JPS62193120A - Exposure system - Google Patents

Exposure system

Info

Publication number
JPS62193120A
JPS62193120A JP61032958A JP3295886A JPS62193120A JP S62193120 A JPS62193120 A JP S62193120A JP 61032958 A JP61032958 A JP 61032958A JP 3295886 A JP3295886 A JP 3295886A JP S62193120 A JPS62193120 A JP S62193120A
Authority
JP
Japan
Prior art keywords
light
exposed
original plate
transferred
original
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61032958A
Other languages
Japanese (ja)
Inventor
Noboru Moriuchi
森内 昇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP61032958A priority Critical patent/JPS62193120A/en
Publication of JPS62193120A publication Critical patent/JPS62193120A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems

Abstract

PURPOSE:To improve resolution and productivity, by providing a light transmitting body, which is displaced in the direction intersecting a light path, and has a rough surface between a light source and an original plate. CONSTITUTION:A light transmitting body 6, which has a rough surface 6a, is linearly displaced and reciprocated in the direction intersecting a light path of light 4 by a driving mechanism. The light transmitting body 6 is provided between a light source 3 and an original plate 5. Therefore, spatial interference of the light 4 of such as laser having relatively short wavelength e.g., is decreased. Occurrence of interference fringe due to excessively good spatial interference and the resultant unclear profile of a figure, which is transferred on a material 1 to be exposed from the original plate 5, is avoided. The figure on the original plate 5 is transferred to the material 1 to be exposed by the light 4. Thus the exposing time is shortened, and the resolution of the figure, which is transferred from the original plate to the material to be exposed, can be improved without impairing productivity.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、露光技術、特に、」を導体装置の製造におけ
るウェハの露光技術に適用して有効な技術に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an exposure technique, and particularly to a technique that is effective when applied to a wafer exposure technique in the manufacture of conductor devices.

[従来の技術] 半導体装置の製造におけるウェハの露光技術については
、株式会社工業調査会、昭和56年11月10日発行、
[電子材料41981年11月号別冊、P103〜P1
09、記載されている。
[Prior art] Regarding wafer exposure technology in the manufacture of semiconductor devices, see Kogyo Kenkyukai Co., Ltd., published November 10, 1980,
[Electronic materials 4 November 1981 issue special issue, P103-P1
09, is described.

ところで、本発明者は、ウェハの光露光技術について検
討した。以下は、公知とされた技術ではないが本発明者
によって検討された技術であり、その概要は次のとおり
である。
By the way, the present inventor studied wafer light exposure technology. The following is a technology considered by the present inventor, although it is not a publicly known technology, and its outline is as follows.

すなわち、ウェハの露光に比較的波長の短いレーザを用
いることにより、フォトマスクなどの原版からウェハに
転写される図形の解像度の向上と、ウェハに照射される
光の照度の増加による単位時間当たりのウェハの露光処
理数量を増加とを両立させるものである。
In other words, by using a laser with a relatively short wavelength to expose the wafer, the resolution of the figure transferred from the original plate such as a photomask to the wafer can be improved, and the illuminance of the light irradiated onto the wafer can be increased, thereby reducing the amount of light per unit time. This allows for an increase in the number of wafers to be exposed.

[発明が解決しようとする問題点] しかしながら、レーザを用いてウェハの露光処理を行う
場合においては、レーザ本来の特性である空間的可干渉
性の良さなどに起因して、フォトマスクなどに設けられ
た遮光部と透光部の境界付近に干渉縞などが発生されや
すく、ウェハに転写される図形の輪郭が不鮮明となって
解像度が低下されるという欠点がある。
[Problems to be Solved by the Invention] However, when exposing a wafer using a laser, due to the good spatial coherence, which is an inherent characteristic of the laser, it is difficult to install a laser on a photomask etc. There is a drawback that interference fringes are likely to occur near the boundary between the light-shielding part and the light-transmitting part, and the outline of the figure transferred to the wafer becomes unclear and the resolution is reduced.

本発明の目的は、原版から被露光物に転写される図形の
解像度および生産性を向上させることが可能な露光技術
を提供することにある。
An object of the present invention is to provide an exposure technique that can improve the resolution and productivity of figures transferred from an original to an exposed object.

本発明の前記ならびにそのほかの目的と新規な特徴は、
本明細書の記述および添付図面から明らかになるであろ
う。
The above and other objects and novel features of the present invention include:
It will become clear from the description herein and the accompanying drawings.

[問題点を解決するための手段] 本願において開示される発明のうち代表的なものの4Q
要を簡華に説明すれば、次の通りである。
[Means for solving the problem] 4Q of typical inventions disclosed in this application
A brief explanation of the main points is as follows.

すなわち、光源と原版との間に、光路に交差する方向に
変位され、粗面を有する透光体を介設さセるものである
That is, a light-transmitting body having a rough surface and displaced in a direction intersecting the optical path is interposed between the light source and the original.

[作  用] 上記した手段によれば、たとえば光源から放射される光
が比較的波長の短いレーザなどの場合、該レーザが、光
路に交差する方向に変位され、粗面を有する透光体を透
過する際に位相などが不揃いとなって空間的可干渉性が
低下され、レーザによって原版から被露光物に転写され
る図形の輪郭などが鮮明となるとともに、照度の比較的
大きなレーザによって露光処理を行うことにより露光時
間が短縮でき、原版から被露光物に転写される図形の解
像度および生産性を向上させることができる。
[Function] According to the above-mentioned means, for example, when the light emitted from the light source is a laser with a relatively short wavelength, the laser is displaced in a direction intersecting the optical path, and the light transmitting body having a rough surface is displaced. During the transmission, the phase etc. become uneven and the spatial coherence is reduced, and the outline of the figure transferred from the original plate to the object to be exposed becomes clearer, and the exposure process is performed using a laser with relatively high illuminance. By doing so, the exposure time can be shortened, and the resolution and productivity of figures transferred from the original plate to the object to be exposed can be improved.

[実施例I] 第1図は、本発明の一実施例である露光装置の要部を示
す説明図である。
[Embodiment I] FIG. 1 is an explanatory diagram showing the main parts of an exposure apparatus that is an embodiment of the present invention.

たとえば、ウェハなどの被露光物lが載置される載置台
2の上方には、光源3が位置され、比較的波長の短いレ
ーザなどの光4が被露光物1の平面に照射されるように
構成されている。
For example, a light source 3 is positioned above a mounting table 2 on which an object l to be exposed such as a wafer is placed, and a light source 3 such as a laser having a relatively short wavelength is irradiated onto the flat surface of the object 1 to be exposed. It is composed of

また、光rA3と被露光’Itとの間には、ガラスなど
の透明な基板5aに、クロム(Cr)などの遮光部5b
を所定の図形に被着して構成される原版5が設けられて
いる。
Further, between the light rA3 and the exposed 'It, a transparent substrate 5a such as glass is provided with a light shielding portion 5b made of chromium (Cr) or the like.
An original plate 5 is provided, which is made up of a predetermined figure.

そして、光源3から原版5を介して被露光物1に光4を
照射することにより、原版5の図形が被露光物1に転写
されるものである。
By irradiating the object 1 with light 4 from the light source 3 via the original 5, the figure on the original 5 is transferred onto the object 1.

この場合、光源3と原版5との間には、所定の駆動機構
(図示せず)によって、光4の光路に交差する方向に直
線的に往復変位されるとともに、ネ■面6aを有する透
光体6が介設されており、光4は、該光4の光路に交差
する方向に直線的に往復変位され粗面6aを存する透光
体6を透過することによって、空間的な可干渉性などが
低下され、その後、原版5を経て被露光物lの表面に到
達される構造とされている。
In this case, between the light source 3 and the original 5, there is provided a transparent material having a neck surface 6a, which is linearly reciprocated in a direction intersecting the optical path of the light 4 by a predetermined drive mechanism (not shown). A light body 6 is interposed, and the light 4 is linearly reciprocated in a direction intersecting the optical path of the light 4 and transmitted through the light transmitting body 6 having a rough surface 6a, thereby creating spatial coherent interference. After that, the light reaches the surface of the object 1 to be exposed via the original 5.

以下、本実施例の作用について説明する。The operation of this embodiment will be explained below.

始めに、1&置台2の上には、露光処理すべき被露光物
1が位置されとともに、粗面6aを有する透光体6は、
所定の駆動機構(図示セず)によって光4の光路に交差
する方向に往復変位されている。
First, the object to be exposed 1 to be exposed is placed on the mounting table 2, and the transparent body 6 having the rough surface 6a is
It is reciprocated in a direction intersecting the optical path of the light 4 by a predetermined drive mechanism (not shown).

次に、光源3からは、たとえば比較的波長の短いレーザ
などの光4が放射され、該光4の光路に交差する方向に
往復変位され粗面6aを有する透光体6をi!ii遇す
ることによって空間的可干渉性などが低下された状態で
原版5を経て被露光物1の表面に照射され、光4の空間
的可干渉性の影ツなどを受けることなく原版5の図形が
被露光物1に良好な解像度で鮮明に転写される。
Next, light 4 such as a laser having a relatively short wavelength is emitted from the light source 3, and the light 4 is reciprocated in a direction intersecting the optical path of the light 4, and the transparent body 6 having the rough surface 6a is exposed to i! ii, the surface of the object 1 to be exposed is irradiated through the original plate 5 with its spatial coherence reduced by the light 4, and the light 4 is illuminated on the surface of the original plate 5 without being affected by the spatial coherence of the light 4. The figure is clearly transferred to the exposed object 1 with good resolution.

このように本実施例によれば以下の効果を得ることがで
きる。
As described above, according to this embodiment, the following effects can be obtained.

(l)、光源3と原版5との間に、該光源3から放射さ
れる光4の光路に交差する方向に往復変位され、粗面6
aを有する透光体6が介設されているため、たとえば比
較的波長の短いレーザなどの光4の空間的可干渉性が低
減され、該空間的可干渉性が過度に良好であることに起
因する干渉縞の発生などによって、原版5から被露光物
1に転写される図形の輪郭などが不鮮明となることなど
が回避され、光4によって原版5から被露光物1に転写
される図形の解像度が向上される。
(l), between the light source 3 and the original 5, the rough surface 6 is reciprocally displaced in a direction intersecting the optical path of the light 4 emitted from the light source 3;
Since the transparent body 6 having a wavelength a is provided, the spatial coherence of the light 4 such as a laser having a relatively short wavelength is reduced, and the spatial coherence is excessively good. The outline of the figure transferred from the original 5 to the object 1 to be exposed becomes unclear due to the occurrence of interference fringes caused by the light 4, and the outline of the figure transferred from the original 5 to the object 1 to be exposed by the light 4 is prevented from becoming unclear. Resolution is improved.

(2)、前記(1)の結果、光4として波長が比較的短
く照度の比較的大きなレーザを使用することが可能とな
り、一つの被露光物1の露光処理に要する時間を短縮で
き、単位時間当たりに露光処理される被露光物lの数量
を増加させることが可能なり、原版5から被露光物1に
転写される図形の解像度および生産性を向上させること
ができる。
(2) As a result of (1) above, it becomes possible to use a laser with a relatively short wavelength and relatively high illuminance as the light 4, and the time required for exposure processing of one object 1 to be exposed can be shortened. It is possible to increase the number of objects 1 to be exposed per hour, and it is possible to improve the resolution and productivity of figures transferred from the original 5 to the object 1 to be exposed.

[実施例2] 第2図は、本発明の他の実施例である露光装置の要部を
示す説明図である。
[Embodiment 2] FIG. 2 is an explanatory diagram showing the main parts of an exposure apparatus that is another embodiment of the present invention.

本実施例2においては、粗面7aを有する透光体7の光
4の光路に交差する方向の変位が、モータ8による回転
運動によって実現されているところが前記実施例1の場
合と異なるものである。
The second embodiment is different from the first embodiment in that the displacement of the transparent body 7 having the rough surface 7a in the direction intersecting the optical path of the light 4 is achieved by rotational movement by the motor 8. be.

このように本実施例2においては以下の効果を得ること
ができる。
As described above, in the second embodiment, the following effects can be obtained.

(1)、光源3と原版5との間に、該光源3から放射さ
れる光4の光路に交差する方向にモータ8によって回転
変位され、粗面7aを有する透光体7が介設されている
ため、たとえば比較的波長の短いレーザなどの光4の空
間的可干渉性が低減され、該空間的可干渉性が過度に良
好であることに起因する干渉縞の発生などによって、原
版5から被露光物lに転写される図形の輪郭などが不鮮
明となることなどが回避され、光4によって原版5から
被露光物lに転写される図形の解像度が向上される。
(1) A transparent body 7 having a rough surface 7a is disposed between the light source 3 and the original 5 and is rotationally displaced by a motor 8 in a direction intersecting the optical path of the light 4 emitted from the light source 3. As a result, the spatial coherence of the light 4 e.g. from a laser with a relatively short wavelength is reduced, and interference fringes due to the excessively good spatial coherence may cause the original 5 to This prevents the outline of the figure transferred from the master plate 5 to the object l to be exposed to become unclear, and the resolution of the figure transferred from the original plate 5 to the object l to be exposed is improved by the light 4.

(2)、前記(11の結果、光4として波長が比較的短
く照度の比較的大きなレーザを使用することが可能とな
り、一つの被露光物1の露光処理に要する時間を短縮で
き、単位時間当たりに露光処理される被露光物lの数量
を増加させることが可能なり、原版5から被露光物1に
転写される図形の解像度および生産性を向上させること
ができる。
(2) As a result of (11) above, it becomes possible to use a laser with a relatively short wavelength and relatively high illuminance as the light 4, and the time required for exposure processing of one exposed object 1 can be shortened, and the unit time It is possible to increase the number of objects 1 to be exposed per exposure process, and it is possible to improve the resolution and productivity of figures transferred from the original plate 5 to the object 1 to be exposed.

以上本発明者によってなされた発明を実施例に基づき具
体的に説明したが、本発明は前記実施例に限定されるも
のではなく、その要旨を逸脱しない範囲で種々変更可能
であることはいうまでもない。
Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

以上の説明では主として本発明者によってなされた発明
をその背景となった利用分野である半導体装置の製造に
おけるウェハの露光技術に適用した場合について説明し
たが、それに限定されるものではなく、原版5の図形を
被露光物1に精度良く転写することが必要とされる技術
などに広く適用できる。
In the above explanation, the invention made by the present inventor was mainly applied to the wafer exposure technology in the manufacturing of semiconductor devices, which is the background field of application, but the invention is not limited to this. The present invention can be widely applied to techniques that require highly accurate transfer of the figure onto the object 1 to be exposed.

[発明の効果] 本願において開示される発明のうち代表的なものによっ
て得られる効果を簡単に説明すれば、下記の通りである
[Effects of the Invention] The effects obtained by typical inventions disclosed in this application are briefly described below.

すなわち、光源から被露光物に到る光路に、透明な基板
に所定の図形に遮光部が形成された原版を介在させるこ
とによって、該原版の図形を被露光物に転写する露光装
置で、I盲記光源と前記原版との間に、前記光路に交差
する方向に変位され、粗面を有する透光体が介設されて
いることにより、たとえば光源から放射される光が比較
的波長の短いレーザなどの場合、該レーザが、光路に交
差する方向に変位され、粗面を存する透光体を透過する
際に位相が不揃いとなって空間的可干渉性が低下され、
レーザによって原版から被露光物に転写される図形の輪
郭などが鮮明となるとともに、照度の比較的大きなレー
ザによって露光処理を行うことにより露光時間が短縮で
き、生産性を損なうことなく原版から被露光物に転写さ
れる図形の解像度を向上させることができる。
That is, an exposure apparatus that transfers the figure of the original to the object to be exposed by interposing an original in which a light-shielding part is formed in a predetermined shape on a transparent substrate in the optical path from the light source to the object to be exposed. By disposing a transparent body having a rough surface and being displaced in a direction intersecting the optical path between the blind light source and the original, for example, the light emitted from the light source has a relatively short wavelength. In the case of a laser, the laser is displaced in a direction that intersects the optical path, and when it passes through a transparent material with a rough surface, the phase becomes uneven and the spatial coherence is reduced,
The outline of the figure transferred from the original plate to the exposed object becomes clearer with the laser, and the exposure time can be shortened by performing the exposure process using a laser with relatively high illuminance, making it possible to transfer the image from the original plate to the exposed object without sacrificing productivity. The resolution of figures transferred to objects can be improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本発明の一実施例である露光装置の要部を示
す説明図、 第2図は、本発明の他の実施例である露光装置の要部を
示す説明図である。 l・・・被露光物、2・・・載置台、3・・・光源、4
・・・光、5a・・・基板、5b・・・遮光部、5・・
・原版、6a、7a・・・ネ■面、6.7・・・透光体
、8・・・モータ。
FIG. 1 is an explanatory diagram showing the main parts of an exposure apparatus which is one embodiment of the present invention, and FIG. 2 is an explanatory diagram showing the main parts of an exposure apparatus which is another embodiment of the invention. l... Object to be exposed, 2... Mounting table, 3... Light source, 4
...light, 5a...substrate, 5b...light shielding part, 5...
・Original plate, 6a, 7a... Neon surface, 6.7... Translucent body, 8... Motor.

Claims (1)

【特許請求の範囲】 1、光源から被露光物に到る光路に、透明な基板に所定
の図形に遮光部が形成された原版を介在させることによ
って、該原版の図形を被露光物に転写する露光装置であ
って、前記光源と前記原版との間に、前記光路に交差す
る方向に変位され、粗面を有する透光体が介設されてい
ることを特徴とする露光装置。 2、前記光源から放射される光がレーザであることを特
徴とする特許請求の範囲第1項記載の露光装置。 3、前記被露光物がウェハであることを特徴とする特許
請求の範囲第1項記載の露光装置。
[Claims] 1. By interposing an original in which a light-shielding portion is formed in a predetermined shape on a transparent substrate in the optical path from the light source to the object to be exposed, the figure of the original is transferred to the object to be exposed. What is claimed is: 1. An exposure apparatus characterized in that a light-transmitting body having a rough surface is disposed between the light source and the original plate and is displaced in a direction intersecting the optical path. 2. The exposure apparatus according to claim 1, wherein the light emitted from the light source is a laser. 3. The exposure apparatus according to claim 1, wherein the object to be exposed is a wafer.
JP61032958A 1986-02-19 1986-02-19 Exposure system Pending JPS62193120A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61032958A JPS62193120A (en) 1986-02-19 1986-02-19 Exposure system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61032958A JPS62193120A (en) 1986-02-19 1986-02-19 Exposure system

Publications (1)

Publication Number Publication Date
JPS62193120A true JPS62193120A (en) 1987-08-25

Family

ID=12373431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61032958A Pending JPS62193120A (en) 1986-02-19 1986-02-19 Exposure system

Country Status (1)

Country Link
JP (1) JPS62193120A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1172905A (en) * 1997-06-27 1999-03-16 Toshiba Corp Photomask repair method, inspection method, inspection apparatus and photomask production
WO2007100144A1 (en) * 2006-02-28 2007-09-07 Canon Kabushiki Kaisha Measurement apparatus, exposure apparatus having the same, and device manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1172905A (en) * 1997-06-27 1999-03-16 Toshiba Corp Photomask repair method, inspection method, inspection apparatus and photomask production
WO2007100144A1 (en) * 2006-02-28 2007-09-07 Canon Kabushiki Kaisha Measurement apparatus, exposure apparatus having the same, and device manufacturing method
US7952726B2 (en) 2006-02-28 2011-05-31 Canon Kabushiki Kaisha Measurement apparatus, exposure apparatus having the same, and device manufacturing method

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