JPS62196348U - - Google Patents

Info

Publication number
JPS62196348U
JPS62196348U JP8478586U JP8478586U JPS62196348U JP S62196348 U JPS62196348 U JP S62196348U JP 8478586 U JP8478586 U JP 8478586U JP 8478586 U JP8478586 U JP 8478586U JP S62196348 U JPS62196348 U JP S62196348U
Authority
JP
Japan
Prior art keywords
stem
lead
metal
nickel
header
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8478586U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8478586U priority Critical patent/JPS62196348U/ja
Publication of JPS62196348U publication Critical patent/JPS62196348U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP8478586U 1986-06-05 1986-06-05 Pending JPS62196348U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8478586U JPS62196348U (enrdf_load_stackoverflow) 1986-06-05 1986-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8478586U JPS62196348U (enrdf_load_stackoverflow) 1986-06-05 1986-06-05

Publications (1)

Publication Number Publication Date
JPS62196348U true JPS62196348U (enrdf_load_stackoverflow) 1987-12-14

Family

ID=30939596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8478586U Pending JPS62196348U (enrdf_load_stackoverflow) 1986-06-05 1986-06-05

Country Status (1)

Country Link
JP (1) JPS62196348U (enrdf_load_stackoverflow)

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