JPS62177039U - - Google Patents

Info

Publication number
JPS62177039U
JPS62177039U JP6598786U JP6598786U JPS62177039U JP S62177039 U JPS62177039 U JP S62177039U JP 6598786 U JP6598786 U JP 6598786U JP 6598786 U JP6598786 U JP 6598786U JP S62177039 U JPS62177039 U JP S62177039U
Authority
JP
Japan
Prior art keywords
convex portion
taking out
utility
insulating material
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6598786U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6598786U priority Critical patent/JPS62177039U/ja
Publication of JPS62177039U publication Critical patent/JPS62177039U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP6598786U 1986-04-28 1986-04-28 Pending JPS62177039U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6598786U JPS62177039U (fr) 1986-04-28 1986-04-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6598786U JPS62177039U (fr) 1986-04-28 1986-04-28

Publications (1)

Publication Number Publication Date
JPS62177039U true JPS62177039U (fr) 1987-11-10

Family

ID=30903568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6598786U Pending JPS62177039U (fr) 1986-04-28 1986-04-28

Country Status (1)

Country Link
JP (1) JPS62177039U (fr)

Similar Documents

Publication Publication Date Title
JPS62177039U (fr)
JPS62157086U (fr)
JPS62177040U (fr)
JPH0195756U (fr)
JPH0252443U (fr)
JPH0193745U (fr)
JPS63131144U (fr)
JPS6454339U (fr)
JPS63131142U (fr)
JPS6454325U (fr)
JPS6251242U (fr)
JPH01161336U (fr)
JPH0176051U (fr)
JPS6199374U (fr)
JPS61177459U (fr)
JPH0187558U (fr)
JPH0267279U (fr)
JPH0310543U (fr)
JPH0350320U (fr)
JPH0236175U (fr)
JPS6447056U (fr)
JPH01129842U (fr)
JPS62164417U (fr)
JPS6397241U (fr)
JPS6382945U (fr)