JPS62196391U - - Google Patents

Info

Publication number
JPS62196391U
JPS62196391U JP8250586U JP8250586U JPS62196391U JP S62196391 U JPS62196391 U JP S62196391U JP 8250586 U JP8250586 U JP 8250586U JP 8250586 U JP8250586 U JP 8250586U JP S62196391 U JPS62196391 U JP S62196391U
Authority
JP
Japan
Prior art keywords
generating element
heat generating
wiring board
printed wiring
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8250586U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8250586U priority Critical patent/JPS62196391U/ja
Publication of JPS62196391U publication Critical patent/JPS62196391U/ja
Pending legal-status Critical Current

Links

JP8250586U 1986-06-02 1986-06-02 Pending JPS62196391U (US06623731-20030923-C00012.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8250586U JPS62196391U (US06623731-20030923-C00012.png) 1986-06-02 1986-06-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8250586U JPS62196391U (US06623731-20030923-C00012.png) 1986-06-02 1986-06-02

Publications (1)

Publication Number Publication Date
JPS62196391U true JPS62196391U (US06623731-20030923-C00012.png) 1987-12-14

Family

ID=30935226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8250586U Pending JPS62196391U (US06623731-20030923-C00012.png) 1986-06-02 1986-06-02

Country Status (1)

Country Link
JP (1) JPS62196391U (US06623731-20030923-C00012.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992002117A1 (en) * 1990-07-26 1992-02-06 Fujitsu Limited Heat dissipating structure of semiconductor device
JP2014013873A (ja) * 2012-07-04 2014-01-23 Hyundai Motor Company Co Ltd ジャンクションボックス用印刷回路基板の熱放出装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992002117A1 (en) * 1990-07-26 1992-02-06 Fujitsu Limited Heat dissipating structure of semiconductor device
GB2252451A (en) * 1990-07-26 1992-08-05 Fujitsu Ltd Heat dissipating structure of semiconductor device
US5262922A (en) * 1990-07-26 1993-11-16 Fujitsu, Limited Heat radiation structure for semiconductor device
GB2252451B (en) * 1990-07-26 1995-01-04 Fujitsu Ltd Heat radiation structure for semiconductor device
JP2014013873A (ja) * 2012-07-04 2014-01-23 Hyundai Motor Company Co Ltd ジャンクションボックス用印刷回路基板の熱放出装置

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