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Filing date
Publication date
Application filedfiledCritical
Priority to JP11134085UpriorityCriticalpatent/JPH0636595Y2/ja
Publication of JPS6219756UpublicationCriticalpatent/JPS6219756U/ja
Application grantedgrantedCritical
Publication of JPH0636595Y2publicationCriticalpatent/JPH0636595Y2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/02—Bonding areas; Manufacturing methods related thereto
H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
