JPS62198265U - - Google Patents
Info
- Publication number
- JPS62198265U JPS62198265U JP8792986U JP8792986U JPS62198265U JP S62198265 U JPS62198265 U JP S62198265U JP 8792986 U JP8792986 U JP 8792986U JP 8792986 U JP8792986 U JP 8792986U JP S62198265 U JPS62198265 U JP S62198265U
- Authority
- JP
- Japan
- Prior art keywords
- cryopump
- vacuum
- heat shield
- shield plate
- work chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007738 vacuum evaporation Methods 0.000 claims 2
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8792986U JPS62198265U (enExample) | 1986-06-10 | 1986-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8792986U JPS62198265U (enExample) | 1986-06-10 | 1986-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62198265U true JPS62198265U (enExample) | 1987-12-17 |
Family
ID=30945588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8792986U Pending JPS62198265U (enExample) | 1986-06-10 | 1986-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62198265U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02284725A (ja) * | 1989-04-25 | 1990-11-22 | Tdk Corp | 金型の表面処理方法及び装置 |
| JP2002015998A (ja) * | 2000-02-24 | 2002-01-18 | Applied Materials Inc | 半導体ウェーハ処理チャンバーから装置をシールドするための方法及び装置 |
-
1986
- 1986-06-10 JP JP8792986U patent/JPS62198265U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02284725A (ja) * | 1989-04-25 | 1990-11-22 | Tdk Corp | 金型の表面処理方法及び装置 |
| JP2002015998A (ja) * | 2000-02-24 | 2002-01-18 | Applied Materials Inc | 半導体ウェーハ処理チャンバーから装置をシールドするための方法及び装置 |