JPS62188039A - Optical information recording carrier - Google Patents

Abstract

PURPOSE:To eliminate curving at the time of fusing and joining by forming >=2 projections on the opposite surface of at least one of couples of circular substrates and annular spacers, and fusing and joining the other opposite surface facing said one opposite surface to the projections by an ultrasonic vibrating method. CONSTITUTION:A DRAW(direct read after write) disk has a couple of circular substrates 21 and 22 made of resin, etc., and those substrates 21 and 22 face each other and are provided with signal recording layers 23 and 24 inside the substrates. For example, an audio signal is recorded in a fine pit. The couple of annular spacers 25 and 26 are held at the outer and inner peripheral parts of both the circular substrates 21 and 22 and a space 27 is formed between the both 21 and 22. Eight and four conic projections 25a and 26a are formed on the opposite surfaces of the spacers 25 and 26 facing the substrates 21 and 22 in one body at equal pitch and those projection and substrates 21 and 22 are fused and connected by an ultrasonic vibrating method.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an optical information recording carrier, and more particularly to an optical information recording carrier in which a space is provided facing an internal signal recording layer.

Optical information recording carrier, such as DRAW (Qircct)
In the case of a Read After Write (Read After Write) disc, information is recorded as a large number of minute bits, so it is important to protect the layer in which the bits are formed, that is, the signal recording layer. For this reason, a type has been developed in which a pair of circular substrates, at least one of which has a signal recording layer, are bonded to face each other with the signal recording layer on the inside.

FIG. 7 shows a partial cross section of a DRAW disk that has already been developed and is in use.

As shown in the figure, two pairs of circular substrates 1 made of resin etc.
and 2 are opposed to each other, and a signal recording layer 3 is provided inside one transparent substrate 1. Both substrates 1 and 2 are fixed together with an adhesive 4.

When a particularly high-sensitivity signal recording layer is provided as the signal recording layer 3 in a DRAW disc configured in this way, the high-sensitivity signal recording layer is sensitive to adhesive and easily eroded, so it is difficult to record data as bits. It was happening that some of the signals that were sent were disappearing.

Figure 8 shows another DRA developed to solve this problem.
It shows a partial cross section of a W disk.

As shown in FIG. 8, in the DRAW disc, each of the pair of circular substrates 6 and 7 has a signal recording WI8.
and 9. Both boards 6 and 7 have respective signal records 18
．． 9 is on the inside, and a pair of annular spacers 10 and 11 are provided at the outer and inner circumferences.
carried by. Each board 6 and 7 and spacer 1
0.11 is fixed with adhesive 12.

As is clear from the figure, in the DRAW disc, the area in which each substrate 6.7 is fixed to the spacers io and 1i is small, and is limited to a portion where no signal is recorded. Therefore, the problem that the DRAW disk shown in FIG. Part of the recorded signal on the signal recording layer 3 will not disappear.

However, since the bonding area between each substrate 6.7 and each spacer 10.11 is small, there is a problem that the bonded portions may peel off when the substrates 6 and 7 expand due to heat or moisture.

Therefore, recently, a new DRAW disk as shown in FIGS. 9(a) and 9(b) has been developed.

In addition, FIG. 9(b) is the LXb related to FIG. 9(a).
-rxb sectional view. In this disc, a pair of annular spacers 18 respectively support the outer and inner peripheries of circular substrates 16 and 17 each having a signal recording layer 14 and 15.
Continuous protrusions 18a and 19a are integrally formed on both the upper and lower principal surfaces of the annular spacers and 19, extending all the way around the annular spacers. These protrusions 18a and 19a are connected to each circular substrate 16 and 1.
7 by ultrasonic vibration. However, the diagram! ! Shows the condition before arrival. With this configuration, the circular substrate 16.17 and the annular spacer 18.19 are integrated, so that even if the circular substrate 16.17 expands due to heat or moisture, or is subjected to a large external force such as when the disk is dropped on the floor, the circular substrate 16.17 remains circular. The substrate 16.17 and the annular spacer 18.19 do not separate.

However, each projection 18a of the annular spacer 18.19
, 19a and each of the circular substrates 16, 17, the annular spacer and the circular substrate generate heat around the entire circumference. Therefore, the amount of heat generated as a whole is large, and there is a concern that warping or the like may occur in the completed disk. Furthermore, the ultrasonic Fa bonding machine for fusing the two requires a high-output device, resulting in high costs.

11 The present invention has been made in view of the above-mentioned points, and its purpose is to prevent warpage from occurring when the circular substrate and the annular spacer are fused together (and to reduce the cost). An object of the present invention is to provide an optical information recording carrier.

The optical information recording carrier according to the present invention includes two circular substrates and an annular spacer on at least one opposing surface of each pair.
It is characterized in that three or more protrusions are formed, and the protrusions are fused to one opposing surface and the other opposing surface by ultrasonic vibration.

*m Hereinafter, a DRAW disk as an embodiment of the present invention will be described with reference to the accompanying drawings.

As shown in FIGS. 1, 2(a) and 2(b), the DRAW disk has a pair of circular substrates 21 and 22 made of resin or the like. In addition, Fig. 2(b) shows the second
It is an nb-nb sectional view regarding figure (a). The dual-use substrates 21, 22 are placed opposite each other, and on the inside of the winter-use substrates a signal recording ff 123, 24 is provided, respectively. These signal recording layers 23 and 24 contain minute bits (
For example, an audio signal is recorded as a dent.

The dual-use substrates 21 and 22 are supported at their outer and inner peripheries by a pair of annular spacers 25 and 26, thereby forming a space 27 between the dual-use substrates. Both main surfaces of each annular spacer 25 and 26,
That is, on the surfaces facing the circular substrates 21 and 22, eight and four semicircular protrusions 25a and 26a, respectively, are formed integrally and at equal pitches. The respective protrusions and the circular substrates 21 and 22 are subjected to ultrasonic waves (Fm?i) by driving.

However, Figure 1 shows the state after fusion, and Figure 2 (b) shows the state after fusion.
indicates the state before fusion.

FIG. 3 shows the state before fusion, and the shapes of the protrusions 25a and 26a before fusion are completely conical.
This is done using two ultrasound machines, upper and lower! ! ! It is fused using Seiki Seiki and 32.

The upper ultrasonic welding machine 31 includes an ultrasonic vibrator 34 driven by a power source 33, transmits ultrasonic vibrations emitted from the ultrasonic vibrator via a booster 35 and a vibration amplification body 36, and The cylinder mechanism 37 pressurizes and fuses them. The lower ultrasonic welding machine 32 is also constructed almost similarly to this ultrasonic welding machine 31. However, the vibration amplifying body 39 of the lower ultrasonic transducer 32 is formed with a ball portion 40 that is formed in each of the 18 attached members and that fits into a hole serving as a disk center hole to position each of the members. has been done. In addition, the vibration amplifying body 36 of the upper ultrasonic welding machine 31 has a concave portion 4 into which this pole portion 40 is inserted.
1 is provided.

As shown in FIG. 1, F! Each circular board 21 after AS
．． 22 and the annular spacer 25, 26, the gap existing between each opposing surface is filled with an ultraviolet curing type swallowing agent 42. This adhesive 42 is poured directly into the hole after the above-mentioned fusion work has been completed using capillary action, and is cured by irradiation with ultraviolet rays.

In addition, in the above DRAW disk, the annular spacer 2
The protrusion 25a (26a) formed in 5 (26) is conical, and the shape of the protrusion is as shown in Fig. 4 (26).
Various methods shown in a) to FIG. 6(b) are effective. However, FIG. 4(b) shows the lj,/1)-rVb cross section regarding FIG. 4(a), and FIGS. 5(b) and (C) each vb-vb cross section regarding FIG. 5(a). The cross section and the Vc-Vc arrow view are shown, and FIG. 6(b) is the same as FIG.
Fig. 3 shows a cross section of b-vrb regarding a).

Effects of the Invention As detailed above, in the optical information recording carrier according to the present invention, two or more protrusions are formed on the opposing surfaces of at least one of the pair of circular substrates and the annular spacer,
The one opposing surface and the other opposing surface and the protrusion are fused together by ultrasonic vibration.

In this way, since each circular substrate and the annular spacer are fused in a dotted manner, the amount of heat generated during fusion is small, and warping does not occur. Furthermore, the ultrasonic R precision machine for performing fusion bonding can be of low output power, resulting in low cost. Also! ! ! Because the wear is done in dots,
The area of the unfused portion between each circular substrate and the annular spacer, that is, the area filled with adhesive, is large, and a large adhesive force can be obtained.

[Brief explanation of drawings]

FIG. 1 is a partial vertical sectional view of a DRAW disk according to the present invention, and FIGS. 2(a) and (b) are Fm of the DRAW disk.
Figure 3 is a diagram showing the state before the m-plane, Figure 3 is a diagram showing each member and the ultrasonic welding machine immediately before the welding process, and Figures 4 (a) to 6 (
b) is a diagram showing a partial modification of the DRAW disk;
Figures 9 to 9(b) show DRAW that has already been developed.
FIG. 3 is a diagram for explaining a disk. Explanation of symbols of main parts

Claims (1)

[Claims] a pair of circular substrates, at least one of which has a signal recording layer; a pair of annular spacers supporting the outer and inner circumferential portions of the substrates, respectively, to face each other so that the signal recording layer is on the inside; an adhesive for fixing the spacers to each other, two or more protrusions are formed on opposing surfaces of at least one of the substrate and the annular spacer, and the ultrasonic wave An optical information recording carrier characterized by being fused by vibration.