JPS62166671U - - Google Patents

Info

Publication number
JPS62166671U
JPS62166671U JP1986038470U JP3847086U JPS62166671U JP S62166671 U JPS62166671 U JP S62166671U JP 1986038470 U JP1986038470 U JP 1986038470U JP 3847086 U JP3847086 U JP 3847086U JP S62166671 U JPS62166671 U JP S62166671U
Authority
JP
Japan
Prior art keywords
reinforcing
utility
dielectric material
model registration
inner sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986038470U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0246061Y2 (US07655688-20100202-C00086.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986038470U priority Critical patent/JPH0246061Y2/ja
Priority to GB8719883A priority patent/GB2208971B/en
Priority to EP87307452A priority patent/EP0304516A1/en
Publication of JPS62166671U publication Critical patent/JPS62166671U/ja
Priority to US07/190,458 priority patent/US4857381A/en
Application granted granted Critical
Publication of JPH0246061Y2 publication Critical patent/JPH0246061Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
    • Y10T428/24182—Inward from edge of web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/249991—Synthetic resin or natural rubbers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP1986038470U 1986-03-17 1986-03-17 Expired JPH0246061Y2 (US07655688-20100202-C00086.png)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1986038470U JPH0246061Y2 (US07655688-20100202-C00086.png) 1986-03-17 1986-03-17
GB8719883A GB2208971B (en) 1986-03-17 1987-08-22 A reinforced porous dielectric sheet
EP87307452A EP0304516A1 (en) 1986-03-17 1987-08-24 A reinforced porous dielectric sheet
US07/190,458 US4857381A (en) 1986-03-17 1988-05-05 Reinforced dielectric sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986038470U JPH0246061Y2 (US07655688-20100202-C00086.png) 1986-03-17 1986-03-17

Publications (2)

Publication Number Publication Date
JPS62166671U true JPS62166671U (US07655688-20100202-C00086.png) 1987-10-22
JPH0246061Y2 JPH0246061Y2 (US07655688-20100202-C00086.png) 1990-12-05

Family

ID=12526127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986038470U Expired JPH0246061Y2 (US07655688-20100202-C00086.png) 1986-03-17 1986-03-17

Country Status (4)

Country Link
US (1) US4857381A (US07655688-20100202-C00086.png)
EP (1) EP0304516A1 (US07655688-20100202-C00086.png)
JP (1) JPH0246061Y2 (US07655688-20100202-C00086.png)
GB (1) GB2208971B (US07655688-20100202-C00086.png)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5089674A (en) * 1990-04-25 1992-02-18 Microtel Pacific Research Limited Hydrostatic pressure sensor
GB9020428D0 (en) * 1990-09-19 1990-10-31 Gore W L & Ass Uk Thermal control materials
US5097099A (en) * 1991-01-09 1992-03-17 Amp Incorporated Hybrid branch cable and shield
GB2255676B (en) * 1991-05-08 1995-09-27 Fuji Electric Co Ltd Metallic printed board
JP2601128B2 (ja) * 1992-05-06 1997-04-16 松下電器産業株式会社 回路形成用基板の製造方法および回路形成用基板
WO1994007348A1 (en) * 1992-09-24 1994-03-31 Hughes Aircraft Company Dielectric vias within multilayer 3-dimensional structures/substrates
US5354603A (en) * 1993-01-15 1994-10-11 Minnesota Mining And Manufacturing Company Antifouling/anticorrosive composite marine structure
US5484641A (en) * 1993-11-01 1996-01-16 Rotter; Martin J. Process for fixing plastic reinforcing pins into non-woven filamentary material and product produced by the process
US5449427A (en) * 1994-05-23 1995-09-12 General Electric Company Processing low dielectric constant materials for high speed electronics
US5571608A (en) * 1994-07-15 1996-11-05 Dell Usa, L.P. Apparatus and method of making laminate an embedded conductive layer
US5733639A (en) * 1995-06-30 1998-03-31 Poly Circuits/M-Wave Circuit board assembly with foam substrate and method of making same
JP2003136623A (ja) * 2001-08-22 2003-05-14 Tdk Corp モジュール部品、コア基板要素集合体、多層基板、コア基板要素集合体の製造方法、多層基板の製造方法、及びモジュール部品の製造方法
US8125341B2 (en) * 2007-12-10 2012-02-28 Checkpoint Systems, Inc. Resonant tag with reinforced deactivation dimple
KR101057088B1 (ko) * 2011-02-16 2011-08-16 (주) 우주케이에프씨 환형도체를 사용한 플렉시블 플랫 케이블
CN102260378B (zh) * 2011-05-06 2013-03-20 广东生益科技股份有限公司 复合材料、用其制作的高频电路基板及其制作方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6278777U (US07655688-20100202-C00086.png) * 1985-11-06 1987-05-20

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2789076A (en) * 1953-09-21 1957-04-16 Frieder Laminated ballistic fabric
FR1206380A (fr) * 1958-08-14 1960-02-09 Etude Des Panneaux Polyvalents Procédé de fabrication de panneaux et panneaux ainsi fabriqués
US3446692A (en) * 1964-06-01 1969-05-27 Pullman Inc Insulated panel and method of making same
US3614848A (en) * 1964-06-09 1971-10-26 Pullman Inc Foam structural element
US4518737A (en) * 1978-12-26 1985-05-21 Rogers Corporation Dielectric material and method of making the dielectric material
US4451527A (en) * 1981-07-28 1984-05-29 Minnesota Mining And Manufacturing Company Conformable metal-clad laminate
US4452657A (en) * 1982-09-15 1984-06-05 The Boeing Company Composite integral web stiffening method
US4514450A (en) * 1983-11-01 1985-04-30 Union Carbide Corporation Peg supported thermal insulation panel
US4591659A (en) * 1983-12-22 1986-05-27 Trw Inc. Multilayer printed circuit board structure
JPS60214941A (ja) * 1984-04-10 1985-10-28 株式会社　潤工社 プリント基板
JPS60169904U (ja) * 1984-04-20 1985-11-11 株式会社　潤工社 ストリップラインケーブル
JPS60225750A (ja) * 1984-04-24 1985-11-11 株式会社　潤工社 プリント基板
US4680220A (en) * 1985-02-26 1987-07-14 W. L. Gore & Associates, Inc. Dielectric materials

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6278777U (US07655688-20100202-C00086.png) * 1985-11-06 1987-05-20

Also Published As

Publication number Publication date
JPH0246061Y2 (US07655688-20100202-C00086.png) 1990-12-05
US4857381A (en) 1989-08-15
EP0304516A1 (en) 1989-03-01
GB2208971A (en) 1989-04-19
GB2208971B (en) 1991-05-01
GB8719883D0 (en) 1987-09-30

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