JPS6216702B2 - - Google Patents
Info
- Publication number
- JPS6216702B2 JPS6216702B2 JP5159484A JP5159484A JPS6216702B2 JP S6216702 B2 JPS6216702 B2 JP S6216702B2 JP 5159484 A JP5159484 A JP 5159484A JP 5159484 A JP5159484 A JP 5159484A JP S6216702 B2 JPS6216702 B2 JP S6216702B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- weight
- film
- adhesive layer
- surface protective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012790 adhesive layer Substances 0.000 claims description 30
- 239000011241 protective layer Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 24
- 239000000178 monomer Substances 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 239000002131 composite material Substances 0.000 claims description 22
- 229920001577 copolymer Polymers 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 9
- 125000000524 functional group Chemical group 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 6
- 229920002554 vinyl polymer Polymers 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 5
- 239000003504 photosensitizing agent Substances 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 2
- 229940125898 compound 5 Drugs 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 14
- -1 vinyl compound Chemical class 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 229920006243 acrylic copolymer Polymers 0.000 description 5
- 239000000839 emulsion Substances 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- 230000004913 activation Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000012943 hotmelt Substances 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000005670 ethenylalkyl group Chemical group 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 150000004291 polyenes Chemical class 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
- WROUWQQRXUBECT-UHFFFAOYSA-M 2-ethylacrylate Chemical compound CCC(=C)C([O-])=O WROUWQQRXUBECT-UHFFFAOYSA-M 0.000 description 1
- DIVXVZXROTWKIH-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpropan-1-one Chemical compound C=1C=CC=CC=1C(O)(C)C(=O)C1=CC=CC=C1 DIVXVZXROTWKIH-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical group OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 description 1
- BEUGBYXJXMVRFO-UHFFFAOYSA-N [4-(dimethylamino)phenyl]-phenylmethanone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=CC=C1 BEUGBYXJXMVRFO-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229920006271 aliphatic hydrocarbon resin Polymers 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- ZLFVRXUOSPRRKQ-UHFFFAOYSA-N chembl2138372 Chemical compound [O-][N+](=O)C1=CC(C)=CC=C1N=NC1=C(O)C=CC2=CC=CC=C12 ZLFVRXUOSPRRKQ-UHFFFAOYSA-N 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- UTSYWKJYFPPRAP-UHFFFAOYSA-N n-(butoxymethyl)prop-2-enamide Chemical compound CCCCOCNC(=O)C=C UTSYWKJYFPPRAP-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 239000004250 tert-Butylhydroquinone Substances 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 229960002447 thiram Drugs 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Printing Methods (AREA)
Description
この発明は被着体面に表面保護層を形成する方
法に関するものであつて、さらに詳しくは金属
板、ガラス板、木板、化粧板、プラスチツク板の
如き板状物品などからなる被着体の表面が損傷す
るのを半永久的に防止するための表面保護層を形
成する方法を提供するものである。
従来、板状物品などからなる被着体の表面保護
は、加工前の段階においては表面保護粘着フイル
ムを仮着しておき、加工後においては塗料などを
塗設することによつて行われているのが一般的で
ある。
これらの一連の工程は、板状物品への前記フイ
ルムの貼り付けから始まり、次いで曲げ、絞り、
打抜きなどの加工を行つて、さらにフイルムの剥
離、表面洗浄、塗装、乾燥という順序からなつて
おり、煩雑であるばかりか、洗浄液や塗料には多
量の有機溶剤が含まれているために、安全および
衛生上の種々の問題があつた。
従つてこの発明の第1の目的は、加工前の板状
物品の表面保護から加工後の表面保護までを簡単
に行える表面保護層の形成方法を提供することに
ある。
この発明の第2の目的は、施工時に有機溶剤を
使用することなく、簡単な操作で表面保護層を形
成する方法を提供することにある。
すなわち、この発明は、自己支持性シート(ま
たはフイルム)およびこのシート(またはフイル
ム)上に設けられた熱賦活性と光硬化性とを備え
た接着剤層からなる複合シート(またはフイル
ム)を被着体面上にこの接着剤層を介して加熱圧
着して貼り合わせたのち光照射してこの接着剤層
を硬化させ、次いで前記の自己支持性シート(ま
たはフイルム)のみを剥離して前記の被着体面上
に重合硬化物からなる表面保護層を形成させる表
面保護層形成方法であつて、前記の接着剤層がエ
チレン性二重結合を有する単量体と官能基を有す
る共重合性単量体との共重合物100重量部、融点
が50℃以上である熱溶融性樹脂30〜200重量部、
光反応性ビニル化合物5〜300重量部および光増
感剤0.05〜30重量部を含む熱賦活性と光硬化性を
備えた接着剤組成物からなることを特徴とする表
面保護層形成方法に係るものである。
上記の複合シート(またはフイルム)における
接着剤層は、加熱により急激に溶融ないしは軟化
して通常の感圧性接着剤と同程度ないしはそれ以
下の粘度となる熱賦活性と光照射により硬化ない
しは三次元構造化する光硬化性とを備えているた
め、上記の複合シート(またはフイルム)は被着
体に対して加熱圧着された際に接着剤層が十分な
濡れ性を発揮して良好に密着し、光照射を行えば
接着剤層はもはや初基の熱賦活性が失われ常温下
ではもちろん高温下においても良好な密着性を有
する硬化物となる。
上記の複合シートを用いるこの発明の方法によ
れば、加工前および加工中の板状物品などからな
る被着体の表面の損傷は、複合シートを加熱圧着
して貼り付けておくことによつて防止され、加工
後は光照射して上記の熱賦活性と光硬化性とを備
えた接着剤層を重合硬化して形成してなる密着性
良好な表面保護層により保護されるので、被着体
表面が損傷されることがない。つまり、この発明
の方法によれば、加工前の表面保護から加工後の
表面保護までを行える表面保護層を複合シート
(またはフイルム)の貼り付け、光照射、自己支
持性シート(またはフイルム)の剥離という簡単
な作業によつて形成することができる。
また、この発明の方法によれば、上記の複合シ
ート(またはフイルム)には有機溶剤が含まれ
ず、しかも上記の一連の作業時にも有機溶剤を使
用しないので安全衛生上の問題がない。
この発明の方法において用いる複合シート(ま
たはフイルム)を構成する自己支持性シート(ま
たはフイルム)としては、通常、200〜500nmの
波長の光の透過率が約10%以上のプラスチツクシ
ート(またはフイルム)を使用すればよく、この
シート(またはフイルム)の素材としては、ポリ
塩化ビニル、ポリオレフイン(エチレン―酢酸ビ
ニル共重合体およびそのケン化物を含む)、ポリ
エステルなどが挙げられる。なお、このシート
(またはフイルム)の厚みは通常10〜300μmとす
るのがよい。
この自己支持性シート(またはフイルム)上に
設けられた熱賦活性と光硬化性とを備えた接着剤
層は上記の各成分を含む接着剤組成物を用いて形
成される。
この接着剤組成物における共重合物を得るため
に用いるエチレン性二重結合を有する単量体の好
適な具体例としては、アルキル基の炭素数が1〜
12個の(メタ)アクリル酸アルキルエステル、ア
ルキル基の炭素数が1〜12個のビニルアルキルエ
ステル、アルキル基の炭素数が1〜12個のビニル
アルキルエーテル、ジメチルアミノエチル(メ
タ)アクリレート、(メタ)アクリロニトリル、
ビニルピリジンなどの1種もしくは2種以上が挙
げられる。
これら単量体と共重合させる官能基を有する共
重合性単量体としては、官能基としてカルボキシ
ル基、ヒドロキシル基、グリシジル基、アミド基
などを有する共重合性単量体が挙げられ、具体例
としては、(メタ)アクリル酸、マレイン酸、イ
タコン酸、クロトン酸、2―ヒドロキシエチル
(メタ)アクリレート、2―ヒドロキシプロピル
(メタ)アクリレート、グリシジルメタクリレー
ト、(メタ)アクリルアミド、N―メチロール
(メタ)アクリルアミドなどの1種もしくは2種
以上が挙げられる。これら官能基を有する共重合
性単量体は金属板などの被着体に対するなじみを
よくする成分であり、また後述する共重合物中に
光反応性の重合性炭素―炭素二重結合を付与する
のに好都合なものである。
このようなエチレン性二重結合を有する単量体
と官能基を有する共重合性単量体とは、通常では
前者の単量体100重量部に対して後者の単量体
0.01〜15重量部を配合し、エマルジヨン重合法、
溶液重合法、塊状重合法などの種々の既知重合法
にて共重合させることにより、好適には平均分子
量約1万以上の共重合物とする。
上記共重合物は接着剤層中において複合シート
(またはフイルム)の被着体に対する加熱圧着時
に所望の粘着性と光硬化後の接着性を付与する成
分であるが、この発明ではこの共重合物中に光反
応性の重合性炭素―炭素二重結合を1分子中に少
なくとも平均1個導入することにより、接着剤層
の光硬化特性をさらに向上させることができる。
その手段としては、たとえば上記共重合物中に存
在するカルボキシル基、ヒドロキシル基、グリシ
ジル基などの官能基と直接的もしくは間接的に反
応し得る基を有する重合性炭素―炭素二重結合を
含む光反応性単量体を、前記共重合物100重量部
に対して0.01〜15重量部反応させて共重合物変成
体とすればよい。このような光反応性単量体とし
ては、たとえばヒドロキシル基と反応しうる単量
体としてN―メチロールアクリルアミド、N―ブ
トキシメチルアクリルアミド、(メタ)アクリル
酸クロライド、(メタ)アクリル酸ブロマイドな
ど、カルボキシル基やヒドロキシル基と反応しう
る単量体としてグリシジル(メタ)アクリレート
などが挙げられる。
共重合物中に光反応性の重合性炭素―炭素二重
結合を導入する他の手段としては、前記共重合物
を得る際に共重合モノマーとしてエチレン性二重
結合を2個以上有するポリエンモノマーを用いる
方法があり、上記ポリエンモノマーとしては、た
とえばポリエチレングリコールジ(メタ)アクリ
レート、ペンタエリスリトールトリ(メタ)アク
リレートなどが挙げられる。
接着剤組成物における熱溶融性樹脂は、複合シ
ート(またはフイルム)を被着体に対して加熱圧
着させる際に接着剤層に十分な熱接着性と被着物
に対する濡れ性を付与すると共に光硬化後の接着
性向上にも貢献する成分であり、蓉点が50℃以
上、好ましくは70〜150℃の範囲にあり、前記共
重合物との相溶性に優れるものが望ましく、とく
に前記共重合物中の光反応性の重合性炭素―炭素
二重結合に対して光増感剤を介して反応し得る光
反応性の重合性炭素―炭素二重結合を分子中に少
なくとも1個有するものがより好適である。
このような熱溶融性樹脂の好適な具体例として
は、キシレン樹脂、ノボラツクまたはレゾール系
フエノール樹脂、ロジン、ロジン変成フエノール
樹脂、水添ロジン、水添ロジンエステル、テルペ
ン変成フエノール樹脂、無水マレイン酸変成フエ
ノール樹脂、クマロンインデン樹脂、テルペン系
樹脂、芳香族系石油樹脂、スチレン系樹脂、脂肪
族系炭化水素樹脂などが挙げられ、2種以上を併
用しても差し支えない。
これらの熱溶融性樹脂は、前記共重合物100重
量部に対して30〜200重量部、好ましくは50〜150
重量部の範囲で配合するのがよい。この配合量が
30重量部より少ないと加熱時の接着剤層の溶融粘
度が高くなつて被着体に対する濡れ性が不十分と
なり、光硬化後の接着力も低下し、また200重量
部を越えると前記共重合物の接着剤層中における
比率が過少となつてその機能が十分に発揮されな
い。
接着剤組成物における光反応性ビニル化合物
は、光照射により活性化されて光重合反応を行う
重合性炭素―炭素二重結合としてのメタクリロイ
ル基またはアクリロイル基を少なくとも1個、好
ましくは2個以上有する多官能性のものであり、
たとえば1・4―ブチレングリコールジ(メタ)
アクリレート、1・6―ヘキサングリコールジ
(メタ)アクリレート、ネオペンチルグリコール
ジ(メタ)アクリレート、ポリエチレングリコー
ルジ(メタ)アクリレート、ペンタエリスリトー
ルトリ(メタ)アクリレート、トリメチロールプ
ロパントリ(メタ)アクリレート、テトラメチロ
ールメタンテトラ(メタ)アクリレートなどの単
量体またはエポキシアクリレート、ウレタン変性
アクリレート、オリゴエステルアクリレートなど
のオリゴマーなどが挙げられ、これらは必要に応
じて2種以上を併用してもよい。
この光反応性ビニル化合物は前記共重合物100
重量部に対して5〜300重量部、好ましくは10〜
200重量部の範囲で配合するのがよく、この配合
量が5重量部より少ないと光照射による接着剤層
の硬化度が不足して凝集力および接着力が低下
し、逆に300重量部を越えると接着剤層が硬くな
り過ぎてやはり接着力の低下を招く。
接着剤組成物に含ませる光増感剤としては前記
光反応性ビニル化合物の光重合反応を促進させる
ものであればよく、その具体例としては、ベンゾ
イン、ベンゾインメチルエーテル、ベンゾインエ
チルエーテル、ベンゾインイソプロピルエーテ
ル、α―メチルベンゾインなどのベンゾイン類、
1―クロロアントラキノン、2―クロロアントラ
キノンなどのアントラキノン類、ベンゾフエノ
ン、p―クロロベンゾフエノン、p―ジメチルア
ミノベンゾフエノンなどのベンゾフエノン類、ジ
フエニルジスルフイド、テトラメチルチウラムジ
スルフイドなどの含イオウ化合物類などを挙げる
ことができる。
このような光増感剤は前記共重合物100重量部
に対して0.05〜30重量部の範囲で使用するのがよ
く、0.05重量部より少ないと光重合反応の促進効
果が不足し、また30重量部より多くなるとこの促
進効果のより以上の増大が望めず経済的にも不利
である。
接着剤組成物には上記の各成分が必須成分とし
て含まれ、さらに目的に応じて他の配合剤を適量
添加することができる。配合例の例としては、製
造中の熱重合や保存中の反応を防止する重合禁止
剤例えばハイドロキノン、ハイドロキノンモノメ
チルエーテル、tert―ブチルカテコール、p―ベ
ンゾキノン、2・5―tert―ブチルハイドロキノ
ン、フエノチアジンなどを前記の光反応性ビニル
化合物に対して5〜1000ppm添加してもよい。
また、着色または装飾などを目的とする例えば亜
鉛華、黄鉛、ベンガラなどの顔料、トルイジンレ
ツド、フタロシアニンブルー、フタロシアニング
リーンなどの染料、その他金属粉、ガラスビー
ズ、ガラス粉末、ガラスフレークなどを添加して
もよい。
上記のように構成された接着剤組成物を用いて
熱賦活性と光硬化性とを備えた接着剤層を形成す
るには、この組成物を上記の自己支持性シート
(またはフイルム)の片面に約1〜100μmの厚み
となるように塗設または転着すればよい。
このように構成された自己支持性シート(また
はフイルム)と熱賦活性と光硬化性とを備えた接
着剤層とからなる複合シート(またはフイルム)
は、金属板、ガラス板、木板、化粧板、プラスチ
ツク板などからなる板状物品などの被着体面に、
前記の接着剤層を介して、この接着剤層が粗面状
態の被着体表面に対しても十分な濡れ性を発揮す
る粘度となるように溶融または軟化しうる温度、
通常は50〜180℃程度に加熱して圧着されること
により密着性良好に接着する。
前記接着剤層を重合硬化させるには、高圧水銀
灯、超高圧水銀灯、メタルハライドランプ、カー
ボンアーク灯、キセノン灯などの光源を用いて
0.3秒以上、好ましくは3秒以上光照射を行う。
なお、光照射の時期は目的により被着体の加工前
でも後でもよい。
光照射後、自己支持性シート(またはフイル
ム)のみを剥離することにより、被着体面には重
合硬化物からなる表面保護層が形成される。
以上のように、この発明の方法によれば、被着
体面の表面保護に用いた複合シート(またはフイ
ルム)に光照射し、自己支持性シート(またはフ
イルム)を剥すことによつて、半永久的に表面を
保護しうる表面保護層を形成することができる。
もとより、この発明の方法は被着体の加工などに
関係なく、単に物品面に表面保護層を形成するだ
けのためにも使用できる。
次にこの発明の実施例を示す。以下に部とある
のは重量部を意味する。
実施例 1
2―エチルヘキシルアクリレート 50部
メチルメタクリレート 50部
メタクリル酸 6部
ベンゾイルパーオキサイド 0.2部
酢酸エチル 100部
上記各成分の混合物を1のフラスコに仕込
み、撹拌しながら反応系の温度を65℃に維持して
約15時間重合させたのち、残存モノマーを完全に
重合させるために反応系を80℃に昇温して2時間
保持したところ、重量平均分子量7.0×105(GPC
による)のアクリル系共重合物を含む重合生成物
を得た。
この重合生成物にその固形分100部に対して、
ロジンエステル(融点60℃) 150部
ペンタエリスリトールトリメタクリレート 40部
ベンゾインイソプロピルエーテル 3部
ハイドロキノンモノメチルエーテル 0.01部
酢酸エチル 300部
の各成分を配合して均一に混合し、熱賦活性およ
び光硬化性を有する接着剤組成物を含む溶液を得
た。この組成物溶液を厚さ60μmのポリプロピレ
ンシートの片面に乾燥後の厚みが20μmとなるよ
うに塗布し、80℃で5分間乾燥して熱賦活性およ
び光硬化性を有する接着剤層を形成し、複合シー
トを得た。
この複合シートをBA仕上げステンレス板
SUS304に前記の接着剤層を介し100℃で加熱圧着
して貼り付けたのち、高圧水銀灯(80W/cm/1
灯)で10cmの距離から約5秒間紫外線照射して前
記の接着剤層を硬化させ、次いでポリプロピレン
シートのみを剥離して前記のステンレス板上に重
合硬化物からなる表面保護層を形成した。
実施例 2
エチルアクリレート 85部
メチルメタクリレート 10部
アクリル酸 5部
過硫酸アンモニウム 0.2部
ドデシルベンゼンスルホン酸ソーダ 7部
イオン交換水 100部
上記各成分の混合物を1のフラスコに仕込
み、撹拌しながら約30分間窒素置換を行つたの
ち、65℃の加熱下で2時間重合させ、重合終了後
に反応系を75℃まで昇温して1時間熟成し、平均
粒径0.09μm、PH約3のアクリル系共重合物エマ
ルジヨンを得た。このアクリル系共重合物の重量
平均分子量は約80万であつた。
つぎにこのエマルジヨンを撹拌しながら、その
アクリル系共重合物固型分100部に対し、
テルペン変性フエノール樹脂エマルジヨン(融
点75℃、固型分50重量%) 200部
トリメチロールプロパントリメタクリレート
20部
ネオペンチルグリコールジアクリレート 25部
ベンゾインエチルエーテル 3.5部
ハイドロキノン 0.01部
イオン交換水 300部
の各成分を配合し、熱賦活性および光硬化性を有
する接着剤組成物を含むエマルジヨンを得た。こ
の組成物エマルジヨンを厚さ25μmのポリエステ
ルシートの片面に乾燥後の厚みが20μmとなるよ
うに塗布し、100℃で5分間乾燥させて複合シー
トを作製した。この複合シートを用いて実施例1
と同様にしてBA仕上げステンレス板SUS304上に
表面保護層を形成した。
実施例 3
実施例2における重合生成物にそのアクリル系
共重合物100部に対してグリシジルメタクリレー
ト3部およびトリエチルアミン0.5部を添加し、
70℃において5時間反応させ、前記の共重合物に
光反応性の重合性炭素―炭素二重結合を導入し
た。この反応生成物の固形分100部に対し、実施
例2に記載の各成分を配合し、以下実施例2と同
様にして複合シートを作製した。この複合シート
を用いて実施例1と同様にしてBA仕上げステン
レス板SUS304上に表面保護層を形成した。
上記実施例1〜3で得られた表面保護層につい
て鉛筆硬度、密着力を測定した結果を次表に示
す。なお、密着力については、被着体を銅板およ
びアクリル板として実施例1〜3と同様にして表
面保護層を形成した場合の値を併記した。
また、光照射前の複合シートの接着力(初期接
着力)および光照射後自己支持性シートを剥離す
る際の接着力(自己支持性シート剥離力)につい
て調べた結果も次表に併記した。
The present invention relates to a method for forming a surface protective layer on the surface of an adherend, and more specifically, the present invention relates to a method for forming a surface protective layer on the surface of an adherend, and more specifically, the present invention relates to a method for forming a surface protective layer on the surface of an adherend, and more specifically, the present invention relates to a method for forming a surface protective layer on the surface of an adherend. The present invention provides a method for forming a surface protective layer to semi-permanently prevent damage. Conventionally, the surface protection of adherends such as plate-shaped articles has been carried out by temporarily attaching a surface protective adhesive film before processing, and then applying paint etc. after processing. It is common for there to be. These series of steps begin with pasting the film onto a plate-shaped article, followed by bending, drawing, and
The process involves processing such as punching, followed by film peeling, surface cleaning, painting, and drying, which is not only complicated, but also requires safety because the cleaning fluid and paint contain large amounts of organic solvents. There were also various hygiene problems. Therefore, a first object of the present invention is to provide a method for forming a surface protective layer that can easily carry out the process from protecting the surface of a plate-shaped article before processing to protecting the surface after processing. A second object of the present invention is to provide a method for forming a surface protective layer by a simple operation without using an organic solvent during construction. That is, the present invention covers a composite sheet (or film) consisting of a self-supporting sheet (or film) and a heat-activatable and photocurable adhesive layer provided on the sheet (or film). After bonding with heat and pressure on the adherend surface via this adhesive layer, the adhesive layer is cured by irradiation with light, and then only the self-supporting sheet (or film) is peeled off to form the adhesive layer. A surface protective layer forming method for forming a surface protective layer made of a polymerized cured product on an adherend surface, the adhesive layer comprising a monomer having an ethylenic double bond and a copolymerizable monomer having a functional group. 100 parts by weight of a copolymer with the body, 30 to 200 parts by weight of a hot-melt resin with a melting point of 50°C or higher,
Relating to a method for forming a surface protective layer, comprising an adhesive composition with heat activation and photocurability, containing 5 to 300 parts by weight of a photoreactive vinyl compound and 0.05 to 30 parts by weight of a photosensitizer. It is something. The adhesive layer in the above composite sheet (or film) is rapidly melted or softened by heating to a viscosity comparable to or lower than that of ordinary pressure-sensitive adhesives, and is cured or three-dimensional by heat activation and light irradiation. Because it has photo-curable properties that create a structure, the adhesive layer exhibits sufficient wettability and adheres well when the composite sheet (or film) is heat-pressed onto an adherend. When irradiated with light, the adhesive layer loses its initial heat-activation activity and becomes a cured product that has good adhesion not only at room temperature but also at high temperatures. According to the method of the present invention using the above-mentioned composite sheet, damage to the surface of the adherend consisting of a plate-like article before and during processing can be prevented by heat-pressing and pasting the composite sheet. After processing, it is protected by a surface protective layer with good adhesion, which is formed by polymerizing and curing the above-mentioned heat-activated and photo-curable adhesive layer by irradiating it with light. No damage to the body surface. In other words, according to the method of the present invention, a surface protective layer that can perform from surface protection before processing to surface protection after processing is formed by pasting a composite sheet (or film), irradiating light, and forming a self-supporting sheet (or film). It can be formed by a simple process of peeling. Furthermore, according to the method of the present invention, the above-mentioned composite sheet (or film) does not contain any organic solvent, and furthermore, no organic solvent is used during the above-mentioned series of operations, so there are no health and safety problems. The self-supporting sheet (or film) constituting the composite sheet (or film) used in the method of this invention is usually a plastic sheet (or film) having a transmittance of about 10% or more for light with a wavelength of 200 to 500 nm. Materials for this sheet (or film) include polyvinyl chloride, polyolefin (including ethylene-vinyl acetate copolymer and saponified products thereof), and polyester. Note that the thickness of this sheet (or film) is usually preferably 10 to 300 μm. The heat-activatable and photocurable adhesive layer provided on the self-supporting sheet (or film) is formed using an adhesive composition containing the above-mentioned components. Preferred specific examples of the monomer having an ethylenic double bond used to obtain the copolymer in this adhesive composition include those in which the alkyl group has 1 to 1 carbon atoms.
12 (meth)acrylic acid alkyl esters, vinyl alkyl esters in which the alkyl group has 1 to 12 carbon atoms, vinyl alkyl ethers in which the alkyl group has 1 to 12 carbon atoms, dimethylaminoethyl (meth)acrylate, ( meta) acrylonitrile,
One or more types such as vinylpyridine may be used. Examples of copolymerizable monomers having functional groups to be copolymerized with these monomers include copolymerizable monomers having carboxyl groups, hydroxyl groups, glycidyl groups, amide groups, etc. as functional groups. Examples include (meth)acrylic acid, maleic acid, itaconic acid, crotonic acid, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, glycidyl methacrylate, (meth)acrylamide, N-methylol (meth) Examples include one or more of acrylamide and the like. These copolymerizable monomers with functional groups are components that improve compatibility with adherends such as metal plates, and also impart photoreactive polymerizable carbon-carbon double bonds to the copolymer described later. It is a convenient thing to do. A monomer having an ethylenic double bond and a copolymerizable monomer having a functional group are usually used in a ratio of 100 parts by weight of the former monomer to 100 parts by weight of the latter monomer.
Blending 0.01 to 15 parts by weight, emulsion polymerization method,
By copolymerizing by various known polymerization methods such as solution polymerization and bulk polymerization, a copolymer having an average molecular weight of about 10,000 or more is preferably obtained. The above-mentioned copolymer is a component in the adhesive layer that imparts desired tackiness and adhesion after photocuring when the composite sheet (or film) is bonded by heat and pressure to an adherend. By introducing at least one photoreactive polymerizable carbon-carbon double bond into each molecule on average, the photocuring properties of the adhesive layer can be further improved.
As a means for this, for example, light containing a polymerizable carbon-carbon double bond having a group that can react directly or indirectly with a functional group such as a carboxyl group, a hydroxyl group, or a glycidyl group present in the above-mentioned copolymer. A modified copolymer may be obtained by reacting 0.01 to 15 parts by weight of a reactive monomer with 100 parts by weight of the copolymer. Examples of such photoreactive monomers include monomers that can react with hydroxyl groups such as N-methylolacrylamide, N-butoxymethylacrylamide, (meth)acrylic acid chloride, (meth)acrylic acid bromide, etc. Glycidyl (meth)acrylate and the like are examples of monomers that can react with groups and hydroxyl groups. Another means of introducing a photoreactive polymerizable carbon-carbon double bond into a copolymer is to use a polyene monomer having two or more ethylenic double bonds as a copolymerizable monomer when obtaining the copolymer. Examples of the polyene monomer include polyethylene glycol di(meth)acrylate and pentaerythritol tri(meth)acrylate. The hot-melt resin in the adhesive composition provides the adhesive layer with sufficient thermal adhesion and wettability to the adherend when the composite sheet (or film) is heated and pressed onto the adherend, and is also photocurable. It is a component that also contributes to the subsequent improvement of adhesion, and it is desirable that it has a melting point of 50°C or higher, preferably in the range of 70 to 150°C, and that has excellent compatibility with the copolymer, especially the copolymer. Those having at least one photoreactive polymerizable carbon-carbon double bond in the molecule that can react with the photoreactive polymerizable carbon-carbon double bond in the molecule through a photosensitizer are preferred. suitable. Preferred specific examples of such hot-melt resins include xylene resin, novolak or resol type phenolic resin, rosin, rosin-modified phenolic resin, hydrogenated rosin, hydrogenated rosin ester, terpene-modified phenolic resin, and maleic anhydride-modified resin. Examples include phenolic resins, coumaron indene resins, terpene resins, aromatic petroleum resins, styrene resins, aliphatic hydrocarbon resins, and two or more types may be used in combination. These hot melt resins are used in an amount of 30 to 200 parts by weight, preferably 50 to 150 parts by weight, based on 100 parts by weight of the copolymer.
It is preferable to mix within the range of parts by weight. This amount is
If it is less than 30 parts by weight, the melt viscosity of the adhesive layer during heating will be high, resulting in insufficient wettability to the adherend, and the adhesive strength after photo-curing will be reduced, and if it exceeds 200 parts by weight, the copolymer will The proportion of the adhesive in the adhesive layer is too low, and its function is not fully exhibited. The photoreactive vinyl compound in the adhesive composition has at least one methacryloyl group or acryloyl group, preferably two or more, as a polymerizable carbon-carbon double bond that is activated by light irradiation to undergo a photopolymerization reaction. It is multifunctional,
For example, 1,4-butylene glycol di(meth)
Acrylate, 1,6-hexane glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, pentaerythritol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylol Examples include monomers such as methane tetra(meth)acrylate, and oligomers such as epoxy acrylate, urethane-modified acrylate, and oligoester acrylate, and two or more of these may be used in combination as necessary. This photoreactive vinyl compound is the copolymer 100
5 to 300 parts by weight, preferably 10 to 300 parts by weight
It is best to mix within the range of 200 parts by weight; if this amount is less than 5 parts by weight, the degree of curing of the adhesive layer by light irradiation will be insufficient and the cohesive force and adhesive strength will decrease; If it is exceeded, the adhesive layer becomes too hard, resulting in a decrease in adhesive strength. The photosensitizer to be included in the adhesive composition may be one that promotes the photopolymerization reaction of the photoreactive vinyl compound, and specific examples thereof include benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl. ether, benzoins such as α-methylbenzoin,
Contains anthraquinones such as 1-chloroanthraquinone and 2-chloroanthraquinone, benzophenones such as benzophenone, p-chlorobenzophenone, and p-dimethylaminobenzophenone, diphenyl disulfide, and tetramethylthiuram disulfide. Examples include sulfur compounds. Such photosensitizers are preferably used in the range of 0.05 to 30 parts by weight per 100 parts by weight of the copolymer; if it is less than 0.05 parts by weight, the effect of promoting the photopolymerization reaction is insufficient; If the amount exceeds 1 part by weight, the promoting effect cannot be further increased, which is economically disadvantageous. The adhesive composition contains each of the above-mentioned components as essential components, and appropriate amounts of other compounding agents can be added depending on the purpose. Examples of formulations include polymerization inhibitors that prevent thermal polymerization during production and reactions during storage, such as hydroquinone, hydroquinone monomethyl ether, tert-butylcatechol, p-benzoquinone, 2,5-tert-butylhydroquinone, and phenothiazine. may be added in an amount of 5 to 1000 ppm to the photoreactive vinyl compound.
Additionally, pigments such as zinc white, yellow lead, and red iron oxide, dyes such as toluidine red, phthalocyanine blue, and phthalocyanine green, and other metal powders, glass beads, glass powder, and glass flakes may be added for the purpose of coloring or decoration. You may. In order to form a heat-activatable and photocurable adhesive layer using the adhesive composition configured as described above, this composition is applied to one side of the self-supporting sheet (or film) as described above. It may be coated or transferred to a thickness of about 1 to 100 μm. A composite sheet (or film) consisting of a self-supporting sheet (or film) configured in this manner and an adhesive layer having heat activation and photocurability.
is applied to the adherend surface of plate-shaped articles made of metal plates, glass plates, wood plates, decorative plates, plastic plates, etc.
A temperature at which the adhesive layer can be melted or softened to a viscosity that exhibits sufficient wettability even on the rough surface of the adherend through the adhesive layer;
Usually, the material is heated to about 50 to 180°C and pressed to achieve good adhesion. To polymerize and harden the adhesive layer, a light source such as a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, a carbon arc lamp, a xenon lamp, etc. is used.
Light irradiation is performed for 0.3 seconds or more, preferably 3 seconds or more.
Note that the timing of the light irradiation may be before or after processing the adherend depending on the purpose. After irradiation with light, only the self-supporting sheet (or film) is peeled off to form a surface protective layer made of a polymerized cured product on the surface of the adherend. As described above, according to the method of the present invention, by irradiating the composite sheet (or film) used for surface protection of the adherend surface with light and peeling off the self-supporting sheet (or film), semi-permanent protection can be achieved. A surface protective layer capable of protecting the surface can be formed.
Of course, the method of the present invention can also be used simply to form a surface protective layer on the surface of an article, regardless of the processing of the adherend. Next, examples of this invention will be shown. Parts below mean parts by weight. Example 1 2-Ethylhexyl acrylate 50 parts Methyl methacrylate 50 parts Methacrylic acid 6 parts Benzoyl peroxide 0.2 parts Ethyl acetate 100 parts A mixture of the above components was placed in flask 1, and the temperature of the reaction system was maintained at 65°C while stirring. After polymerizing for about 15 hours, the temperature of the reaction system was raised to 80°C and held for 2 hours to completely polymerize the remaining monomers .
A polymerization product containing an acrylic copolymer was obtained. To this polymerization product, 150 parts of rosin ester (melting point 60°C), 40 parts of pentaerythritol trimethacrylate, 3 parts of benzoin isopropyl ether, 0.01 part of hydroquinone monomethyl ether, and 300 parts of ethyl acetate were blended into the polymerized product, based on 100 parts of its solid content. A solution containing a heat-activatable and photocurable adhesive composition was obtained by uniformly mixing the adhesive composition. This composition solution was applied to one side of a polypropylene sheet with a thickness of 60 μm so that the thickness after drying would be 20 μm, and dried at 80° C. for 5 minutes to form an adhesive layer having heat activation and photocurability. , a composite sheet was obtained. This composite sheet is made of BA finished stainless steel plate.
After applying heat and pressure bonding to SUS304 through the adhesive layer mentioned above at 100℃, a high pressure mercury lamp (80W/cm/1
The adhesive layer was cured by irradiating it with ultraviolet light for about 5 seconds from a distance of 10 cm, and then only the polypropylene sheet was peeled off to form a surface protective layer made of a cured polymer on the stainless steel plate. Example 2 Ethyl acrylate 85 parts Methyl methacrylate 10 parts Acrylic acid 5 parts Ammonium persulfate 0.2 parts Sodium dodecylbenzenesulfonate 7 parts Ion-exchanged water 100 parts A mixture of the above components was placed in flask 1, and heated with nitrogen for about 30 minutes while stirring. After the substitution, polymerization was carried out under heating at 65°C for 2 hours, and after the polymerization was completed, the reaction system was heated to 75°C and aged for 1 hour to obtain an acrylic copolymer with an average particle size of 0.09 μm and a pH of about 3. I got an emulsion. The weight average molecular weight of this acrylic copolymer was approximately 800,000. Next, while stirring this emulsion, 200 parts of terpene-modified phenolic resin emulsion (melting point 75°C, solid content 50% by weight) was added to 100 parts of the solid content of the acrylic copolymer.
20 parts neopentyl glycol diacrylate 25 parts benzoin ethyl ether 3.5 parts hydroquinone 0.01 part ion-exchanged water 300 parts of each component were blended to obtain an emulsion containing a heat-activatable and photocurable adhesive composition. This composition emulsion was coated on one side of a 25 μm thick polyester sheet so that the thickness after drying would be 20 μm, and dried at 100° C. for 5 minutes to produce a composite sheet. Example 1 using this composite sheet
A surface protective layer was formed on a BA finished stainless steel plate SUS304 in the same manner as above. Example 3 To the polymerization product in Example 2, 3 parts of glycidyl methacrylate and 0.5 parts of triethylamine were added to 100 parts of the acrylic copolymer,
The reaction was carried out at 70° C. for 5 hours to introduce a photoreactive polymerizable carbon-carbon double bond into the copolymer. Each component described in Example 2 was blended with 100 parts of the solid content of this reaction product, and a composite sheet was produced in the same manner as in Example 2. Using this composite sheet, a surface protective layer was formed on a BA finished stainless steel plate SUS304 in the same manner as in Example 1. The results of measuring the pencil hardness and adhesion of the surface protective layers obtained in Examples 1 to 3 above are shown in the following table. In addition, regarding the adhesion strength, the values when the surface protective layer was formed in the same manner as in Examples 1 to 3 using a copper plate and an acrylic plate as adherends are also shown. In addition, the results of investigating the adhesive strength of the composite sheet before light irradiation (initial adhesive strength) and the adhesive strength when peeling off the self-supporting sheet after light irradiation (self-supporting sheet peeling force) are also listed in the following table.
【表】
なお、上記測定は次の方法により行つた。
初期接着力:複合シートを25mm幅に切断し、
BA仕上げステンレス板SUS304に100℃で加熱圧
着して貼り付けて30分間放置後、180度引き剥し
接着力を測定した(引き剥し速度300mm/分、20
℃×65%R.H.)。
自己支持性シート剥離力:複合シートを25mm幅
に切断し、BA仕上げステンレス板SUS304に100
℃で加熱圧着して貼り付けた後、高圧水銀灯
(80W/cm/1灯)で10cmの距離から約5秒間紫
外線照射後、自己支持性シートの180度剥離接着
力を測定した(引き剥し速度300mm/分、20℃×
65%R.H.)。
鉛筆硬度:JIS―K―5400に準じ、表面保護層
の硬度を測定した。
密着力:表面保護層に、1mm間隔の切れ目を碁
盤目状に100個入れ、これに市販のセロハン粘着
テープを貼り付け、次いでテープを剥して碁盤目
片の残留%で表示した。
上記実施例からも明らかなように、この発明の
方法によれば、被着体上に良好な表面保護層を簡
単に形成できることがわかる。[Table] The above measurements were performed by the following method. Initial adhesive strength: Cut the composite sheet into 25mm width,
The adhesive strength was measured by peeling off at 180 degrees after applying heat and pressure at 100°C to BA finish stainless steel plate SUS304 and leaving it for 30 minutes (peeling speed: 300 mm/min, 20
℃×65%RH). Self-supporting sheet peeling force: Cut the composite sheet into 25 mm width and apply 100 to BA finish stainless steel plate SUS304.
After applying heat and pressure at ℃ and irradiating it with ultraviolet light for about 5 seconds from a distance of 10 cm using a high-pressure mercury lamp (80 W/cm/lamp), the 180 degree peel adhesive strength of the self-supporting sheet was measured (peeling speed 300mm/min, 20℃×
65%RH). Pencil hardness: The hardness of the surface protective layer was measured according to JIS-K-5400. Adhesion: 100 cuts at 1 mm intervals were made in a grid pattern on the surface protective layer, commercially available cellophane adhesive tape was pasted thereon, the tape was then peeled off, and the score was expressed as the percentage remaining of the grid pieces. As is clear from the above examples, it can be seen that according to the method of the present invention, a good surface protective layer can be easily formed on an adherend.
Claims (1)
このシート(またはフイルム)上に設けられた熱
賦活性と光硬化性とを備えた接着剤層からなる複
合シート(またはフイルム)を被着体面上にこの
接着剤層を介して加熱圧着して貼り合わせたのち
光照射してこの接着剤層を硬化させ、次いで前記
の自己支持性シート(またはフイルム)のみを剥
離して前記の被着体面上に重合硬化物からなる表
面保護層を形成させる表面保護層形成方法であつ
て、前記の接着剤層がエチレン性二重結合を有す
る単量体と官能基を有する共重合性単量体との共
重合物100重量部、融点が50℃以上である熱溶融
性樹脂30〜200重量部、光反応性ビニル化合物5
〜300重量部および光増感剤0.05〜30重量部を含
む熱賦活性と光硬化性を備えた接着剤組成物から
なることを特徴とする表面保護層形成方法。 2 エチレン性二重結合を有する単量体と官能基
を有する共重合性単量体との共重合物が、分子中
に少なくとも平均1個の光反応性の炭素―炭素二
重結合を有するものである特許請求の範囲第1項
記載の表面保護層形成方法。[Claims] 1. A composite sheet (or film) consisting of a self-supporting sheet (or film) and a heat-activatable and photocurable adhesive layer provided on the sheet (or film). After bonding with heat and pressure on the adherend surface via this adhesive layer, the adhesive layer is cured by irradiation with light, and then only the self-supporting sheet (or film) is peeled off to form the adhesive layer. A surface protective layer forming method for forming a surface protective layer made of a polymerized cured product on the surface of an adherend, the adhesive layer comprising a monomer having an ethylenic double bond and a copolymerizable monomer having a functional group. 100 parts by weight of a copolymer with polymer, 30 to 200 parts by weight of a heat-melting resin with a melting point of 50°C or higher, photoreactive vinyl compound 5
1. A method for forming a surface protective layer, comprising a heat-activatable and photocurable adhesive composition containing ~300 parts by weight and 0.05 to 30 parts by weight of a photosensitizer. 2 A copolymer of a monomer having an ethylenic double bond and a copolymerizable monomer having a functional group has at least one photoreactive carbon-carbon double bond in the molecule on average A method for forming a surface protective layer according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5159484A JPS60197274A (en) | 1984-03-17 | 1984-03-17 | Formation of surface protective layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5159484A JPS60197274A (en) | 1984-03-17 | 1984-03-17 | Formation of surface protective layer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60197274A JPS60197274A (en) | 1985-10-05 |
JPS6216702B2 true JPS6216702B2 (en) | 1987-04-14 |
Family
ID=12891235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5159484A Granted JPS60197274A (en) | 1984-03-17 | 1984-03-17 | Formation of surface protective layer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60197274A (en) |
-
1984
- 1984-03-17 JP JP5159484A patent/JPS60197274A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60197274A (en) | 1985-10-05 |
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