JPS62209163A - Dipping material for capacitor - Google Patents
Dipping material for capacitorInfo
- Publication number
- JPS62209163A JPS62209163A JP5202286A JP5202286A JPS62209163A JP S62209163 A JPS62209163 A JP S62209163A JP 5202286 A JP5202286 A JP 5202286A JP 5202286 A JP5202286 A JP 5202286A JP S62209163 A JPS62209163 A JP S62209163A
- Authority
- JP
- Japan
- Prior art keywords
- pref
- dipping material
- resin
- isocyanurate
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 24
- 238000007598 dipping method Methods 0.000 title claims abstract description 20
- 239000003990 capacitor Substances 0.000 title claims description 20
- -1 isocyanurate compound Chemical class 0.000 claims abstract description 17
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 11
- 239000000178 monomer Substances 0.000 claims abstract description 9
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 9
- 239000003999 initiator Substances 0.000 claims abstract description 8
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 8
- 238000012719 thermal polymerization Methods 0.000 claims abstract description 8
- 229920006337 unsaturated polyester resin Polymers 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 abstract description 3
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 abstract description 2
- DAILYOMFBRIOIM-UHFFFAOYSA-N 2-methylprop-2-enoic acid;1,1,2-tribromo-2-(2-hydroxyethoxy)ethanol Chemical compound CC(=C)C(O)=O.OCCOC(Br)C(O)(Br)Br DAILYOMFBRIOIM-UHFFFAOYSA-N 0.000 abstract description 2
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 abstract 1
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 229920006305 unsaturated polyester Polymers 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical class OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 210000001015 abdomen Anatomy 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- FAIHWYDOMLEEQJ-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenylethanol;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.OCCOCC(O)C1=CC=CC=C1 FAIHWYDOMLEEQJ-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 241001441723 Takifugu Species 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000009331 sowing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明はコンデンサー特にフィルムコンデンサーをグイ
フビフグ封止して耐湿性を上げるようにしたコンデンサ
ー用ディッピング材に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a dipping material for capacitors, which seals capacitors, particularly film capacitors, to improve moisture resistance.
従来、フィルムコンデンサーをディッピングして樹脂封
止するということが行なわれているが、従来のグイッピ
フグ材は加熱硬化型の２液エポキシ樹脂が使用されてい
た。しかしながら、このものけ硬化するまでに２〜２４
時間かかつて硬化時間が長いといり欠点があシ、従って
硬化するまでに樹脂が垂れていわゆるヘソができ、後で
このヘソを削除しなければならないという欠点があった
。Conventionally, film capacitors have been encapsulated with resin by dipping, but the conventional Guippi Fugu material used a heat-curable two-component epoxy resin. However, it takes 2 to 24 hours before this Mononoke hardens.
In the past, the disadvantage was that the curing time was long, and therefore the resin dripped before curing, creating what was called a belly button, which had to be removed later.
また、これらの欠点を改良したものとして、ディッピン
グ材をアクリレート系の紫外Ｍ硬化型樹脂で作成し、紫
外線の照射により瞬時に硬化させるという方法もあるが
、このグイッピフグ材ではフィルムコンデンサーの誘電
特性が損なわれ易く、しかも耐湿性に劣るという欠点が
あった。In addition, to improve these drawbacks, there is a method in which the dipping material is made of an acrylate-based ultraviolet M-curing resin and instantly cured by irradiation with ultraviolet rays, but this Guippifugu material does not have the dielectric properties of the film capacitor. It has the drawbacks of being easily damaged and having poor moisture resistance.
本発明は１紀の点に鑑みて成されたものであって、短時
間で硬化させることができてディッピング材が垂れると
いうことがなく、またコンデンサーの誘電特性を損うこ
とがなく、さらに耐湿性をも向上させることができ、更
に加えてフィルムとのヌレがよくはじきの少ないコンデ
ンサー用ディッピング材を提供することを目的とするも
のである。The present invention was made in view of the points of the first century, and it can be cured in a short time, the dipping material does not drip, it does not impair the dielectric properties of the capacitor, and it is moisture resistant. It is an object of the present invention to provide a dipping material for capacitors which can improve the properties of the dipping material and which also has good wetting with the film and is less likely to be repelled.
すなわち、本発明のコンテ゛ンサー用グイッピフグ材は
、不飽和ポリエステル系樹脂とイソシアヌレート系化合
物とアクリレート系化合物とビニル糸モノマーと光重合
開始剤と熱重合開始剤とを配合して成るもので、紫外線
硬化させることによシ材料の垂れをなくすることができ
ると共に、樹脂としては不飽和ポリエステ／Ｌ’糸樹脂
を用いることにより誘電特性を上げ、また耐湿性を向上
して上記目的を達成したものである。That is, the Guippifugu material for a container of the present invention is made by blending an unsaturated polyester resin, an isocyanurate compound, an acrylate compound, a vinyl thread monomer, a photopolymerization initiator, and a thermal polymerization initiator. By doing so, it is possible to eliminate sagging of the material, and by using unsaturated polyester/L' thread resin as the resin, the dielectric properties are improved and the moisture resistance is improved, achieving the above objectives. be.
以下本発明の詳細な説明する。本発明に係るディッピン
グ材は、不飽和ポリエステ／Ｌ／糸樹脂と、イソシアヌ
レート系化合物とアクリレート系化合物とビニル糸モノ
マーと光重合開始剤と熱重合開始剤とを配合混練して調
整するものである。不飽和ポリエステル系樹脂としては
、イソまたはテレのものが好ましく、イソシアヌレート
系化合物としてはトリス（２アクリロキンエチＩ’）イ
ソシアヌレート、トリス（２メタアクリｐキシエチ／Ｌ
／）イソシアヌレート等が好ましく、アクリＶ−）系化
合物としてはトリブロモジエチレンクリコールメタアク
リレート等が好−ましい。またビニル糸モノマーとして
は、α、β不飽和ビニル系七ツマーを用いるのが好まし
く、例えばスチレン、メチルスチレン、ジビニルベンゼ
ン等を用いることができ、１乃至３種用いるものである
。また、光重合開始剤としてはベンゾインエチルエーテ
ル等と用いることができる。熱重合開始剤としてはｔ−
ブチルパーオキシベンゾエート停を用いることができる
。これらの各成分の配合量は不飽和ポリエステ／Ｌ’系
樹脂１００重ビオ（以下単に部と記す）に対しイソシア
ヌレート系化合物ｌＯ〜７０部、アクリレート系化合物
５〜３５部、ビニル糸モノマー１０〜７０部、光重合開
始剤１〜１０部、熱重合開始剤１〜１０部とするのが好
ましい。また、必要に応じて重合禁止剤、脱泡剤等を配
合することができる。このようにして各配合成分を混合
してコンテ゛ンサー用ディッピフグ材を得るのである。The present invention will be explained in detail below. The dipping material according to the present invention is prepared by blending and kneading unsaturated polyester/L/thread resin, an isocyanurate compound, an acrylate compound, a vinyl thread monomer, a photopolymerization initiator, and a thermal polymerization initiator. be. The unsaturated polyester resin is preferably iso or tele, and the isocyanurate compounds are tris(2 acryloquine ethyl I') isocyanurate, tris(2 methacryloquine ethyl/L
/) Isocyanurate etc. are preferable, and as the acrylic V-) type compound, tribromodiethylene glycol methacrylate etc. are preferable. As the vinyl yarn monomer, it is preferable to use α,β unsaturated vinyl heptamers, such as styrene, methylstyrene, divinylbenzene, etc., and one to three of these can be used. Furthermore, benzoin ethyl ether or the like can be used as a photopolymerization initiator. As a thermal polymerization initiator, t-
Butyl peroxybenzoate stopper can be used. The blending amounts of each of these components are 10 to 70 parts of isocyanurate compound, 5 to 35 parts of acrylate compound, and 10 to 10 parts of vinyl thread monomer per 100 parts of unsaturated polyester/L'-based resin. It is preferable to use 70 parts, 1 to 10 parts of photopolymerization initiator, and 1 to 10 parts of thermal polymerization initiator. Further, a polymerization inhibitor, a defoaming agent, etc. can be added as necessary. In this way, each component is mixed to obtain a dippy puffer material for a container.
しかして、上記のようにして調製されたコンデンサー用
ディッピング材中にフィルムコンデンサーを含浸させて
ディッピング材をフィルムコンデンサーに被覆した後、
ディッピング材より取シ出して紫外線を照射し、ディッ
ピング材の表面を硬化させるものであシ、続いて加熱炉
内にこのディッピング材が被着されたフィルムコンデン
サーを入れて加熱硬化させるものである。このようにし
て不飽和ポリエステ／Ｉ／系樹脂、イソシアヌレート系
化合物、アクリレート系化合物及びビニル糸モノマーの
紫外線硬化型樹脂を配合することＫよシ、紫外線の照射
によって表面を瞬時に硬化させることができ、硬化時間
を短縮することができるものであり、例えば乃ンドリン
グ可能（使用可能）な時間を５〜２０秒とすることがで
きる。すなわち、下塗シ含浸用に５〜１０秒、上塗シ塗
布用に５〜１０秒とすることが可能となる。しかも、従
来のように樹脂がコンデンサーから垂れるということが
なく、いわゆるヘソができることがないものであムまた
、使用する樹脂としては、従来のアクリレート紫外ｆｉ
ｌｌ硬化型樹脂をポリエステル樹脂主体に変えることに
より、誘電特性及び耐湿性を向上することができ、特に
フィルムコンダンサ一本来の誘電特性が出せ、更にフィ
ルムとのヌレがよく、はじきが少なく、リード線付着が
少なくなるものである。After impregnating a film capacitor into the capacitor dipping material prepared as described above and coating the film capacitor with the dipping material,
The dipping material is removed from the dipping material and irradiated with ultraviolet rays to harden the surface of the dipping material.Then, the film capacitor coated with the dipping material is placed in a heating furnace and heated to harden. By blending the UV-curable resin of unsaturated polyester/I/based resin, isocyanurate compound, acrylate compound, and vinyl yarn monomer in this way, the surface can be instantly hardened by UV irradiation. It is possible to shorten the curing time, and for example, the time during which it can be undled (usable) can be set to 5 to 20 seconds. In other words, it is possible to take 5 to 10 seconds to impregnate the undercoat and 5 to 10 seconds to apply the topcoat. Moreover, the resin does not drip from the capacitor as in the past, and there is no so-called navel formation.In addition, the resin used is the conventional acrylate ultraviolet fi
By changing the curable resin to mainly polyester resin, it is possible to improve dielectric properties and moisture resistance, and in particular, it is possible to exhibit the original dielectric properties of film capacitors, and it also has good wetting with the film, less repellency, and lead resistance. This reduces line adhesion.
以下本発明を実施例に基づいて具体的に説明する。The present invention will be specifically described below based on examples.
実施例
イソ７りμ酸系ポリエステ／Ｉ／樽脂（日本触媒化学工
業株式会社製、品番Ｎ ３４０ Ｋ 、スチレンあ％）
１００部に対して、トリス（２アクリロキＶエチ／Ｌ
／）イソシアヌレート（日立化成工業株式会社製品番Ｆ
人７３１Ａ３４０部、トリブロモフェニルジエチレング
リコ−μメタアクリレート（大阪１ｍ化学工業株式会社
製、品番３８Ｍ）２０部、スチレンω部、ペンゾインエ
チμエーテル６部、ｔブチルバーオキシベシゾエート６
部を混合してコンダンサ−用ディッピング材ｔ−得た。Example Iso 7 Polyester polyester/I/barrel fat (manufactured by Nippon Shokubai Chemical Co., Ltd., product number N 340 K, styrene%)
For 100 parts of Tris (2 acrylic V ethi/L
/) Isocyanurate (Hitachi Chemical Co., Ltd. product number F
340 parts of human 731A, 20 parts of tribromophenyl diethylene glyco-μ methacrylate (manufactured by Osaka 1m Kagaku Kogyo Co., Ltd., product number 38M), ω part of styrene, 6 parts of penzoin ethyl μ ether, 6 parts of t-butyl baroxybecizoate
A dipping material T for a capacitor was obtained by mixing the two parts.
比較例
ビスフェノ−Ａ／Ａ型エポキンアクリレート（粘度２万
ＣｐＳ１５０°Ｃ） １００部に対して、フエ二〜 ジ
エチレングリコールメタアクリレート（ＡＭＰ６０Ｇ。Comparative Example: For 100 parts of bispheno-A/A type Epoquin acrylate (viscosity: 20,000 CpS, 150°C), Phenyl-diethylene glycol methacrylate (AMP60G) was added.
新中村化学ｇ）２ｓｏ部、ベンジルジメチルケタ−１ｖ
ｌＯ部、ｔ−ブチルパーオキシベンゾエート７．５部を
混合してコンデンサー用ディッピング材を得た。Shin Nakamura Chemical g) 2so part, benzyl dimethyl ket-1v
A dipping material for a capacitor was obtained by mixing 10 parts and 7.5 parts of t-butyl peroxybenzoate.
以上のコンデンサー用ディッピング材について、容ｆｎ
１ ｎＦ 、 １００ｎＦのポリプロピレンフィルム
コンテ゛ンサー及び１００ｎＦのポリエチレンテレフタ
レートフィルムコンテ゛ンサーを用いて含浸、硬化させ
て樹脂封止フィルムコンテ゛ンサーを得た。なお、含浸
、硬化条件は次の通りとする。Regarding the above dipping materials for capacitors,
A 1 nF, 100 nF polypropylene film container and a 100 nF polyethylene terephthalate film container were impregnated and cured to obtain a resin-sealed film container. The impregnation and curing conditions are as follows.
鳴浸条沖：真空変３） ｍｍＨｇ （ｔｏｒｒ ）の真
空 中で１分間浸漬させた。Naruikjooki: Vacuum change 3) It was immersed in a vacuum of mmHg (torr) for 1 minute.
硬化条Ｖ＋： ８０ Ｗ／ｃｍ高圧水銀灯を用い、ラン
プからの距離２０ ｃｌｌｌにて１０秒間紫外線を照射
した後、１１０’Ｃ硬化炉内で２時間加熱した。Curing strip V+: Using an 80 W/cm high pressure mercury lamp, the sample was irradiated with ultraviolet rays for 10 seconds at a distance of 20 clll from the lamp, and then heated in a 110'C curing furnace for 2 hours.
ソノ後、上記の樹脂封止フィルムコンデンサーの初期の
容量Ｃｏと、１酎湿試験後の容量Ｃを測定した。耐湿条
件はめ’Ｃ，９５％ＲＨ雰囲気下で１０００時間放置し
た。なお、測定はＹＨＰ ＬＣＲメータ １ＫＨｚで行
った。結果を第１表に示す。After sowing, the initial capacitance Co of the above resin-sealed film capacitor and the capacitance C after the 1-moisture test were measured. Moisture resistant conditions were met and left in a 95% RH atmosphere for 1000 hours. Note that the measurement was performed using a YHP LCR meter at 1 KHz. The results are shown in Table 1.
第１表の結果より、フンダンサ−容量の初期値及び容量
変化率ΔＣ／Ｃｏ％が実施例１．２のものは比較例のも
のに比べて著しく小さく、実施例のものは誘電特性及び
耐湿性が向上したことが確認される。From the results in Table 1, the initial value of the fundusor capacitance and the rate of change in capacitance ΔC/Co% of Example 1.2 are significantly smaller than those of the comparative example, and the dielectric properties and moisture resistance of the example are significantly smaller. It is confirmed that this has improved.
第 １ 表
〔発明の効果〕
上記のように本発明は、不飽和ポリエステＡ／系樹脂と
インシアヌレート系化合物とアクリレート系化合物とビ
ニμ系モノマーと光重合開始剤と熱重合開始剤とを配合
したので、紫外線の照射によシ表面を短時間で硬化させ
ることができて樹脂が垂れるのを防ぐことができ、従来
のようにヘソを削除するというような手間を省くことが
できるものであり、しかもポリエステ／Ｉ／樹脂を主成
分にすることでコンデンサーの誘電特性と耐湿性を向上
させ、更に加えてフィルムとのヌレを良くシ、はじきを
少なくすることができるものである。Table 1 [Effects of the Invention] As described above, the present invention combines an unsaturated polyester A/based resin, an incyanurate-based compound, an acrylate-based compound, a vinyl μ-based monomer, a photopolymerization initiator, and a thermal polymerization initiator. The combination allows the surface of the resin to be cured in a short time by irradiation with ultraviolet rays, preventing the resin from dripping, and eliminating the traditional hassle of removing the belly button. Moreover, by using polyester/I/resin as the main component, the dielectric properties and moisture resistance of the capacitor can be improved, and in addition, it can also improve wetting with the film and reduce repellency.
Claims (1)
化合物とアクリレート系化合物とビニル系モノマーと光
重合開始剤と熱重合開始剤とが配合されて成ることを特
徴とするコンデンサー用ディッピング材。(1) A dipping material for capacitors, which is characterized in that it is a blend of an unsaturated polyester resin, an isocyanurate compound, an acrylate compound, a vinyl monomer, a photopolymerization initiator, and a thermal polymerization initiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5202286A JPS62209163A (en) | 1986-03-10 | 1986-03-10 | Dipping material for capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5202286A JPS62209163A (en) | 1986-03-10 | 1986-03-10 | Dipping material for capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62209163A true JPS62209163A (en) | 1987-09-14 |
Family
ID=12903186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5202286A Pending JPS62209163A (en) | 1986-03-10 | 1986-03-10 | Dipping material for capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62209163A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5815534A (en) * | 1981-07-20 | 1983-01-28 | Hitachi Chem Co Ltd | Production of unsaturated polyester resin laminated sheet |
| JPS5845214A (en) * | 1981-09-12 | 1983-03-16 | Hitachi Chem Co Ltd | Resin composition for electrical insulation |
-
1986
- 1986-03-10 JP JP5202286A patent/JPS62209163A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5815534A (en) * | 1981-07-20 | 1983-01-28 | Hitachi Chem Co Ltd | Production of unsaturated polyester resin laminated sheet |
| JPS5845214A (en) * | 1981-09-12 | 1983-03-16 | Hitachi Chem Co Ltd | Resin composition for electrical insulation |
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