JPS62204358U - - Google Patents
Info
- Publication number
- JPS62204358U JPS62204358U JP1986092563U JP9256386U JPS62204358U JP S62204358 U JPS62204358 U JP S62204358U JP 1986092563 U JP1986092563 U JP 1986092563U JP 9256386 U JP9256386 U JP 9256386U JP S62204358 U JPS62204358 U JP S62204358U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- package
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Details Of Television Systems (AREA)
Description
第１図乃至第４図は本考案固体撮像装置の一つ
の実施例を説明するためのもので、第１図は斜め
表側から見た斜視図、第２図は斜め裏側から見た
斜視図、第３図は第１図の３―３線に沿う断面図
、第４図は位置決めの仕方を説明するための斜視
図、第５図は本考案固体撮像装置の別の実施例の
斜め裏側から見た斜視図、第６図及び第７図は固
体撮像装置の従来例を示し、第６図は斜視図、第
７図は第６図の７―７線視断面図である。 符号の説明、１，１ａ……固体撮像装置、２…
…パツケージ、３……固体撮像素子収納凹部、４
……固体撮像素子、９，１４……有底位置合せ基
準部。
の実施例を説明するためのもので、第１図は斜め
表側から見た斜視図、第２図は斜め裏側から見た
斜視図、第３図は第１図の３―３線に沿う断面図
、第４図は位置決めの仕方を説明するための斜視
図、第５図は本考案固体撮像装置の別の実施例の
斜め裏側から見た斜視図、第６図及び第７図は固
体撮像装置の従来例を示し、第６図は斜視図、第
７図は第６図の７―７線視断面図である。 符号の説明、１，１ａ……固体撮像装置、２…
…パツケージ、３……固体撮像素子収納凹部、４
……固体撮像素子、９，１４……有底位置合せ基
準部。
Claims (1)
- 【実用新案登録請求の範囲】 パツケージの表面に形成された固体撮像素子収
納凹部内に固体撮像素子を収納した固体撮像装置
において、 上記パツケージの裏面に切欠ないしは穴からな
る有底の位置合せ基準部を形成してなる ことを特徴とする固体撮像装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986092563U JPS62204358U (ja) | 1986-06-18 | 1986-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986092563U JPS62204358U (ja) | 1986-06-18 | 1986-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62204358U true JPS62204358U (ja) | 1987-12-26 |
Family
ID=30954377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986092563U Pending JPS62204358U (ja) | 1986-06-18 | 1986-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62204358U (ja) |
-
1986
- 1986-06-18 JP JP1986092563U patent/JPS62204358U/ja active Pending