JPS62201944U - - Google Patents
Info
- Publication number
- JPS62201944U JPS62201944U JP9158586U JP9158586U JPS62201944U JP S62201944 U JPS62201944 U JP S62201944U JP 9158586 U JP9158586 U JP 9158586U JP 9158586 U JP9158586 U JP 9158586U JP S62201944 U JPS62201944 U JP S62201944U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- stack
- heat sink
- semiconductor stack
- sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 1
Description
第１図はこの考案の一実施例によるインバータ
用半導体スタツク、第２図は第１図のヒートシン
クの詳細図、第３図は従来のインバータ用半導体
スタツク、第４図は第３図のヒートシンクの詳細
図を示す。
１は半導体、２は絶縁座、３はヒートシンク、
４はスチールボール、５は皿バネ、６は締付用両
ネジボルト、７はナツト、８は鋼鉄製クランパ、
９は外部端子接続用ネジ穴、１０はヒートシンク
、１１は外部端子接続用穴を示す。尚、図中同一
符号は同一、又相当部分を示す。
Fig. 1 shows a semiconductor stack for an inverter according to an embodiment of the invention, Fig. 2 shows a detailed view of the heat sink shown in Fig. 1, Fig. 3 shows a conventional semiconductor stack for an inverter, and Fig. 4 shows the heat sink of Fig. 3. A detailed view is shown. 1 is a semiconductor, 2 is an insulator, 3 is a heat sink,
4 is a steel ball, 5 is a disc spring, 6 is a double screw bolt for tightening, 7 is a nut, 8 is a steel clamper,
Reference numeral 9 indicates a screw hole for connecting an external terminal, 10 indicates a heat sink, and 11 indicates a hole for connecting an external terminal. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
体冷却用シートシンクとをスタツク状に組込んだ
半導体スタツクにおいて、上記ヒートシンクの放
熱用フインが上記半導体の軸心方向に延在するよ
うに設けたことを特徴とする半導体スタツク。 (2) ヒートシンクは円筒形でその円周上を歯車
形のフインを設けたことを特徴とする実用新案登
録請求の範囲第１項記載の半導体スタツク。[Claims for Utility Model Registration] (1) In a semiconductor stack in which a flat package type semiconductor and this semiconductor cooling sheet sink are assembled in a stack, the heat dissipation fins of the heat sink are arranged in the axial direction of the semiconductor. A semiconductor stack characterized in that it is provided in an extending manner. (2) The semiconductor stack according to claim 1, wherein the heat sink is cylindrical and has gear-shaped fins on its circumference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9158586U JPS62201944U (en) | 1986-06-16 | 1986-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9158586U JPS62201944U (en) | 1986-06-16 | 1986-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62201944U true JPS62201944U (en) | 1987-12-23 |
Family
ID=30952506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9158586U Pending JPS62201944U (en) | 1986-06-16 | 1986-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62201944U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5130468B1 (en) * | 1966-10-11 | 1976-09-01 |
-
1986
- 1986-06-16 JP JP9158586U patent/JPS62201944U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5130468B1 (en) * | 1966-10-11 | 1976-09-01 |
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