JPS62174677U - - Google Patents

Info

Publication number
JPS62174677U
JPS62174677U JP6118586U JP6118586U JPS62174677U JP S62174677 U JPS62174677 U JP S62174677U JP 6118586 U JP6118586 U JP 6118586U JP 6118586 U JP6118586 U JP 6118586U JP S62174677 U JPS62174677 U JP S62174677U
Authority
JP
Japan
Prior art keywords
synthetic resin
resin powder
electronic component
fluidized
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6118586U
Other languages
Japanese (ja)
Other versions
JPH0720916Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986061185U priority Critical patent/JPH0720916Y2/en
Publication of JPS62174677U publication Critical patent/JPS62174677U/ja
Application granted granted Critical
Publication of JPH0720916Y2 publication Critical patent/JPH0720916Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の装置の側断面図、第２図は第
１図の―線視断面図、第３図は第２図の要部
拡大正面図、第４図は電子部品の斜視図、第５図
及び第６図は従来技術を示し、第５図は従来装置
の断面図、第６図は第５図の―線視要部正面
図である。 １…本体、２…基板、３…部品、４…リード部
、５…パツケージ、７…流動槽、８…合成樹脂粉
体、１０…吊下げ体、１１…管、９，１２…フイ
ルタ、１４…昇降ガイド機構、１５…基台、１６
…上下スライド軸、１７…昇降駆動手段、１８…
フレーム、２０…支持テーブル、２１…防振ゴム
、２２…バイブレータ、２３…水平案内支持軸、
２４…軸受、２５…ねじ軸、２６…ナツト部、２
７…駆動モータ。 Fig. 1 is a side sectional view of the device of the present invention, Fig. 2 is a sectional view taken along the - line of Fig. 1, Fig. 3 is an enlarged front view of the main part of Fig. 2, and Fig. 4 is a perspective view of electronic components. , FIG. 5 and FIG. 6 show the prior art. FIG. 5 is a cross-sectional view of the conventional device, and FIG. 6 is a front view of the main part of FIG. DESCRIPTION OF SYMBOLS 1... Main body, 2... Board, 3... Parts, 4... Lead part, 5... Package, 7... Fluidization tank, 8... Synthetic resin powder, 10... Hanging body, 11... Pipe, 9, 12... Filter, 14 ...Elevating guide mechanism, 15...Base, 16
...Vertical slide shaft, 17... Lifting drive means, 18...
Frame, 20... Support table, 21... Anti-vibration rubber, 22... Vibrator, 23... Horizontal guide support shaft,
24...Bearing, 25...Screw shaft, 26...Nut part, 2
7... Drive motor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上面開放の流動槽を上下振動すると共に、該流
動槽内の合成樹脂粉体を槽底部から吹き上げるエ
アにて流動状にして電子部品の本体を浸漬するよ
うにした電子部品の合成樹脂粉体塗装装置におい
て、前記流動槽の上方に電子部品の本体を吊下げ
し、前記流動槽または電子部品の少なくとも一方
を、流動槽内部の合成樹脂粉体が前記電子部品に
おける凹凸の大きい広巾面に押し付けられるよう
に略水平移動させることを特徴とする電子部品の
合成樹脂粉体塗装装置。 Synthetic resin powder coating of electronic components in which a fluidized tank with an open top is vibrated up and down, and the synthetic resin powder in the fluidized tank is fluidized by air blown up from the bottom of the tank, and the main body of the electronic component is immersed. In the apparatus, a main body of an electronic component is suspended above the fluidized tank, and at least one of the fluidized tank or the electronic component is pressed against a wide surface of the electronic component where the synthetic resin powder inside the fluidized tank has large irregularities. A synthetic resin powder coating device for electronic components, which is moved approximately horizontally as shown in FIG.
JP1986061185U 1986-04-23 1986-04-23 Synthetic resin powder coating equipment for electronic parts Expired - Lifetime JPH0720916Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986061185U JPH0720916Y2 (en) 1986-04-23 1986-04-23 Synthetic resin powder coating equipment for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986061185U JPH0720916Y2 (en) 1986-04-23 1986-04-23 Synthetic resin powder coating equipment for electronic parts

Publications (2)

Publication Number Publication Date
JPS62174677U true JPS62174677U (en) 1987-11-06
JPH0720916Y2 JPH0720916Y2 (en) 1995-05-15

Family

ID=30894286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986061185U Expired - Lifetime JPH0720916Y2 (en) 1986-04-23 1986-04-23 Synthetic resin powder coating equipment for electronic parts

Country Status (1)

Country Link
JP (1) JPH0720916Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011235240A (en) * 2010-05-11 2011-11-24 Denso Corp Powder coating apparatus and powder coating method
JP2019084515A (en) * 2017-11-09 2019-06-06 本田技研工業株式会社 Powder resin coating apparatus and powder resin coating method
JP2019084514A (en) * 2017-11-09 2019-06-06 本田技研工業株式会社 Powder surface flattening method and powder resin coating apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60227427A (en) * 1984-04-26 1985-11-12 Fujitsu Ltd Packaging method of sip-type parts

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60227427A (en) * 1984-04-26 1985-11-12 Fujitsu Ltd Packaging method of sip-type parts

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011235240A (en) * 2010-05-11 2011-11-24 Denso Corp Powder coating apparatus and powder coating method
JP2019084515A (en) * 2017-11-09 2019-06-06 本田技研工業株式会社 Powder resin coating apparatus and powder resin coating method
JP2019084514A (en) * 2017-11-09 2019-06-06 本田技研工業株式会社 Powder surface flattening method and powder resin coating apparatus

Also Published As

Publication number Publication date
JPH0720916Y2 (en) 1995-05-15

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