component 2 of FIG. 8 is housed in the magazine 7 of FIG. 7.

As shown in FIG. 7, the magazine 7 has a rectangular cylindrical shape, and the four inner wall surfaces constituting the inner wall 8 all have concave rounded surfaces when viewed in cross section. It is formed so that a side with a radius appears. For example, in Figure 7,
Rm is shown as representing the R value of the inner wall surface constituting the shorter side. Furthermore, the maximum length formed between these shorter sides is indicated by Lm.

The chip-shaped electronic components 2 shown in FIG. 8 are stored in such a magazine 7 in the state shown in FIG. 9. In the example shown here, the chip-shaped electronic component 2
The external electrode surfaces 5, 5 are formed with convex rounded surfaces. The R value of the R surface of the external electrode surface 5 is indicated by Rc. Further, the maximum dimension in the longitudinal direction of the chip-shaped electronic component 2 is indicated by Lc.

Referring to FIG. 9, if the chip-shaped electronic component 2 is slid within the magazine 7 while it is housed in the magazine 7, it will eventually come into contact with the inner wall 8 thereof. That is, it is inevitable that the chip-shaped electronic component 2 comes into contact with the inner wall 8. in this case,
In order to allow the chip-shaped electronic component 2 to move smoothly within the magazine 7, only the relatively smooth external electrode surface 5 should come into contact with the inner wall 8, and the rough ceramic exposed portion 6 should never touch the inner wall. 8 must be avoided. In this sense, magazine 7
It is important that concave radiuses are formed on all four inner wall surfaces constituting the inner wall 8. With this configuration, as shown in FIG. 9, no matter how the chip-shaped electronic component 2 rotates within the magazine 7 (rotation with the axis of the magazine 7 as the rotation axis), the ceramic will not be exposed. The part 6 never comes into contact with the inner wall 8.

As shown in FIGS. 7 to 9, in the illustrated embodiment, the R value Rm and the R value Rc are set to be approximately equal, and the dimension Lm is set as close as possible to the dimension Lc. ing.
However, there are various shapes of chip-shaped electronic components 2, and even if the chip-shaped electronic components 2 are of the same type, individual dimensions may vary, so the relationship between these dimensions is However, the relationship is not particularly limited to that shown in the drawings.

As described above, according to this invention, all four inner wall surfaces of the magazine are formed with concave rounded surfaces, so the chip-shaped electronic components stored in this magazine are relatively smooth. It is possible to make contact with the inner wall only at the rough external electrode surface, and never to contact the inner wall at the exposed portion of the ceramic, which is a rough surface. Therefore, the chip-shaped electronic component can be smoothly moved within the magazine. The effect of smooth movement of chip-shaped electronic components is that the force required to move 200 chip-shaped electronic components when stored was about 1 kg or more, but this can be reduced to less than 200 g. This is proven by the following. Furthermore, as mentioned above, since the chip-shaped electronic components move smoothly within the magazine, it is easy to insert and remove the chip-shaped electronic components, and no excessive force is applied to the chip-shaped electronic components. This prevents chip-like electronic components from being scratched or broken.
This can be expected to improve the reliability of the quality of chip-shaped electronic components and also to improve the operating rate of the chip-shaped electronic component insertion machine or extraction device.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway perspective view of a magazine in which chip-shaped electronic components are housed, which is an interesting prior art of this invention. FIG. 2 is a cross-sectional view for explaining a typical conventional example of the internal shape of the magazine 1. Figure 3 shows a typical chip-shaped electronic component 2
FIG. 2 is a perspective view for explaining the configuration. Figure 4,
FIGS. 5 and 6 are a cross-sectional view, a cross-sectional view, and a vertical cross-sectional view, respectively, of the magazine 1 for explaining the conventional problems. FIG. 7 is a cross-sectional view showing an embodiment of this invention. FIG. 8 is a plan view showing the shape of the chip-shaped electronic component 2 stored in the magazine 7 of FIG. Figure 9 shows magazine 7 in Figure 7.
9 is a cross-sectional view showing a state in which the chip-shaped electronic component 2 of FIG. 8 is housed. FIG. In the figure, 2 is a chip-shaped electronic component, 5 is an external electrode surface, 7 is a magazine, 8 is an inner wall, and Rm is an inner wall 8.
The R value of the short side portion of Rc is the R value of the external electrode surface 5.

Claims (1)

[Scope of utility model registration request] In a rectangular cylindrical magazine for accommodating a plurality of chip-shaped ceramic electronic components having external electrode surfaces formed on both end surfaces in a stacked manner inside the magazine, the four inner walls of the magazine are A magazine for stacked storage of electronic components, characterized in that both sides are formed with concave rounded surfaces when viewed from above.