JPS6217831B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a connection structure for a printed board connector, and more particularly to a connection structure for a printed board connector used to connect a backboard and a printed board in an electronic computer.

Conventionally, the connection structure of this type of printed board connector has a backboard 10 as shown in FIGS.
The connecting pin 3 driven in is brought into contact with a conductor spring 4 housed in a connector 9 fixed around one periphery of the printed board, and the lead wire 2 connected to the spring 4 is inserted into the through hole 8 of the printed board 7. A structure was used in which the device was inserted into the device and soldered.

In this case, in order to insert the lead wire 2 of the connector 9 into the through hole 8 of the printed board 7, the lead wire 2 becomes L-shaped, so the conductor length of the lead wire 2 from the connector 9 to the through hole 8 becomes long. Also,
The diameter of the lead wire 2 is becoming smaller because of the need for high-density packaging. Therefore, the impedance is high, which has the drawback of adversely affecting high frequency characteristics such as the amount of crosstalk, ground noise, and delay time.

SUMMARY OF THE INVENTION An object of the present invention is to provide a connection structure for a printed board connector that improves high frequency characteristics in connection between a printed board and a connector even if the lead wire of the connector is long and has a small diameter.

The connection structure of the printed board connector of the present invention includes a printed board having a ground terminal and a signal terminal, a ground lead wire fixed to the printed board and connected to the ground terminal, and a signal lead connected to the signal terminal. The device includes a connector having a wire, and a plate-shaped conductor provided along the ground lead wire and the signal lead wire and connected to the ground terminal and the ground lead wire.

Next, embodiments of the present invention will be described in detail with reference to the drawings.

3 and 4 are a perspective view and a sectional view, respectively, of an embodiment of the present invention, and FIG. 5 is an enlarged sectional view of part A in FIG. The cross-sectional shapes of the through-hole 51 for signals, the seat 61 for signals, the through-hole 52 for grounding, and the seat 62 for grounding are shown.

As shown in FIG. 4, a connector 9 is fixed to one side of the printed board 7, and a signal connection pin 31 and a ground connection pin 32 are driven into the back board 10.
(connected to earth) is brought into contact engagement with a signal spring 41 and a grounding spring 42 of the conductor correspondingly accommodated in the connector 9.

The lead wires of the connector 9 are lined up in three cases, and the signal lead wires 21 lined up inside the connector 9 connected to the signal spring 41 and the signal lead wires 23 lined up outside (shown in FIG. 3) are L. It is soldered to the corresponding signal through hole 51 and signal seat 61 of the printed board 7 in the shape of a letter. Similarly, the grounding lead wire 2 of the connector 9 is connected to the grounding spring 42.
2 has an L-shape and is soldered to the corresponding grounding through hole 52 and grounding seat 62 of the printed board 7. L along the grounding lead wire 22 and signal lead wire 23 and covering the connector 9.
A letter-shaped copper plate 1 is arranged.

This copper plate 1 has a protrusion 11 and a grounding lead wire 2.
The protrusion 12 provided on the printed board 7 side of the copper plate 1 is connected to the connector outlet part a of the copper plate 1 to be grounded.
Connect to by soldering.

Therefore, the copper plate 1 lowers the impedance between the grounding spring 42 and the grounding through hole 52, and also shields the signal lead wire 23 to improve high frequency characteristics.

In the above-described embodiment, the copper plate 1 was placed outside the outer lead wires of the three rows of connector 9 lead wires, but the copper plate 1 was placed between the lead wire rows and between the lead wires in the inner row. They may be placed along the same line.

As explained above, the present invention provides a grounded plate-shaped conductor along the lead wire of the connector, lowers the impedance in the connection between the printed board and the connector, reduces high frequency noise, and can be applied to high-speed logic devices. effective.

[Brief explanation of the drawing]

1 and 2 are a perspective view and a sectional view of a conventional example, respectively, FIGS. 3 and 4 are a perspective view and a sectional view of an embodiment of the present invention, respectively, and FIG.
FIG. 2 is an enlarged cross-sectional view of part A in the figure. 1... Copper plate, 2... Lead wire, 3... Connection pin, 4... Spring, 7... Printed board, 8... Through hole, 9... Connector, 10... Back board, 11... Protrusion, 21, 23...Signal lead wire, 22...Ground lead wire, 31...Signal connection pin, 32...Ground connection pin, 41...
...Signal spring, 42...Grounding spring, 51...
Signal through hole, 52... Grounding through hole, 61... Signal seat, 62... Grounding seat.

Claims (1)

[Claims] 1. A printed board having a ground terminal and a signal terminal, a connector fixed to the printed board and having a ground lead wire connected to the ground terminal, a signal lead wire connected to the signal terminal, and the ground lead. 1. A connection structure for a printed board connector, comprising a wire and a plate-shaped conductor provided along the signal lead wire and connected to the ground terminal and the ground lead wire.