JPS62204368U - - Google Patents

Info

Publication number

JPS62204368U

JPS62204368U JP9307386U JP9307386U JPS62204368U JP S62204368 U JPS62204368 U JP S62204368U JP 9307386 U JP9307386 U JP 9307386U JP 9307386 U JP9307386 U JP 9307386U JP S62204368 U JPS62204368 U JP S62204368U

Authority

JP

Japan

Prior art keywords

wiring board

multilayer wiring

map

conductive foil

connection map

Prior art date

1986-06-18

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011888 foil Substances 0.000 claims description 4
• 229910000679 solder Inorganic materials 0.000 claims 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 239000011889 copper foil Substances 0.000 description 2
• 239000004020 conductor Substances 0.000 description 1
• 239000000463 material Substances 0.000 description 1