JPS62170676U - - Google Patents

Info

Publication number

JPS62170676U

JPS62170676U JP5861186U JP5861186U JPS62170676U JP S62170676 U JPS62170676 U JP S62170676U JP 5861186 U JP5861186 U JP 5861186U JP 5861186 U JP5861186 U JP 5861186U JP S62170676 U JPS62170676 U JP S62170676U

Authority

JP

Japan

Prior art keywords

wiring board

printed wiring

surface mount

component

thickness

Prior art date

1986-04-18

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
• 238000005476 soldering Methods 0.000 description 2
• 229910000679 solder Inorganic materials 0.000 description 1