JPS62160798A - Source supply method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] (Summary) A plurality of power supply bars with input power pins fixed to them are stretched on the underside of a motherboard that has a power supply circuit and a signal circuit between each pin inserted into a promotion board. Then, insert a high-density mounted package into the upper connection pin, and insert a power module that supplies the required power of the package into the lower output power pin and input power pin to connect the power bar and the primary power source side. , a new power supply method to power the package with low voltage, high current loads.

[Industrial application field]

The present invention relates to a power supply for a printed board package used in electronic equipment.

In particular, there is a need for a new power supply method for information equipment equipped with a large number of printed circuit board packages each having a large number of high-density elements such as LSi mounted thereon.

[Conventional technology]

As shown in FIG. 2, the conventional power supply method is to supply power to a motherboard 2 in which a predetermined number of connection pins 21 are inserted into an insulating substrate having a signal circuit and a power supply circuit (both not shown). The circuit is connected to a power supply unit (not shown) separately placed on the equipment stand using a power cable 5, and is connected to a predetermined connection pin 21 using a rail 6 assembled on the opposite side of the motherboard 2 in the direction of the solid line arrow as a guide. Insert the package connector 11 and connect the connection pin 2 of the motherboard 2.
A method is used in which power is supplied from the power supply circuit to the package 1 through connection terminals of a part of the package 1 and a part of the package connector 11.

[Problem to be Solved by the Invention 1] The problem with the conventional power supply structure described above is that the connection cable wiring from the power supply unit separately installed in the equipment frame, the power supply circuit of the motherboard, and the connection Since power is supplied to each element mounted on the package through the pins and connection terminals of the package connector, the power is For power supply, since the load section and the power supply unit are separated, the connecting cable or bus bar between them becomes thick, and there are many contact points, which causes a large voltage drop.

SUMMARY OF THE INVENTION The present invention aims to provide a new power supply method that can easily and stably supply power to packages mounted at high density in view of the above-mentioned circumstances.

[Means for solving problems]

The above problem can be solved by inserting a predetermined number of output power pins 22 and connection pins 21 as shown in FIG.
The input power pins are connected at a constant pitch to the motherboard 2, which has a power supply circuit (not shown) from 2 to a predetermined connection pin 21, and a signal circuit (not shown) between the other connection pins 21. Three power supply bars 4 of a predetermined length to which 41 are fixed are stretched at predetermined locations at regular intervals in the direction of the dotted line arrow.

Next, one or two of the high-density mounted packages 1 attached to this motherboard 2 have the required power, that is, have the ability to supply power corresponding to low voltage and large current loads, and receive the primary power supply. A power module 3 is manufactured to which an input power connector 31 and an output power connector 32 that outputs the required secondary power are attached.

Then, insert the package connector 11 of the package 1 into the connection pin 21 of the motherboard 2 in the direction of the dashed-dotted line arrow, using a rail (not shown) as a guide, and insert the Input power connector 31 and output power connector 32 of module 3
This problem is solved by the new power supply method of the present invention, in which primary power is supplied to the power bar 4 with the power cable 5 by inserting the rail into the input power pin 41 and the output power pin 22 of the power bar 4 using the rail as a guide. be done.

[Effect]

That is, in the present invention, a power supply circuit from the output power supply pin 22 to a predetermined connection pin 21 and a power supply cable 5 are provided.
Packages 1 mounted in high density and power modules 3 for supplying the required power to each package 1 are placed close to a motherboard 2 on which a power bar 4 connected to a primary power source and having a power supply pin 41 is stretched. By mounting, high-voltage primary power can be supplied to the power module 3 from the input power pin 41 of the power supply bar 4, and it can be connected to the primary power source using the thin power cable 5.

Also, the power module 3 requires a low voltage.

By converting into a large capacity secondary power and supplying the required power to the nearby package 1 via the output power pin 22 and the connection pin 21 of the motherboard 2, the connection part becomes simple and the voltage drop is reduced. Alternatively, fluctuations are reduced and highly reliable power supply becomes possible.

〔Example〕

The present invention will be described in detail below based on embodiments shown in the drawings.

FIG. 1 is a perspective view of the power supply method according to this embodiment.

As shown in the figure, a predetermined number of connection pins 21 are inserted above in the direction of the dashed line arrow on the insulating board, and a required number of output power supply pins 22 are inserted below them, and from these output power supply pins 22, the predetermined connection pins A motherboard 2 is manufactured in which a circuit for supplying power to 21 (not shown) and other connection pins 21 are connected by a signal circuit (not shown).

Next, an input power supply pin 41 of a predetermined size, for example, a pin made by cutting hard copper wire and plated with nickel, is attached to a power supply bar 4 of a predetermined length, for example, a hard copper strip having a rectangular cross section of a predetermined size, and is connected to the primary power source at the required location. It is fixed by brazing or press-fitting it in a predetermined direction at a constant pitch onto a belt having tapped holes for connecting the power cable 5 of the same.

Then, the power supply bar 4 is placed at a predetermined location in the lower part of the surface of the motherboard 2 on the side shown by the solid line arrow, that is, in the opposite direction of the dashed line arrow. I'll put it on the shelf.

Next, attach the input power connector 31 that receives power from the input power pin 41 on the blow mold source side and the output power connector 32 that supplies secondary power to the output power pin 22 in the opposite direction of the solid line arrow. , a power module 3 that receives power from a high-voltage primary power source and outputs it as secondary power to supply the required power to the high-density package 1 or two packages, that is, the power corresponding to low voltage and large current loads. To manufacture.

The output power connector 32 and input power connector 31 of this power module 3 are connected to the output power pin 2 installed on the motherboard 2 via a rail (not shown).
2 into the input power pin 41 of the power supply bar 4, and insert the package connector 11 of the package 1 into the connection pin 21 above it, that is, in the direction of the dashed line arrow, using the groove of the rail as a guide. Primary power can be supplied from the power bar 4 to the power module 3 by connecting the tip of the power cable 5 with a bolt 51 to a screw hole provided in the power bar 4 of the book and connecting it to a high voltage primary power source.
Necessary secondary power can be supplied to the package 1 through the output power supply pin 22 and the connection pin 21.

〔Effect of the invention〕

As explained above, according to the present invention, with a simple configuration, it is possible to supply power from a nearby location that can handle the low voltage and large current loads of high-density packaging packages, and it is possible to provide stable power supply, thereby achieving high reliability. It is expected to be effective and is extremely useful industrially.

[Brief explanation of drawings]

FIG. 1 is a perspective view illustrating a power supply method according to an embodiment of the present invention, and FIG. 2 is a side view illustrating a conventional power supply method. In the figure, 1 is the package, 11 is the package connector, 2 is the motherboard, 21 is the connection pin, 22 is the output power pin, 3 is the power module, 31 is the input power connector, 32 is the output power connector, 4 is the power supply bar, 41 is the input power pin, 5 is the power cable, 51 is the volt, and 6 is the rail. 2 masters.

Claims (1)

[Claims] For power supply, an output power supply pin (22) and a connection pin (21) are inserted into a predetermined location, and the output power supply pin (22) and a predetermined connection pin (21) are connected. Motherboard with circuit (2) and input power pins (41
) to which a predetermined number of power supply bars (4) are fixed, and an input power connector ( 31) and an output power connector (32) that outputs the required secondary power to the output power pin (22).
The package (1) is inserted into the connection pin (21) of the motherboard (2), and the input power pin of the power supply bar (4) suspended below (41) and the output power supply pin (
22) A power supply system characterized in that the power module (3) is inserted into the power supply bar (4) and primary power is supplied to the power supply bar (4).