JPS62204341U - - Google Patents
Info
- Publication number
- JPS62204341U JPS62204341U JP9311286U JP9311286U JPS62204341U JP S62204341 U JPS62204341 U JP S62204341U JP 9311286 U JP9311286 U JP 9311286U JP 9311286 U JP9311286 U JP 9311286U JP S62204341 U JPS62204341 U JP S62204341U
- Authority
- JP
- Japan
- Prior art keywords
- piston
- cylinder
- semiconductor device
- casing
- head portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 5
- 239000012809 cooling fluid Substances 0.000 claims description 3
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Description
第１図は本考案による半導体装置の冷却装置の
基本原理を説明する断面図、第２図は本考案の実
施例を示す断面図と部分断面斜視図、第３図は従
来の半導体装置の冷却装置を示す断面図、第４図
は従来の半導体装置の冷却装置の全容を示す分解
斜視図、第５図は従来の半導体装置の冷却装置に
おける熱交換部の断面図である。
図において、１は配線基板、２は半導体装置、
３は冷却流体循環用のケーシング、８はピストン
、９はシリンダ、１０はヘツド部、１１は弾圧手
段（圧縮コイルバネ）、１４はシール手段（Ｏリ
ング）をそれぞれ示す。
Fig. 1 is a cross-sectional view explaining the basic principle of a cooling device for a semiconductor device according to the present invention, Fig. 2 is a cross-sectional view and a partial cross-sectional perspective view showing an embodiment of the present invention, and Fig. 3 is a conventional cooling device for a semiconductor device. FIG. 4 is an exploded perspective view showing the entire structure of a conventional cooling device for a semiconductor device, and FIG. 5 is a sectional view of a heat exchange section in the conventional cooling device for a semiconductor device. In the figure, 1 is a wiring board, 2 is a semiconductor device,
3 is a casing for circulating cooling fluid, 8 is a piston, 9 is a cylinder, 10 is a head portion, 11 is an elastic means (compression coil spring), and 14 is a sealing means (O ring).
Claims (1)
持用のシリンダ９を設け、シリンダ９中をケーシ
ング３中の冷却流体流路と連通したこと、 該シリンダ９中に、該シリンダから突出するヘ
ツド部１０を有するピストン８を挿入支持したこ
と、 該ピストン８のヘツド部１０を半導体装置２に
直接または間接に押圧する弾圧手段１１を該設け
、かつピストン８とシリンダ９との間をシールし
て成ること、を特徴とする半導体装置の冷却装置
。[Claims for Utility Model Registration] A cylinder 9 for supporting a piston is provided in the casing 3 for circulating cooling fluid, and the inside of the cylinder 9 is communicated with the cooling fluid passage in the casing 3. A piston 8 having a head portion 10 protruding from the cylinder is inserted and supported, a pressing means 11 for directly or indirectly pressing the head portion 10 of the piston 8 against the semiconductor device 2 is provided, and the piston 8 and the cylinder 9 are A cooling device for a semiconductor device, characterized in that the space is sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9311286U JPS62204341U (en) | 1986-06-18 | 1986-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9311286U JPS62204341U (en) | 1986-06-18 | 1986-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62204341U true JPS62204341U (en) | 1987-12-26 |
Family
ID=30955412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9311286U Pending JPS62204341U (en) | 1986-06-18 | 1986-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62204341U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014110426A (en) * | 2012-11-30 | 2014-06-12 | Ge Aviation Systems Llc | Phase change heat sink for transient thermal management |
-
1986
- 1986-06-18 JP JP9311286U patent/JPS62204341U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014110426A (en) * | 2012-11-30 | 2014-06-12 | Ge Aviation Systems Llc | Phase change heat sink for transient thermal management |
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