JPS62177609U - - Google Patents
Info
- Publication number
- JPS62177609U JPS62177609U JP1986066640U JP6664086U JPS62177609U JP S62177609 U JPS62177609 U JP S62177609U JP 1986066640 U JP1986066640 U JP 1986066640U JP 6664086 U JP6664086 U JP 6664086U JP S62177609 U JPS62177609 U JP S62177609U
- Authority
- JP
- Japan
- Prior art keywords
- carrier sheet
- cover tape
- longitudinal direction
- heat
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
Landscapes
- Package Closures (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986066640U JPH0451136Y2 (pl) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986066640U JPH0451136Y2 (pl) | 1986-04-30 | 1986-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62177609U true JPS62177609U (pl) | 1987-11-11 |
JPH0451136Y2 JPH0451136Y2 (pl) | 1992-12-02 |
Family
ID=30904834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986066640U Expired JPH0451136Y2 (pl) | 1986-04-30 | 1986-04-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0451136Y2 (pl) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS465987A (pl) * | 1970-04-30 | 1971-12-06 | ||
JPS5532804U (pl) * | 1978-08-21 | 1980-03-03 | ||
JPS59123300A (ja) * | 1982-12-28 | 1984-07-17 | 株式会社東芝 | 半導体装置のテ−ピング方法およびテ−ピング装置 |
-
1986
- 1986-04-30 JP JP1986066640U patent/JPH0451136Y2/ja not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS465987A (pl) * | 1970-04-30 | 1971-12-06 | ||
JPS5532804U (pl) * | 1978-08-21 | 1980-03-03 | ||
JPS59123300A (ja) * | 1982-12-28 | 1984-07-17 | 株式会社東芝 | 半導体装置のテ−ピング方法およびテ−ピング装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0451136Y2 (pl) | 1992-12-02 |