JPS62197862U

JPS62197862U -

Info

Publication number: JPS62197862U
Application number: JP8487887U
Authority: JP
Priority date: 1987-05-29
Filing date: 1987-05-29
Publication date: 1987-12-16
Also published as: JPH0319228Y2

Description

[Brief explanation of the drawing]

図面はこの考案の実施例を示すもので、第１図
は本考案品の部分切欠き正面図、第２図は同側面
図、第３図は第１図―線に沿う断面図、第４
図は第１図―線に沿う断面図、第５図は第１
図―線に沿う拡大断面図、第６図は分解斜視
図である。１……半導体素子冷却装置、２……タンク部、
３……放熱部、４……冷媒、６……プレート、７
……連結壁、８……下側孔、９……上側孔、１０
……空気溜め部、１１……内部フイン、１４……
下部リング、１５……上部リング、１９……放熱
フイン、２９……通風間隙部、３０……半導体素
子、４０……ガス状冷媒凝縮部。 The drawings show an embodiment of the invention, in which Fig. 1 is a partially cutaway front view of the product of the invention, Fig. 2 is a side view of the same, Fig. 3 is a sectional view taken along the line of Fig. 1, and Fig. 4 is a cross-sectional view taken along the line of Fig. 1.
The figure is a sectional view along the line of Figure 1, and Figure 5 is a cross-sectional view along the line of Figure 1.
FIG. 6 is an enlarged sectional view taken along the line, and FIG. 6 is an exploded perspective view. 1... Semiconductor element cooling device, 2... Tank section,
3... Heat dissipation section, 4... Refrigerant, 6... Plate, 7
... Connection wall, 8 ... Lower hole, 9 ... Upper hole, 10
...Air reservoir section, 11...Internal fin, 14...
Lower ring, 15... Upper ring, 19... Heat radiation fin, 29... Ventilation gap, 30... Semiconductor element, 40... Gaseous refrigerant condensing part.

Claims

[Scope of utility model registration request]

At least three holes having holes 8 and 9 at the lower end and the upper end, respectively, and arranged at a predetermined interval from each other.
two vertically long plates 6 and an adjacent plate 6,
an annular connecting wall 7 disposed between peripheral edges of the plates 6 and 6; and an internal fin 1 disposed within the annular connecting wall 7 so as to correspond to the intermediate portion of the plates 6, 6.
1, a pair of upper and lower rings 14, 15 disposed between adjacent plates 6, 6 so as to surround the lower hole 8 and the upper hole 9, respectively; both rings 14,
15, and all the above members are joined in a superposed state to the lower hole 8 of each plate 6, the lower end of the annular connecting wall 7, and the lower ring 14. Thus, a tank section 2 is formed in which the liquid refrigerant 4 and the semiconductor element 30 are stored, and an air reservoir section 10 is formed by the upper hole 9 of each plate 6, the upper end of the annular connecting wall 7, and the upper ring 15. At the same time, a gaseous refrigerant condensing section 40 is provided between the tank section 2 and the air reservoir section 10, and is connected to both the tank section 2 and the air reservoir section 10 and has an internal fin 11 housed therein.
Ventilation gap 2 in which heat dissipation fins 19 are present
9. A semiconductor device cooling device in which a heat dissipating section 3 is formed.