JPS62160556U - - Google Patents

Info

Publication number
JPS62160556U
JPS62160556U JP1986049221U JP4922186U JPS62160556U JP S62160556 U JPS62160556 U JP S62160556U JP 1986049221 U JP1986049221 U JP 1986049221U JP 4922186 U JP4922186 U JP 4922186U JP S62160556 U JPS62160556 U JP S62160556U
Authority
JP
Japan
Prior art keywords
semiconductor elements
semiconductor
integrated circuit
circuit device
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986049221U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986049221U priority Critical patent/JPS62160556U/ja
Publication of JPS62160556U publication Critical patent/JPS62160556U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16135Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Wire Bonding (AREA)
JP1986049221U 1986-04-01 1986-04-01 Pending JPS62160556U (US06368395-20020409-C00050.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986049221U JPS62160556U (US06368395-20020409-C00050.png) 1986-04-01 1986-04-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986049221U JPS62160556U (US06368395-20020409-C00050.png) 1986-04-01 1986-04-01

Publications (1)

Publication Number Publication Date
JPS62160556U true JPS62160556U (US06368395-20020409-C00050.png) 1987-10-13

Family

ID=30871470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986049221U Pending JPS62160556U (US06368395-20020409-C00050.png) 1986-04-01 1986-04-01

Country Status (1)

Country Link
JP (1) JPS62160556U (US06368395-20020409-C00050.png)

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