JPS62169409A - Wafer control equipment for searching optimum operating conditions - Google Patents

Abstract

PURPOSE:To contrive the automatic and rapid collection, control and practical use of the minute operational results of the sorts, types and processes of a wafer and a pellet by recording the data on operating conditions and the opera tional results in the processor contained in a wafer carrier jig. CONSTITUTION:After connecting a wafer carrier jig 1 to a computer 5 with CRT, various information concerning a wafer is selected and sent to the memory of a processor 3 contained in the wafer carrier jig 1. The sorts, the types and the identification information of the wafer, process series (operational procedures), operating conditions, etc., are registered, while the sorts, the types and the identification information of the wafer, the name of the next process, etc., are shown on the display elements 2 with touch panel of the wafer carrier jig 1. Communication is possible by connecting to the information input/output terminal 4 of the wafer carrier jig 1 and the processing and the treatment of the wafer can be carried out autonomously by connecting a processing equip ment which can automatically set operating conditions to the information input/ output terminal 4 of the wafer carrier jig 1.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention provides high-yield, optimal work by reading and writing wafer processing results, etc., into a processor built in a wafer carrier jig for searching for optimal work conditions in the processing process of semiconductor memory elements. The present invention relates to a wafer management device for searching for optimal working conditions that can speed up the search for conditions and trial management for searching, and easily shift to automation of work management.

[Background of the invention]

As a method for identifying single wafers in the conventional semiconductor device processing process, 1, for example, as shown in a part of the computer-controlled semiconductor wafer processing apparatus described in Japanese Patent Application Laid-Open No. 55-40184, a computer-controlled method is used. There is a method of reading the wafer code stamped on the back side of the wafer to process it in units of 800 wafers, or a method for numbering semiconductor wafers described in Japanese Patent Application Laid-Open No. 115325/1983, which uses the peripheral part of the surface of each wafer. A known method is to selectively inject a radioactive substance into a predetermined area of the area and number the area. However, the above conventional method is a method in which a wafer identification code is attached to the main body of the wafer 1 and then read.

This is not a method that retains wafer history information to search for and evaluate high-yield working conditions for the relevant process. On the other hand, for example, "Electronic Materials J 1981 Special Issue p. 34. Ultra LS" published by Kogyo Research Association.
I and single crystal technology as described.

The SEMI standard also proposes a method of adding information such as crystal resistance and orientation in addition to wafer identification information to the wafer surface.

However, as the miniaturization and customization of semiconductor devices progress, processing conditions and processing results for each wafer pellet are increasingly required for failure analysis and process control. With conventional methods, it is necessary to handwrite only the necessary information on slips or notebooks, or collect and manage huge amounts of information, such as 100 megabytes of information at once, resulting in a decrease in productivity due to management through acquisition. was. In addition, with the above-mentioned method of stamping an identification hood on the back side of the wafer, the problem of alignment accuracy due to unevenness on the back side of the wafer becomes more difficult as miniaturization progresses, and the influence of processing on semiconductor characteristics becomes a problem. Even the method of injecting substances and numbering them has problems, such as the effect on semiconductor characteristics and the safety of the human body.

In order to overcome these problems with conventional methods, it is possible to automatically read and write identification information, work conditions, work results, etc. of single wafers, and to prevent the generation and adhesion of foreign matter and dust during transfer between processing steps. There is a need for a wafer carrier jig for searching for optimal working conditions that can centrally manage objects and information, and a wafer management device for searching for optimal working conditions that can evaluate and manage that information.

[Purpose of the invention]

The purpose of the present invention is to read and write instructions for setting work conditions and collection of work results in the processing process of semiconductor memory elements into a processor built in a wafer carrier jig for searching for optimal work conditions in units of 8 units, so that it can be used in conventional forms and notebooks. It is an object of the present invention to provide a wafer management device for searching for optimal working conditions that enables collection and management of work results for each type and process of each pellet, and speeding up and automating its utilization, which was not possible with the previous methods.

[Summary of the invention]

The present invention is built into a wafer carrier jig for searching for optimal working conditions that can manage and transport the working conditions and work performance data for each wafer in the processing process of semiconductor memory elements without recording the wafer itself. By recording the information in the processor and performing the necessary processing,
Optimal working conditions that allow for the reading and writing of work management information without the need for media such as work slips or barcodes, and the ability to process ueno autonomously without constantly communicating with the host converter system. This is a search wafer management device.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIG.

FIG. 1 is a conceptual diagram showing an embodiment of a wafer management device for searching for optimal working conditions according to the present invention. In Figure 1, 1
is a wafer carrier jig for searching for optimal working conditions used for managing single wafers and transporting them between processes in the processing process of semiconductor memory devices.

2 is a display element with a touch panel provided on the wafer carrier jig 1; 3 is a processor built in the wafer carrier jig 1 and capable of storage and communication; 4 is an information input/output terminal of the wafer carrier jig 1; 5 is an information This is a computer with a CRT that can be connected to the input terminal 4 for communication.

With this configuration, first, a CRT that can be connected and communicated with the information input/output terminal 4 of the rectangular parallelepiped wafer carrier jig 1 for searching for optimal working conditions has a wafer insertion/extraction port that can store, hold, and transport a single wafer. All product types, wafer identification information, process names, processing conditions for each process, etc. are registered in the computer 5 in advance. Here, after connecting the wafer carrier jig 1 and the computer 5 with CRT, select various information corresponding to the wafer and
Magnetic bubble memory of processor 3 built in or E
By transmitting data to a recording unit such as a 2FROM that has reading/writing and erasing functions, the product model name, wafer identification information, process sequence (work procedure), work conditions, etc. of the wafer are registered in the storage unit of this large-capacity processor 3. On the other hand, the wafer type, wafer identification information, next process name, etc. of the wafer are displayed on the display element 2 with a touch panel of this wafer carrier jig 1, and the wafer is inserted into this wafer carrier jig 1 and prepared. Complete. If you want to take more aggressive measures to improve yield.

The CRT-equipped computer 5 classifies and evaluates the working conditions of the process according to the experimental design method, and the searched experimental information is additionally transmitted to the wafer carrier jig 1 and registered.

Then, after transporting the Kueno\carrier jig 1 holding the wafer to the next process, it is connected to the information input/output terminal 4 of the wafer carrier jig 1 to enable communication and to automatically set working conditions. The information input/output terminal 4 of the wafer carrier jig 1 is connected to the processing equipment for the process that has not yet been installed.

The working conditions of the process searched and registered in the recording section of the processor 3 are transmitted to the processing equipment through all the information input/output terminals 4, and are also displayed on the display element 2 with a touch panel of the wafer carrier jig 1. . Here, during or after the work on the wafer taken out from the wafer carrier jig 1 by the processing equipment of the process is completed.

The wafer carrier jig 1 inputs information such as work results and work time such as work start and completion through the information input/output terminal 4 and registers it in the recording section of the processor 3.

The processor 3 determines whether or not the processing of the process is appropriate. If it is judged to be appropriate, the progress instruction information for the next process @ is displayed on the display element 2 with a touch panel to encourage the wafer to proceed to the next process, but if it is judged to be no, it will be displayed according to the condition. If the wafer has been instructed to be reprocessed, the wafer is also instructed to be discarded. In response to these instructions, the heavy worker confirms their execution by pressing the display element 2 with a touch panel.
, work date, worker name, equipment model name, and
Also registers device status, etc. Also, if only a portion of the wafer can be effectively used.

The pellet position information within the effective area is registered and designated as the processing area for the next process.

Here, the wafer that has been processed in this step is stored in the wafer carrier jig 1 and transported to the next step, thereby performing the same operation as in the 91st step. Furthermore, for wafers for which work has been completed in all processes, work performance data registered in the storage section of the processor 3 of the wafer carrier jig 1 is collected and managed in the computer 5 with the 1cRT, and is analyzed using various analysis programs. ] Evaluate yield factors such as working conditions and consider countermeasures.

As described above, according to this embodiment, firstly, it is possible to automate work condition setting instructions and performance collection using a wafer carrier jig for searching for optimal work conditions, vapor-free equipment management notebooks, etc., and electronic media such as work performance records. In addition to real-time collection and management of data for failure analysis, it is possible to reduce cracks and chips. Second, by decentralizing data management by managing the identification information of each wafer in the wafer carrier jig, work conditions for each process, and work performance data, data exchange with the host system can be minimized, improving system responsiveness. This makes it possible to improve scalability and automate work. 8
In g3, speed up the management of experiments for searching for high-yield, multi-work conditions, reduce the number of man-hours required for managing experiment data, reduce manual errors, and eliminate sources of dust and dust by preventing experiment work instructions and staff from entering the site. can be reduced. Fourth, it is possible to establish a production system for a wide variety of wafers by managing each pellet.

Various effects can be obtained by automating work management for each wafer.

〔Effect of the invention〕

As described above, according to the wafer management device for searching for optimum working conditions of the present invention, the working conditions and work performance data are recorded in the processor built in the wafer carrier jig for searching for optimum working conditions, and the type and model of each wafer and each pellet are identified. It is possible to automate and speed up the collection and management of fine-grained work results for each process and process.

[Brief explanation of drawings]

# is a conceptual diagram showing an embodiment of a wafer management device for searching for optimal working conditions according to the present invention. DESCRIPTION OF SYMBOLS 1... Optimum working condition purple detector key r') jig, 2... Display element with touch panel, 3... Processor, 4... Information input/output terminal, 5... CRT Calculator with.

Claims (1)

[Claims] The wafer carrier jig used for managing single wafers and transporting them between processes in the processing process of semiconductor memory devices has a built-in processor with a display element that can store and communicate, and provides identification information and product model name of single wafers. and a wafer carrier jig for searching for optimal working conditions that can input and output the process sequence (work procedure) and working conditions of the wafer, as well as the work date, operator name, equipment type name, equipment status, and work results for each process;
For searching for optimal working conditions, which consists of a computer that collects and organizes the data stored in these jigs, searches for and evaluates optimal working conditions, and, if necessary, drafts, instructs, and evaluates experimental plans for the working conditions for the search. Wafer management equipment.