JPS62205604A - Method and jig for processing electronic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Object of the invention] (Industrial application field) The present invention relates to a processing method and a processing jig for electronic components,
For example, a method of forming a coating on multiple chip electronic components such as a cylindrical chip or a square chip resistor, and a process of forming a coating while holding the electronic components rotatably in order to carry out this processing method. It relates to a jig for performing this.

(Prior art) A conventional coating film forming method for chip electronic components such as chip resistors that do not have lead wires is disclosed in, for example, Japanese Patent Laid-Open No. 5
A conveying method described and prescribed in Japanese Patent No. 9-167407 is known. In this conventional method, support holes are formed in the belt at predetermined intervals in the conveying direction of the belt, and a rail is provided on the lower conveying surface of the belt. The electronic component that has been fitted into the support hole is supported with both ends on the rail by the support hole, and is conveyed while being rotated, and during this conveyance, the coating roller is brought into contact with the circumferential surface of the electronic component from between the rails. iFI+ on the surrounding surface of electronic components.
A configuration is adopted in which the coating is applied.

(Problems to be Solved by the Invention) In the conventional conveying method described above, it is difficult to reliably support chip electronic components in the support holes of the belt, and it is particularly difficult to support ultra-small components. Problems may occur during the transportation process, such as electronic components falling off while being transported by a belt, or electronic components becoming contaminated with paint that has fallen onto the rail.
In particular, it is not possible to perform various processes continuously, and electronic components must be transported between processes in packets, containers, etc. for each process, and cannot be supplied individually to each facility (if possible). First, they have problems of poor manageability, poor quality stability, and high costs.

Further, conventional conveying devices have the problem that, for example, in the case of chip resistors, they cannot cut the resistive film, measure the resistance value, or process the voltage.

The present invention was made in view of the above-mentioned problems, and the first invention is to hold a large number of electronic components in a jig in a cassette manner, and to coat the electronic components while holding the electronic components in the jig body. Various processes such as processing can be performed continuously,
Electronic component processing 11 that enables efficient processing of electronic components without the need to reinstall electronic components for each processing step
1 (provides a method).

In addition, the second invention is capable of rotatably holding a large number of electronic components in the jig main body, making it possible to reliably and easily perform processes such as coating film formation on the electronic components, and allowing the jig main body equipped with the electronic components to be subjected to various processes. An object of the present invention is to provide a jig for processing electronic components that can continuously perform various types of processing on electronic components without having to reinstall the electronic components in each processing step by installing the device in a process.

[Structure of the invention]

(Means for Solving the Problems) A method for processing electronic components according to the first invention includes a jig main body in which a plurality of electronic components are held in parallel, and a jig in which the plurality of electronic components are sandwiched. The main body of the jig is transported to, for example, an electronic component processing step for forming a coating film, and a plurality of electronic components are processed while being sandwiched between the main body of the jig 1.

A second invention electronic component processing jig has an electronic component processing opening formed in the jig body, rotatably supports a rotary shaft of W number in the jig body, and a jack portion at the tip of the rotary shaft. are arranged in parallel along one side of the processing opening, and a plurality of sliding rotation shafts are rotatably and slidably supported in the jig main body corresponding to each of the rotation shafts. , the tip chuck portions of the sliding rotation shafts are arranged in parallel along the other side of the processing opening, facing the jack portions of the respective rotation shafts 1111, and the N
The number of sliding rotating shafts is urged by a spring in the direction in which the tip chuck part advances toward the jack part of each of the rotating shafts, and this rotation +111 is applied to each of the rotating shafts and the sliding rotating shaft. It is characterized by the provision of rollers that rotate respectively with the sliding rotation shaft.

(Function) The method for processing electronic components of the first invention includes holding a plurality of electronic components sandwiched in parallel on a jig body, and forming a coating film on the jig body with the plurality of electronic components sandwiched therein. It is installed in a process transport or processing device and transported to an electronic parts processing process, where multiple electronic parts are processed while being sandwiched in this jig body, and the processing of this process is completed. At this stage, it is installed in the same transport or processing device or another transport or processing device to perform the next processing step.

A jig for processing electronic components according to a second aspect of the present invention is such that the electronic component is clamped between the tip chuck portions of the rotating shaft and the sliding rotary shaft of the jig main body by the biasing force of a spring, and the electronic component is held between the chuck portions. The electronic component is rotated by moving the electronic component while rotating the roller, and the rotated electronic component is subjected to processing such as coating I19.

(Example) The configuration of an embodiment of the present invention will be described with reference to the drawings.

1 is a jig body, and this jig body 1 is formed to be flat in width, and three openings 2 are formed parallel to one side edge along the conveyance direction of this jig body 1.
, 3.4 are formed. A plurality of rotating shafts 5 are rotatably supported in parallel in this jig main body 1, and each rotating shaft 5
The tip chuck portion 6 is disposed along one side edge of the processing opening 3 in the central portion. Further, each rotating shaft 5 is provided with a roller 7, and each roller 7 is provided on each rotating shaft 5 so as to face one of the openings 2.

In addition, a plurality of sliding rotary shafts 8 are supported in the jig main body 1 so as to rotate in parallel and slidably in the axial direction, facing the rotary shaft 5, and a tip chuck portion 9 of each sliding rotary shaft 8 is supported. are arranged along the other side edge of the processing opening 3, facing the chuck portion 6 of each rotating shaft 5. In addition, each sliding rotation shaft 8
A roller 10 is provided at G, and each roller 10 is provided on each sliding rotation shaft 8 so as to face one of the openings 4.

And each of these Ii! ! The bouyack portion 9 is biased toward the chuck portion 6 of each rotation shaft 5 via a ball 12 by a dynamic rotation shaft rotation shaft biasing means such as a coil spring 11.

Further, relief recesses 13 for the application roller 14 are cut out in the lower surface of the jig main body 1 from both end positions of the intermediate processing opening 3 to the end face of the jig main body 1. In addition, guide portions 18 are provided protruding from both lower surfaces of the jig main body 1.

Next, the operation of this embodiment will be explained.

For example, the 11 motion rotation 114h 8 of the jig body 1 is the roller 1.
0 in the axial direction against the spring 11, the chuck part 9 separates from the chuck part 6 of the rotating shaft 5, and the chuck part 6 of each rotating shaft 5 and the chuck part 9 of the sliding rotating shaft 8 are separated. When the electronic component is sandwiched between the two chirek parts 6.9 and the pressure on the sliding rotation shaft 8 is released, the spring 11 rotates PIJ&) 6, and clamp both ends of the electronic component with both chuck parts 6.9.

The jig main body 1 holding the electronic components in this manner is moved by a conveying device such as a belt (not shown). At this time, the jig main body 1 is guided and regulated by the guide bearing 16 to perform positioning. When the rollers 7.10 are rolled, for example, on a rail, the rotating shaft 5 and the sliding rotating shaft 8 rotate, and the electronic component held between the chuck parts 6, 9 is rotated and conveyed.

For example, in the case of cutting chip resistors,
After the resistors that have been subjected to initial resistance selection are rotatably held in the jig main body 1 and subjected to cutting processing, when the jig main body 1 is conveyed to the coating process, the escape recess 13 of the coating roller 14 is removed.
Then, the coating roller 14 comes into contact with the outer peripheral surface of the electronic component 15 which is being held and rotated by the chuck part 6.9, and the paint is applied to the outer peripheral surface of the electronic component 15, and then the jig main body 1 is exposed to the electron beam. Alternatively, pass the electronic components through a heating drying device such as a heat oven while rotating to stabilize the coating film, and if necessary, display the jig body 1 roughly if necessary. It is transported to a tearing process, where a marking is similarly formed with paint, and it is subsequently heated and dried. Next, the jig main body 1 is transferred to, for example, a voltage treatment step, a resistance value measurement step, etc., and a voltage is applied to the electronic components rotatably supported by the jig main body 1, and the resistance value of the electronic components is measured. Further, depending on the processing process, the jig main body 1 may be installed in another transport device or processing device to perform processing.

Note that the chuck portion 6J3 of the rotating shaft 5 and the sliding rotating shaft 8
The chuck portion 9 may have an appropriate structure such as a structure for abutting and holding an end of an electronic component or a structure for fitting and holding an end of an electronic component.

Furthermore, in the above embodiment, the configuration in which electronic components are rotatably held by the rotating shaft 5 and the sliding rotating shaft 8 has been described, but it is not always necessary to rotate the electronic components, and it is also possible to hold them. can.

〔Effect of the invention〕

According to the first invention, processing step C can be carried out by mounting a large number of electronic components on the jig main body in a fixed manner, and the electronic components can be mounted on the jig main body for the next process using a transfer device or the like. It is possible to process the electronic parts continuously by attaching them to other processing equipment, and there is no need to reinstall the electronic parts to the conveying device or processing equipment after each process, and the processing can be carried out continuously and efficiently.

According to the second invention, it is possible to rotatably hold a plurality of electronic components in the jig main body and rotate the electronic components during transportation of the jig main body, and there is no possibility that the electronic components will fall off during each processing process. This jig can be used to perform various processes, increase the processing speed of electronic parts, improve manageability, stabilize the quality, be obtained at low cost, and form a coating film using a particularly viscous paint. There is no fear of 19 loss when coating, and a uniform coating film can be formed.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway plan view of a jig for processing electronic components showing one embodiment of the present invention, FIG. 2 is a side view of the same, and FIG.
The figure is a front view of the touch part same as above. 1. Jig body, 3. Processing opening, 5. Rotating shaft, 6.
9... Chuck part, 7, 10... Roller, 8... Sliding rotation shaft, 11... Spring, 15... Electronic component. Introduction 2g

Claims (2)

[Claims] (1) Hold multiple electronic components in parallel on the jig body,
The electronic component is characterized in that the jig main body with the plurality of electronic components sandwiched therein is transported to an electronic component processing process, and the plurality of electronic components are processed while being sandwiched in the jig main body. Processing method. (2) a jig main body in which an electronic component processing opening is formed; a plurality of rotating shafts rotatably supported by the jig main body and having tip chuck portions disposed in parallel along one side of the processing opening;
On the other side of the processing opening, a chuck part is rotatably supported by the jig main body and slidably in the axial direction in correspondence with the rotating shaft, and is formed at the tip so as to face the chuck part of each of the rotating shafts. a plurality of sliding rotary shafts arranged in parallel along the jig body, and a tip chuck section biasing each of the sliding rotary shafts provided in the jig body in a direction in which each of the sliding rotary shafts advances toward the chuck section of each of the rotary shafts. A jig for processing electronic components, comprising a biasing means and rollers provided on each of the rotating shafts and the sliding rotating shaft.