JPS62190342U - - Google Patents

Info

Publication number
JPS62190342U
JPS62190342U JP1986078042U JP7804286U JPS62190342U JP S62190342 U JPS62190342 U JP S62190342U JP 1986078042 U JP1986078042 U JP 1986078042U JP 7804286 U JP7804286 U JP 7804286U JP S62190342 U JPS62190342 U JP S62190342U
Authority
JP
Japan
Prior art keywords
wiring board
semiconductor device
mounting
flexible wiring
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986078042U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986078042U priority Critical patent/JPS62190342U/ja
Publication of JPS62190342U publication Critical patent/JPS62190342U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1986078042U 1986-05-26 1986-05-26 Pending JPS62190342U (US06534493-20030318-C00166.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986078042U JPS62190342U (US06534493-20030318-C00166.png) 1986-05-26 1986-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986078042U JPS62190342U (US06534493-20030318-C00166.png) 1986-05-26 1986-05-26

Publications (1)

Publication Number Publication Date
JPS62190342U true JPS62190342U (US06534493-20030318-C00166.png) 1987-12-03

Family

ID=30926616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986078042U Pending JPS62190342U (US06534493-20030318-C00166.png) 1986-05-26 1986-05-26

Country Status (1)

Country Link
JP (1) JPS62190342U (US06534493-20030318-C00166.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02226736A (ja) * 1989-02-28 1990-09-10 Sony Corp 配線基板
WO2000002243A1 (fr) * 1998-07-01 2000-01-13 Seiko Epson Corporation Dispositif a semi-conducteur, procede de fabrication associe, carte imprimee et dispositif electronique

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02226736A (ja) * 1989-02-28 1990-09-10 Sony Corp 配線基板
WO2000002243A1 (fr) * 1998-07-01 2000-01-13 Seiko Epson Corporation Dispositif a semi-conducteur, procede de fabrication associe, carte imprimee et dispositif electronique

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