JPS62188140U - - Google Patents

Info

Publication number
JPS62188140U
JPS62188140U JP7633086U JP7633086U JPS62188140U JP S62188140 U JPS62188140 U JP S62188140U JP 7633086 U JP7633086 U JP 7633086U JP 7633086 U JP7633086 U JP 7633086U JP S62188140 U JPS62188140 U JP S62188140U
Authority
JP
Japan
Prior art keywords
lead frame
bonder
conveyor
supplied
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7633086U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7633086U priority Critical patent/JPS62188140U/ja
Publication of JPS62188140U publication Critical patent/JPS62188140U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Special Conveying (AREA)
JP7633086U 1986-05-22 1986-05-22 Pending JPS62188140U (US06521211-20030218-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7633086U JPS62188140U (US06521211-20030218-C00004.png) 1986-05-22 1986-05-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7633086U JPS62188140U (US06521211-20030218-C00004.png) 1986-05-22 1986-05-22

Publications (1)

Publication Number Publication Date
JPS62188140U true JPS62188140U (US06521211-20030218-C00004.png) 1987-11-30

Family

ID=30923307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7633086U Pending JPS62188140U (US06521211-20030218-C00004.png) 1986-05-22 1986-05-22

Country Status (1)

Country Link
JP (1) JPS62188140U (US06521211-20030218-C00004.png)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526697A (en) * 1979-07-30 1980-02-26 Hitachi Ltd Pellet bonding device
JPS5754337A (en) * 1980-09-19 1982-03-31 Toshiba Corp Assembling apparatus for semiconductor device
JPS6133436B2 (US06521211-20030218-C00004.png) * 1982-10-08 1986-08-01 Matsushita Electric Ind Co Ltd
JPS6161832B2 (US06521211-20030218-C00004.png) * 1983-03-17 1986-12-27 Pfaff Ind Masch

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526697A (en) * 1979-07-30 1980-02-26 Hitachi Ltd Pellet bonding device
JPS5754337A (en) * 1980-09-19 1982-03-31 Toshiba Corp Assembling apparatus for semiconductor device
JPS6133436B2 (US06521211-20030218-C00004.png) * 1982-10-08 1986-08-01 Matsushita Electric Ind Co Ltd
JPS6161832B2 (US06521211-20030218-C00004.png) * 1983-03-17 1986-12-27 Pfaff Ind Masch

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