JPS62180065U - - Google Patents

Info

Publication number

JPS62180065U

JPS62180065U JP6697686U JP6697686U JPS62180065U JP S62180065 U JPS62180065 U JP S62180065U JP 6697686 U JP6697686 U JP 6697686U JP 6697686 U JP6697686 U JP 6697686U JP S62180065 U JPS62180065 U JP S62180065U

Authority

JP

Japan

Prior art keywords

sputtering

target

view

perspective

taken along

Prior art date

1986-05-06

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000463 material Substances 0.000 claims description 8
• 238000004544 sputter deposition Methods 0.000 claims description 7
• 238000005477 sputtering target Methods 0.000 claims description 4
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
• 239000000654 additive Substances 0.000 description 3
• 230000000996 additive effect Effects 0.000 description 3
• 229910052802 copper Inorganic materials 0.000 description 3
• 239000010949 copper Substances 0.000 description 3
• 238000000034 method Methods 0.000 description 3
• 229910000679 solder Inorganic materials 0.000 description 2
• 239000002131 composite material Substances 0.000 description 1