JPS6216541A - Semiconductor element detecting device - Google Patents

Abstract

PURPOSE:To easily detect the information on the coordinate value data and external shape of a semiconductor element single unit and an existence of defective ink thereon by a binary logical signal by a method wherein only the semiconductor element single unit is pushed up and the semiconductor element pushed up is detected by image pickup. CONSTITUTION:When the semiconductor element group is scanned (a) among dimension positions t1-t4 with the image pickup means, most of lights 9 directed down to the semiconductor element 4a located at the flat position are reflected by the surface of the semiconductor element 4a and the reflected lights 9a come into an optical mirror cylinder 2. Therefore, the output signal from a camera 1 falls into a high level, but as the semiconductor elements 4b on the periphery of the semiconductor element 4a excluding the semiconductor element 4a are inclining, the reflected lights 9b of the lights 9 directed down to the semiconductor elements 4b do not almost inside in the optical mirror cylinder 2 and reflect to other directions. Therefore, the output signal from the camera tube 1 falls into a low level. There, when the video signal turns into a binary signal in the threshold level, the output signal from the camera tube 1 results in being detected as the binary logical signal.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to the detection of semiconductor elements attached to adhesive sheets during the assembly of semiconductor devices.

Conventional technology A detection means for detecting the individual position and shape of a semiconductor element pasted on an adhesive sheet after dicing is performed using an optical system and an imaging means such as an image pickup tube or a can. The pixel size varies depending on the size of the optical sensor or semiconductor element, but generally one pixel is several tens of microns (μm).

The groove width between semiconductor elements formed by dicing is 30 mm.
μm to 40 μm, which is the same or smaller than the size of one pixel, and it is difficult to detect the external shape of each semiconductor element. Conventionally, after attaching a group of semiconductor elements to the adhesive sheet, Detection was performed by stretching the adhesive sheet and enlarging the gap between semiconductor elements to several times the size of one pixel.

Problems to be Solved by the Invention In such conventional methods, it is difficult to stretch the adhesive sheet uniformly, and meandering occurs in the regularly arranged semiconductor elements. There was an inconvenience that it could not be detected.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention is such that only a single semiconductor element is pushed up and the pushed up semiconductor element is imaged and detected.

Effect of the Invention With the above-described configuration, the present invention detects the light intensity difference by imaging and clearly detects the outline of the semiconductor element, since the light beams are reflected in different directions between the pushed-up semiconductor element and peripheral elements other than the semiconductor element. can do.

EXAMPLE The present invention will be explained in detail by way of example with reference to FIGS. 1 to 4.

FIG. 1 is a schematic sectional view showing an outline of the embodiment, and FIG. 2 is a partially detailed view thereof. A wafer ring 6 is attached via a wafer ring holder 10 onto an XY table 11 driven by a DC servo, a pulse motor, or the like. The wafer ring 6 holds an adhesive sheet 6, on which a large number of diced semiconductor elements 4 are arranged.

A pillar 7 is provided below the adhesive sheet 5 to push the adhesive sheet 5 upward.

Above the wafer ring 6, an incident light source 3 and an imaging means are provided. This imaging means is composed of an optical lens barrel 2 and an image pickup tube 1, and converts an optical signal 9 incident on the optical lens barrel 2 into an electrical signal (video signal).

FIG. 3 shows a group of semiconductor elements at dimensional position 11 using the imaging means.
This is a cross-sectional view for explaining the scanning between . In detail, in FIG. 3, most of the light 9 incident on the flat semiconductor element 4a is reflected by the surface of the semiconductor element 4&, and the reflected light 9a enters the optical lens barrel 2. , the output signal from the image pickup tube 1 becomes high level as shown in FIG. 4a. However, the peripheral elements 4b other than the semiconductor element 4a
Since the element 4b is tilted, the reflected light 9b of the light 9 incident on the image pickup tube 1 hardly enters the optical lens barrel 2, but is reflected in another direction, resulting in an output from the image pickup tube 1. The signal goes low level. Therefore, if the video signal of FIG. 4a is binarized at the threshold level (J''), it will be detected as a binary logic signal as shown in FIG.

Effects of the Invention According to the present invention, it is possible to perform image processing on a single semiconductor element without stretching the adhesive sheet with a group of diced semiconductor elements attached, without being affected by gaps between the semiconductor elements and surrounding elements. , information such as coordinate value data, external shape, and presence or absence of defective ink of the same element can be easily detected using binary logic signals.

[Brief explanation of the drawing]

FIG. 1 is a sectional front view showing an outline of an embodiment of the present invention, FIG. 2 is a partial detailed view of the same embodiment, and FIGS. 3 and 4 a and b explain a detection method based on the embodiment. FIG. 2 is a schematic cross-sectional view and a detection signal waveform diagram. 1... Image pickup tube, 2... Optical lens barrel, 3.
... Epi-light source, 4... Semiconductor element, 6.
... Adhesive sheet, 6 ... Wafer ring, 7 ... Pillar, 8 ... Incident light, 9 ...
...Reflected light, 1o...Wafer ring halter
111...X-Y table. Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
figure

Claims (1)

[Claims] A semiconductor device comprising means for pushing up a single semiconductor element from the back side of an adhesive sheet to which a large number of semiconductor elements are attached, and an imaging means for optically detecting the shape of the pushed-up semiconductor element. Detection device.