JPS62168668A - Ic holder - Google Patents

Abstract

PURPOSE:To improve the work efficiency by providing a cover plate having many through-holes freely attachably and detachably on a lattice-shaped bottom frame, and also, inserting and holding many ICs between the cover plate and the bottom frame. CONSTITUTION:A base material of an IC holder 10 is all made of metallic titanium, and a bottom frame 43 is formed by erecting vertical and horizontal bottom cleats 42a, 42b on the bottom face of a plate frame 41. Also, on the upper face of the bottom frame 43 of placed part of an IC 9, four pieces of projections 46 are provided in a square shape, and also, a cover plate 44 provided with many through-holes is fixed freely attachably and detachably. By this mechanism, each IC 9 which has been placed on the upper face of the bottom frame 43 is inserted and held, and fixed between the bottom frame 43 and the projection 46 by a pressure body 49 which has been energized by a spring 48. Accordingly, many ICs 9 which have been loaded on the holder 10 are dispersed by holding mutually a prescribed interval, therefore, even in case of the IC 9 which has provided a terminal on four peripheral parts, the work is automated, and the work efficiency can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application This invention relates to an IC holder for use in IC terminal soldering work, etc.

= 1 - (b) Conventional technology Conventionally, IC terminals have been used to prevent poor continuity due to oxidation on the surface of IC terminals, to improve the contact between the terminals and sockets, and to improve the connection between the terminals and wiring, etc. In order to facilitate soldering, a so-called soldering process is performed in which a solder film is applied to the surface of an IC terminal.

In this soldering process, the melted solder is
A method is used in which IC terminals that have been pre-treated such as pickling are immersed to adhere a solder film, and the soldering process is completed after post-treatment such as washing with water.

In this series of work, a holder was devised to process a large number of ICs at once (Utility Model Application No. 58-99835).
＞The holder consists of an IC support device consisting of a large number of filaments inside a substantially rectangular plate frame, and a large number of ICs are inserted through IC insertion holes opened in the side wall of the plate frame on the end side of the filaments. A large number of ICs are fixed inside the plate frame.

(c) Problems that the invention seeks to solveHowever,
This holder is configured so that the IC is inserted through the IC insertion hole in the side wall, so it can be used for ICs with terminals only on the opposite side edges of the IC.
In the case of an IC in which a) is arranged on the four circumferential side edges of the IC, (the 12th
(See figure) IC terminals inserted through the same insertion hole are in close contact with adjacent IC terminals, and the terminals are soldered to each other, making them unusable.
C automatic loading was also impossible.

(d) Means for solving the problem In this invention, a plurality of substantially bar-shaped vertical and horizontal bottom bars are installed on the bottom surface of a rectangular plate frame with vertical sides parallel to each other to form a substantially lattice-shaped bottom frame. A cover plate with a number of through holes is removably fixed inside the plate frame at a position above the bottom frame, and a number of ICs are sandwiched and fixed between the bottom surface of the cover plate and the top surface of the bottom frame. The present invention provides an IC holder comprising the following configurations.

(E) Effects and Effects According to this invention, since the lid plate for the IC that fixes the IC is removable, the lid plate is removed and the IC is inserted from above.
＼ By placing the IC in a predetermined position on the bottom frame of the router, and then fixing the cover plate and fixing the IC with a pressing body, a large number of ICs can be placed in a discrete state with a predetermined interval maintained on the phase H. Since it can be fixed to the same holder, even if the IC has terminals arranged around all four sides, the soldering work can be carried out without any problem. Since the IC is supported by the frame, the cleaning liquid and molten solder can pass through easily, ensuring reliable work and preventing the occurrence of defective products.The holder can also be used to process a large number of ICs at once. This has the effect of increasing work efficiency.

Furthermore, by using the IC holder of the present invention, it is also possible to automatically load ICs into the holder.

Example) Prior to explaining the IC holder according to the present invention, an IC soldering process using the same holder and its apparatus will be explained.

Figure 1 shows the terminal (9a) of an integrated circuit (hereinafter referred to as IC).
FIG. 2 is a block diagram showing the steps of an apparatus for welding a solder film to a semiconductor device;
Pretreatment step (2) of washing, drying, and preheating the rc (9)
), then immerse it in a molten solder bath to connect the TO(9) terminal (
Solder dip step (3) to solder the terminal (9a) of 9a), then wash the soldered rc (9),
Drying post-treatment step (4), and each step (1) (2) (
3) Pass the holder (1) loaded with IC (9) between (4).
The main body is composed of a conveyor (5) for conveying 0), and the auxiliary equipment is for each process (1) (2) (
3) A control system w (6) for (4) and the conveyor (5), water absorption, oil supply, etc. is attached.

That is, as shown in FIGS. 2, 3, and 4, the case mounting table (12) is mounted on a substantially frame-shaped pedestal (11) with a pivot (13).
), the tip (12a) of the probe (12) is pivoted downwardly, and the same operation is performed by the expansion and contraction of the air cylinder (14). In the half part, a large number of rectangular grooves (15) are formed in the longitudinal direction of the interrogator (12) with a predetermined gap between them, and an IC case (8) is fitted into each of the circumferential grooves (15). Place it in the same case (
8), and a pair of front and rear rails (16) are installed along the front and rear edges on the left half of the inquiry (12).
An air cylinder (
18), erect a sliding platform (17) that can slide left and right,
A press plate (19) is provided on the bottom of the inquiry (17), and
An air cylinder (20) is interposed between 7) and the plate (19) to enable the presser plate (19) to move up and down.

On the left side of the case mounting table (12), a boulder fixing device 21) is installed at a predetermined interval.
21) is connected to the transport device (22), and the device (21) is connected to the transport device (22).
The IC (9) is mounted on the holder (10) placed on the IC (21) and transported to the pre-processing device (not shown) on the left side.

An equipment device (7) is installed at -[-h of the tip (12a) of the case mounting table (12) (see Figures 5 and 6), and is mounted on the top of the machine frame (11) in the left and right direction. The rail (23) of the device (7) is mounted on the rail (23), and the base (24) of the device (7) is connected to the groove of the tip (12a) of the case mounting table.
It is supported slidably from side to side by the operation of the J cylinder (25) between the ten tabs of the holder fixed positioning device (21), and is further supported via the T cylinder (26) erected on the same base (24). A horizontal substantially rectangular substrate (27) is vertically movable with the C part recessed, and supports (28) are provided at the four corners of the substrate (27).
) is installed in the left-right direction and supports a large number of sliding bodies (30) so as to be able to slide left and right through front and rear rails (two). Right and left rails (two) are inserted through the rail insertion holes (30a) drilled at the upper and lower ends, respectively, and an adsorbent (31) is connected to the lower end of the host body (30). The suction bodies (31) are plate-shaped with a substantially comb-shaped lower part, and are installed between the front and rear sliding bodies (30) facing in the λj direction.
A suction cup (32) is connected to the lower end of each comb shape. .

A large number of sliding bodies (33) arranged on the above rail (29)
In this case, a perforated part (34) is recessed in the side surface of the sliding body (30), and the back surface of the perforated part (34) is connected to the adjacent sliding body (30).
It is overlapped with the back side of the stepped hole part (34a) in a), and the port
-(35) Through the thread (,), a predetermined clearance (d) is maintained at the tip of the same port h (35), and -CJ-1-(36) is screwed, and in this way all Adjacent sliding body (30)
is connected to the phase U, and the 1st cylinder (37) is connected to the sliding body (30) on the furthest tour side, and when the cylinder (37) is retracted, that is, the telescopic mechanism (33) is retracted, (See Figure 7), each sliding body <aO> approaches each other until the left and right side surfaces contact each other, and when the cylinder (37) is extended, that is, the mechanism (33) is extended one step (see Fig. 8). (see figure), each sliding body (30) - the above play (d)
(It is configured so that it is spaced apart. Therefore,
The suction body (31) and suction cup (32) connected to the lower end of each sliding body (30) can also be moved toward and away from each other according to the usage of the clearance (d).

Further, the suction cups (32) are each connected to a vacuum generator (not shown) via a control valve (not shown) via an intake pipe (32a).

In addition, in the figure (3rd) is the guide rod for regulating the 1-inoperation of the board (27), and (39) is the IC slide bearing interposed between the sliding body (30) and the rail (29). show.

In addition, when the telescoping mechanism (33) is contracted, the left and right protruding parts of the slide bearing (39) from the side surfaces of the sliding body (30) are located at the front and rear sides of the telescoping mechanism (33) so that they do not interfere with each other. The rails (2) each consist of 4 rails on the top and bottom, and the odd numbered sliding body (30a) counting from the left
are supported by the first and third rails (29) from the top via the same bearings (39), and the even-numbered sliding bodies (30
) is supported by the same bearing (39) on the second and fourth rails (29) from ``-'', and the adjacent sliding body (3
1'F facing the slide bearings (3) of 0)!
Four parts (40) are provided on the left and right sides of the moving body (30) to avoid interference with the bearing (39).
It is possible to cover the left and right pips of each suction cup (32) as small as possible.

The holder (10) of the present invention is entirely made of metallic titanium material, and as shown in FIGS. 9 and 10,
A plate frame (41) having a rectangular shape between the upper and lower surfaces is constructed of plate materials,
The vertical and horizontal bottom bars <42a) (42b) are attached to the bottom of the same plate frame <41).
) is constructed to form a bottom frame (43) in the shape of a substantially lattice shape, and a large number of ICs (9) are mounted on the upper surface of the bottom frame (43).
7), the ICs (9) are arranged in a rectangular manner on the top surface of the bottom frame (43) where the IC (9) is placed, with predetermined gaps maintained in the front and rear and left and right directions. The bottom surface of the IC (9) placed thereon is separated from the top surface of the bottom frame (43) by providing two protrusions (46).

Moreover, inside the board frame (41) and above the bottom frame (43),
A substantially rectangular cover plate (44) is detachably arranged, and a plurality of through holes (47) are inserted into the cover plate (44) so as to be slidable up and down, so that an intermittent pressure rest (49) can be inserted. is urged downward by a spring (48).

Furthermore, a lock Rfiff (50) is interposed between the side edge of the lid plate (44) and the inner surface of the plate frame (41), and the plate frame (41) is closed by operating the device (50). ) against the cover plate (44)
is fixed and detachable, and when the advisory board (44) is fixed, each IC (9) is clamped and fixed between the pressing body (49) and the protrusion (46) of the bottom frame (43). are doing.

Further, on the side wall of the plate frame (41), an engaging ear portion (45) formed by bending the upper end of the side wall outward, and a lower ear portion (45a) protruding from the side wall at a position below the engaging ear portion (45). The holder (10) is engaged with the conveying device (22) at each ear (45) < 4.5a) and conveyed.
Each IC (9) fixed to 10) is connected to the master worker 1'i before and after
! (2) Subject to the punishments in (3) and (4).

In addition, when removing the rc (9) from the boulder (10), each IC (9) can be easily taken out by releasing the locking device (50> and removing the cover plate (44).

The embodiment of this invention is constructed as described above, and the IC
When soldering the terminals, the I
C case (8) is manually fitted and fixed into the rectangular groove 15) of the case mounting table (12), the air cylinder (14) is retracted, and the mounting table tip (12a) is rotated downward. Then, the IC (9) in the IC case (8) is slid down to the tip (12a) of the gap (12) by gravity. 1 At this time,
The air cylinder (20) is extended and the press plate (19) is lowered to prevent the IC (9) from jumping out.

Next, return the case mounting table (12) to the horizontal state,
Move the holding plate (1) upward, retract the air cylinder (1B), move the sliding table (17) to the right, and press the top of the IC (9) taken out from the IC case (8). Open.

Next, the air cylinder (26) is extended and the loading device (
7), the base (24) is lowered, and the suction cup (32) of the adsorbent (31) is attracted to the upper surface of the IC (9), and then the base (24) is returned to the upper position.

Next, the air cylinder (25) is extended to open the loading mechanism (
7) to the left holder fixed position device 21) and extend the air cylinder (37) of the telescopic mechanism (33) to expand the same mechanism (33) and attach it to the suction cup (32). The left and right distance between the ICs (9) which are attracted by the ICs (9) is made to be the clearance (d).

The operation of the expansion/contraction mechanism (33) causes the ICs (9), which are in close contact with each other immediately after being taken out of the IC case (8), to be in a discrete state with a predetermined interval maintained therebetween.

Next, the air cylinder (26) is operated again to remove the substrate (
27) is lowered and the IC (9) on the top surface of the bottom frame (43) of the holder 10) placed on the holder fixing device 21) is lowered.
) The IC <9> is placed in the mounting position, the suction of the suction cup (32) is released, and the IC (9) is placed in the above position.

Each of the above air cylinders (14) (18) (20>(25)
The operations of >(26>(37), suction cup (32), etc.) are sequence-controlled and automatically performed by the control device (6).

Next, manually place the lid plate (44) on the IC (9)-F and operate the locking device (50) to close the lid (44).
is fixed to the holder (10), and each IC <9> is fixed to the bottom plate (43) of the boulder (10) using a spring 48) and a pressing body (49).

A large number of ICs loaded in the holder (10) as described above
is transported by the transport device @ (22) and processed in each process (2) (3).
(4,), and each IC (9) is connected to the projection (46) of the bottom plate (43) of the holder (10) and the suppressor (4,).
9), and each rc (9) is separated at a predetermined interval, so cleaning, drying, etc. in pre-treatment and post-treatment steps (2) and (4) are effective. In particular, even for ICs with terminals arranged on the four circumferential edges, in the solder dipping process (3), t) No solder bridging occurs, and high-quality solder frying work is performed. In particular, the complicated and labor-intensive manual process of arranging ICs at specified intervals, which was a bottleneck in conventional soldering work, is now automatically performed, greatly increasing work efficiency. be. In addition, when removing the IC (9) from the holder (1Q), use the locking device (5).
0) and remove the lid (44>), and the holder (10) from which the IC (9) has been removed can be reused.

[Brief explanation of drawings]

FIG. 1 is a dimensional block diagram showing the steps of the soldering device. FIG. 2 is a plan view of the IC loading device according to the present invention. The figure is a sectional view of the loading device (FIG. 4 I-I cross section). FIG. 6 is a side view of the loading device. FIG. FIG. 8 is a sectional side view showing the expanded state of the mechanism. FIG. 9 is a perspective view of the holder. FIG. 10 is a sectional view of the same. FIG. 11 is a perspective view of the IC case. vj1, Plan view of IC (9): IC (41): Board frame <42a ) (/12+) ) : III horizontal bottom crosspiece (
/13): Bottom frame (4/I); Lid plate (47>: Through hole Fig. 2' 01 0A-7 Kuri-Sunken 7 Unpublished publication date, U32-1f'; 8G6B (6) Fig. 4

Claims (1)

[Claims] 1) A substantially lattice-shaped bottom frame (43) is formed by installing a large number of substantially rod-shaped vertical and horizontal bottom beams (42a) (42b) on the bottom surface of a substantially rectangular plate frame (41) with open upper and lower surfaces, and a through-hole (47) A lid plate (44) having a plurality of holes is removably fixed at a position above the bottom frame (43) inside the plate frame (41), and the lower surface of the lid plate (44) and the bottom frame (43) Between the top surface and the IC
(9) An IC holder configured to clamp and fix a large number of ICs.