JPS62158865U - - Google Patents
Info
- Publication number
- JPS62158865U JPS62158865U JP4622486U JP4622486U JPS62158865U JP S62158865 U JPS62158865 U JP S62158865U JP 4622486 U JP4622486 U JP 4622486U JP 4622486 U JP4622486 U JP 4622486U JP S62158865 U JPS62158865 U JP S62158865U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- electronic component
- stress
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4622486U JPS62158865U (me) | 1986-03-31 | 1986-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4622486U JPS62158865U (me) | 1986-03-31 | 1986-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62158865U true JPS62158865U (me) | 1987-10-08 |
Family
ID=30865690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4622486U Pending JPS62158865U (me) | 1986-03-31 | 1986-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62158865U (me) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH098081A (ja) * | 1995-06-20 | 1997-01-10 | Fujitsu General Ltd | Ｂｇａ型パッケージの実装構造 |
| JP2008218644A (ja) * | 2007-03-02 | 2008-09-18 | Sumitomo Wiring Syst Ltd | 回路基板および電子部品付回路基板 |
-
1986
- 1986-03-31 JP JP4622486U patent/JPS62158865U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH098081A (ja) * | 1995-06-20 | 1997-01-10 | Fujitsu General Ltd | Ｂｇａ型パッケージの実装構造 |
| JP2008218644A (ja) * | 2007-03-02 | 2008-09-18 | Sumitomo Wiring Syst Ltd | 回路基板および電子部品付回路基板 |