JPS62190669U - - Google Patents
Info
- Publication number
- JPS62190669U JPS62190669U JP7876686U JP7876686U JPS62190669U JP S62190669 U JPS62190669 U JP S62190669U JP 7876686 U JP7876686 U JP 7876686U JP 7876686 U JP7876686 U JP 7876686U JP S62190669 U JPS62190669 U JP S62190669U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- adhesive
- air circulation
- circulation space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 4
- 230000001070 adhesive effect Effects 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す構成図、第２
図は制御内容を示すフローチヤート、第３図はプ
リント配線基板への電子部品を実装する工程を順
を追つて示す図である。
１０……ヘツド、１１……カートリツジ、１２
……筐体、１３……空気流通空間、１４……冷却
空気の導入パイプ、１５……電磁弁、１６……温
度センサ、１７……制御回路。
Fig. 1 is a configuration diagram showing one embodiment of the present invention;
The figure is a flowchart showing the control contents, and FIG. 3 is a diagram showing the step-by-step process of mounting electronic components on a printed wiring board. 10...Head, 11...Cartridge, 12
... Housing, 13 ... Air circulation space, 14 ... Cooling air introduction pipe, 15 ... Solenoid valve, 16 ... Temperature sensor, 17 ... Control circuit.
Claims (1)
接着剤のカートリツジを内包し、プリント配線基
板上の電子部品仮止め位置に接着剤を塗布するプ
リント配線基板への接着剤塗布装置において、前
記ヘツドの外周を筐体で囲んで空気流通空間を形
成し、この空気流通空間に冷却空気の導入パイプ
を接続し、この導入パイプの途中に電磁弁を設け
、さらに、前記空気流通空間内の温度を検出する
温度センサと、この温度センサからの信号に基づ
いて前記電磁弁を開閉する制御回路とを設けたこ
とを特徴とするプリント配線基板への接着剤塗布
装置。 In an adhesive application device for a printed wiring board, in which an adhesive cartridge is contained in a head that moves relative to the printed wiring board, and the adhesive is applied to the temporary fixing position of electronic components on the printed wiring board, the outer periphery of the head is An air circulation space is formed by surrounding it with a casing, a cooling air introduction pipe is connected to this air circulation space, a solenoid valve is provided in the middle of this introduction pipe, and the temperature inside the air circulation space is detected. 1. A device for applying adhesive to a printed wiring board, comprising: a sensor; and a control circuit that opens and closes the solenoid valve based on a signal from the temperature sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7876686U JPS62190669U (en) | 1986-05-27 | 1986-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7876686U JPS62190669U (en) | 1986-05-27 | 1986-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62190669U true JPS62190669U (en) | 1987-12-04 |
Family
ID=30928005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7876686U Pending JPS62190669U (en) | 1986-05-27 | 1986-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62190669U (en) |
-
1986
- 1986-05-27 JP JP7876686U patent/JPS62190669U/ja active Pending
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