JPS62163967U - - Google Patents
Info
- Publication number
- JPS62163967U JPS62163967U JP5314986U JP5314986U JPS62163967U JP S62163967 U JPS62163967 U JP S62163967U JP 5314986 U JP5314986 U JP 5314986U JP 5314986 U JP5314986 U JP 5314986U JP S62163967 U JPS62163967 U JP S62163967U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead frame
- lead
- thinner
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5314986U JPS62163967U (it) | 1986-04-08 | 1986-04-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5314986U JPS62163967U (it) | 1986-04-08 | 1986-04-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62163967U true JPS62163967U (it) | 1987-10-17 |
Family
ID=30878945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5314986U Pending JPS62163967U (it) | 1986-04-08 | 1986-04-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62163967U (it) |
-
1986
- 1986-04-08 JP JP5314986U patent/JPS62163967U/ja active Pending