JPS62174916A - Resist coating device - Google Patents

Abstract

PURPOSE:To prevent the liquid resist spreading on the circumference of a wafer from creeping on the back of the wafer and adhering to the back side of the succeeding wafer by a method wherein a heating device, with which the circumferential part of the wafer will be heated up, is provided and the resist spread on the circumference of the wafer is dried up and hardened. CONSTITUTION:A heating device 10 is arranged on the part located upper than the upper surface of a wafer placing plate 25. A wafer 35 is fixed to the wafer placing plate 25, and the suitable quantity of liquid resist is fed to the center part of the surface of the wafer 35 from the exhaust hole 28 of a resist pipe 22. The circumferential part of the wafer 35 is heated up by the heating device 10 in the state wherein the liquid resist has been spread over the surface of the wafer 35. As a result, the liquid resist collected on the circumference of the wafer is dried up and hardened, and the resist is prevented from creeping on the back side of the wafer 35 and adhering to the back side of the succeeding wafer through the intermediary of the guide of a conveying device and the like.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a resist coating apparatus for coating a resist liquid on the surface of a wafer.

<Prior Art> Conventionally, a resist solution is applied to a wafer using a resist coating device 20 as shown in FIG. This resist coating device 20 is composed of a dock 21, a resist pipe 22, and a resist j/cup 23.

When applying resist liquid to the surface of the wafer 35 using the resist coating device 20, the following procedure is performed.

First, set the wafer 35 on the upper surface of the chuck 21,
It is fixed on the chuck 21 by evacuation.

Then, resist liquid is supplied from the resist vibrator 22 to the surface of the wafer 35, and the wafer 35 is rotated together with the chuck 21. The resist liquid supplied to the surface of the wafer 35 is spread over the entire surface of the wafer 35 by rotation.

In this way, the wafer 35 coated with the resist solution
is taken out from the resist coating device 20 and sent to the next baking (drying) process.

<Problems to be Solved by the Invention> By the way, when carrying a wafer coated with a resist liquid to a baking process, or baking while carrying it on a device such as a baking belt, the following There are many problems like 6.

By the time the wafer is taken out from the resist coating device, the resist liquid is not yet dried and has spread to the periphery of the wafer and remains there. Then, some of it wraps around the back side of the wafer. Resist liquid that has accumulated in an undried state on the periphery or back surface of the wafer adheres to the guide or belt of the transport device during transport. Then, the resist liquid adhering to the guide or belt is transferred and adheres to the back surface of the subsequent wafer. However, if the resist solution adheres to the back surface of the wafer, it will interfere with the edging process for the back surface of the wafer, which is performed after the baking process.

The present invention has been made in view of the above-mentioned problems, and is such that when a wafer coated with a resist solution is transported, the resist solution that has spread around the periphery of the wafer gets around to the back surface of the wafer. It is an object of the present invention to provide a resist coating device that does not deposit any resist on the back side of subsequent wafers via a guide of a conveyance device or the like.

Means for Solving Problems> In order to achieve the above object, the present invention provides a heater device that heats the peripheral edge of a wafer held on the upper surface of a chuck of a resist coating device, above the chuck. Ta.

<Operation> According to the above configuration, the peripheral edge of the wafer coated with the resist liquid is heated by the heater device, and the resist liquid spreading on the peripheral edge is dried and hardened.

<Example> FIG. 1 is a side sectional view of a resist coating apparatus according to an example of the present invention. The resist coating device 20 of the present invention is the same as the conventional example shown in FIG. 2 except that the heater device 10 is provided. Therefore, parts in FIG. 1 that correspond to those in FIG. 2 are given the same reference numerals.

First, this resist coating device 20 has a chuck 2.
1, a resist pipe 22, and a resist cup 23. The chuck 21 has a support shaft 24 that rotates around a vertical axis, and a wafer mounting table 25 is formed above the support shaft 24.

The wafer mounting table 25 has an opening 26 on its upper surface,
The opening 26 is connected to a vacuum evacuation device (not shown) through a through hole 27 formed in the support shaft 24. Also,
The discharge port 28 of the resist pipe 22 is connected to the wafer mounting table 25.
It is located above the center of the top surface. On the other hand, the resist cup 23 consists of a lower part 129 and an upper half part 30.

The lower half 29 has an opening 31 formed in its center, through which the support shaft 24 passes, and a liquid receiving part 32 lower than the center formed in its periphery. Furthermore, an opening 33 is formed in the upper half 30.

The heater device 10 is arranged above the top surface of the wafer mounting table 25. The heater device 10 has a disk shape with an opening Il in its center through which the discharge port 28 of the resist pipe 22 can pass. A heater 12 that heats the peripheral edge of the wafer 35 is attached to the peripheral edge of the heater device 10 . In the embodiment shown in FIG. 1, a circular film heater is shown as an example of the heater 12. This heater 12 is connected to a power source 14 via a temperature regulator i3. Further, the heater device 10 is supported so as to be movable up and down by a lifting means I5 fixed outside the resist coating device 20.

Next, the operation of the resist coating device 20 will be explained based on FIG.

A wafer 35 to be coated with a resist solution is set on a wafer mounting table 25. By evacuation through the through hole 27, the wafer 35 is placed on the wafer mounting table 2.
5. Fix it on top. Then, an appropriate amount of resist liquid is supplied from the discharge port 28 of the resist pipe 22 to the center of the surface of the wafer 35 . Next, the chuck 21 is rotated at a high speed corresponding to the thickness of the resist solution to be applied. Due to the centrifugal force caused by the rotation, the supplied resist solution or the wafer 35
spreads over the entire surface. At this time, the excess resist liquid reaches the liquid receiving portion 32 of the lower half 29 of the resist cup 23 by ρ1.

With the resist solution spread over the surface of the wafer 35, the peripheral edge of the wafer 35 is heated by the heater device IO. In this way, the resist liquid accumulated on the peripheral edge of the wafer 35 is dried and hardened. The heater device IO is raised by the lifting device 15 only when setting and taking out the wafer 35.

The wafer 35 with the resist liquid spread around its periphery is taken out from the resist coating device 20 and transported to the next bagging step.

<Effects of the Invention> As described above, according to the present invention, the resist liquid spreading around the periphery of the wafer is dried and evaporated by the heater device. An advantage is obtained that the wafer does not adhere to the transfer device during the transfer of the wafer, and does not adhere to the back surface of the subsequent wafer via the transfer device.

[Brief explanation of drawings]

FIG. 1 is a side sectional view of a resist coating apparatus according to an embodiment of the present invention, and FIG. 2 is a side sectional view of a conventional resist coating apparatus. IO...heater device, 20...resist coating device,
21...Jack, 35...Wafer. Figure 2

Claims (1)

[Claims] (1) In a resist coating device that applies a resist solution to a wafer held on the upper surface of a chuck rotating around a vertical axis, the peripheral edge of the wafer held by the chuck is heated above the chuck. A resist coating device characterized by being equipped with a heater device.