JPS62177874A - Connectiong terminal - Google Patents
Connectiong terminalInfo
- Publication number
- JPS62177874A JPS62177874A JP1795386A JP1795386A JPS62177874A JP S62177874 A JPS62177874 A JP S62177874A JP 1795386 A JP1795386 A JP 1795386A JP 1795386 A JP1795386 A JP 1795386A JP S62177874 A JPS62177874 A JP S62177874A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- terminal
- pin terminal
- flat part
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 32
- 238000005452 bending Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 5
- 238000002788 crimping Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ピン端子と電線とを半田を用いて電気的に接
続するための接続端子に係り特に半田強度を増大するに
好適な構造に関する。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a connection terminal for electrically connecting a pin terminal and an electric wire using solder, and particularly relates to a structure suitable for increasing solder strength. .
従来の接続端子は、実開昭５６−０４４４７１号公報に
記載のようにピン端子機持部側に向って膨出する溶融半
田流入用突条を設けた構造となっていた。Conventional connection terminals have a structure in which a protrusion for flowing molten solder is provided that bulges toward the pin terminal holding portion, as described in Japanese Utility Model Application Publication No. 56-044471.
上記従来技術は流入した半田強度の点について配慮され
ておらず、半田強度不足となる問題があった。The above-mentioned conventional technology does not take into account the strength of the inflowing solder, and has the problem of insufficient solder strength.
本発明の目的は半田強度を増大するととＫある。An object of the present invention is to increase solder strength.
上記目的は、半田流入用突条を分割し、突条の両側を連
結する半田連結路を設け、流入半田を連結することによ
り達成される。The above object is achieved by dividing the solder inflow protrusion, providing a solder connection path that connects both sides of the protrusion, and connecting the inflowing solder.
半田連結路は突条の両側を突条に沿って流れる半田を連
結するように作用する。それ江よって流入半田は連結で
きるので半田強度が不足することがない。The solder connection path acts to connect the solder flowing along the protrusion on both sides of the protrusion. Since the inflowing solder can be connected by the bridge, the solder strength will not be insufficient.
以下、本発明の一実施例を第１図、第２図、第３図、第
４図、第５図、によシ説明する。Hereinafter, one embodiment of the present invention will be explained with reference to FIGS. 1, 2, 3, 4, and 5.
第１図は、本発明に係る接続端子の平面図、第２図は第
１図■−■線断面図、第３図は背面図、第４図は右側面
図、第５図は第１図■−■線断面図である。図面に於い
てｌｒ／ｉピン端子３との接続部であり、２はピン端子
３と直交するように設けた電線４との接続部である。電
線接続部は、断面Ｕ字形の被覆部圧着片２ａと略同形状
の導体部圧着片２ｂから成る。第２図に於いてピン端子
接続部１は、電線接続部２から延出した平面部１ａと該
平面部１ａから延出し、平面部端をほぼ直角に上方に折
曲した後、ピン端子３を囲み平面部１ａに対面するよう
に断面逆Ｕ字状に形成したピン端子握持部１ｂとから成
り、該平面部１ａのピン端子挿入方向には、ピン端子握
持部側に向って膨出する溶融半田導入用断続突条ＩＣと
第５図による半田連結路Ｃを設けている。なお、平面部
端は正確に直角に折曲することは要せず、多少丸みをつ
けても良い。ピン端子握持部１ｂの長手方向の略中央に
は切込み１ｄを設け、ピン端子握持部１ｂに弾力性を付
与している。Fig. 1 is a plan view of a connecting terminal according to the present invention, Fig. 2 is a sectional view taken along the line ■-■ in Fig. 1, Fig. 3 is a rear view, Fig. 4 is a right side view, and Fig. 5 is a It is a sectional view taken along the line shown in FIG. In the drawing, it is a connection part with the lr/i pin terminal 3, and 2 is a connection part with an electric wire 4 provided perpendicularly to the pin terminal 3. The wire connection portion consists of a covering portion crimping piece 2a having a U-shaped cross section and a conductor portion crimping piece 2b having approximately the same shape. In FIG. 2, the pin terminal connecting portion 1 includes a flat portion 1a extending from the wire connecting portion 2 and a flat portion 1a extending from the flat portion 1a. and a pin terminal gripping part 1b formed in an inverted U-shape in cross section so as to surround the flat part 1a and face the flat part 1a. Intermittent protrusions IC for introducing molten solder and a solder connecting path C as shown in FIG. 5 are provided. Note that the ends of the flat portions do not need to be bent exactly at right angles, and may be slightly rounded. A notch 1d is provided at approximately the center of the pin terminal gripping portion 1b in the longitudinal direction to impart elasticity to the pin terminal gripping portion 1b.
本実施例によれば、ピン端子３を接続端子に装着した場
合に、ピン端子３の外面と接続端子内面との間の空隙Ａ
及びＢから流入した半田が半田連結路Ｃによって連結で
きる効果がある。According to this embodiment, when the pin terminal 3 is attached to the connecting terminal, the gap A between the outer surface of the pin terminal 3 and the inner surface of the connecting terminal
There is an effect that the solder flowing from the and B can be connected by the solder connecting path C.
第６図ＶＣ′＄発明の半田連結路を″複数個設けた実施
路を示す。この場合流入半田は複数箇所で連結でき、持
続をより確実に行なうことができる効果がある。なお、
半田流入用断続突条は円形でもよい。FIG. 6 shows an implementation path in which a plurality of solder connection paths of the VC'$ invention are provided. In this case, the inflowing solder can be connected at a plurality of locations, which has the effect of more reliably sustaining the solder.
The intermittent protrusions for solder inflow may be circular.
第７図に本発明による半田連結路を設けた半田流入用断
続突条を複数列設けた実施列の上面図を示す。この場合
ピン端子３の外面と接続端子内面との間の空隙はＡ及び
Ｂ及びＤとなりピン端子３の全周に形成でき、本発明に
よる半田の連結はピン端子３０周りで環状に連結でき、
接続をより確実に行うことのできる効果がある。FIG. 7 shows a top view of an embodiment of the present invention in which a plurality of rows of intermittent protrusions for solder inflow are provided with solder connection paths according to the present invention. In this case, the gaps A, B, and D between the outer surface of the pin terminal 3 and the inner surface of the connecting terminal can be formed around the entire circumference of the pin terminal 3, and the solder connection according to the present invention can be connected in a ring shape around the pin terminal 30.
This has the effect of making the connection more reliable.
本発明によれば、流入した半田の連結ができるので半田
強度を増大できる効果がある。According to the present invention, since the inflowing solder can be connected, the solder strength can be increased.
第１図は本発明の一実施例の正面図、第２図は第１図の
■−π線断面図、第３図は背面図、第４列の正面図であ
る。
ｌ・・・ピン端子接続部、２・・・電線接続部、３・・
・ピン端子、４・・・電線、ｌａ・・・平面部、１ｂ・
・・ピン端子握持部、ＩＣ・・・断続突条、Ｃ・・・半
田連結路。FIG. 1 is a front view of an embodiment of the present invention, FIG. 2 is a sectional view taken along the line ■-π of FIG. 1, and FIG. 3 is a rear view and a front view of the fourth row. l...Pin terminal connection part, 2...Wire connection part, 3...
・Pin terminal, 4...Electric wire, la...Flat part, 1b・
...Pin terminal gripping part, IC...intermittent protrusion, C...solder connection path.
Claims (1)
接続端子において、ピン端子接続部は、電線接続部から
延出した平面部と、該平面部から延出し、平面部端をほ
ぼ直角に上方に折曲して後、ピン端子を囲み平面部に対
面するように断面逆Ｕ字状に成形したピン端子握持部と
から成り、該平面部のピン端子挿入方向には、ピン端子
握持部側に向って膨出する溶融半田導入用断続突条を設
け、該断続部を流入半田の連結路としたことを特徴とす
る接続端子。 ２、特許請求の範囲第１項に記載の接続端子において導
入半田の連結路を１箇所又は複数箇所設けたことを特徴
とする接続端子。 ３、特許請求の範囲第１項に記載の接続端子において溶
融半田導入用断続突条を１列又は複数列設けたことを特
徴とする接続端子。[Claims] 1. In a connecting terminal that electrically connects a pin terminal and an electric wire using solder, the pin terminal connecting part has a flat part extending from the electric wire connecting part and a flat part extending from the flat part. , a pin terminal gripping part formed by bending the end of the flat part upward at a substantially right angle and then forming an inverted U-shaped cross section so as to surround the pin terminal and face the flat part, and the pin terminal of the flat part A connecting terminal characterized in that an interrupted protrusion for introducing molten solder is provided in the insertion direction and bulges toward the pin terminal gripping portion, and the interrupted portion is used as a connection path for inflowing solder. 2. A connecting terminal according to claim 1, characterized in that one or more connecting paths for introducing solder are provided in the connecting terminal. 3. A connecting terminal according to claim 1, characterized in that one or more rows of intermittent protrusions for introducing molten solder are provided in the connecting terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1795386A JPS62177874A (en) | 1986-01-31 | 1986-01-31 | Connectiong terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1795386A JPS62177874A (en) | 1986-01-31 | 1986-01-31 | Connectiong terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62177874A true JPS62177874A (en) | 1987-08-04 |
Family
ID=11958124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1795386A Pending JPS62177874A (en) | 1986-01-31 | 1986-01-31 | Connectiong terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62177874A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0353753U (en) * | 1989-09-26 | 1991-05-24 |
-
1986
- 1986-01-31 JP JP1795386A patent/JPS62177874A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0353753U (en) * | 1989-09-26 | 1991-05-24 |
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