JPS62188181U - - Google Patents

Info

Publication number

JPS62188181U

JPS62188181U JP6196787U JP6196787U JPS62188181U JP S62188181 U JPS62188181 U JP S62188181U JP 6196787 U JP6196787 U JP 6196787U JP 6196787 U JP6196787 U JP 6196787U JP S62188181 U JPS62188181 U JP S62188181U

Authority

JP

Japan

Prior art keywords

inner layer

layer circuit

circuit board

substrate

printed wiring

Prior art date

1987-04-23

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
• 239000011889 copper foil Substances 0.000 claims description 2
• 239000000758 substrate Substances 0.000 claims 5
• 238000000465 moulding Methods 0.000 claims 1
• 238000004519 manufacturing process Methods 0.000 description 3
• 238000000691 measurement method Methods 0.000 description 1