JPS62157860U

JPS62157860U -

Info

Publication number: JPS62157860U
Application number: JP4755186U
Authority: JP
Priority date: 1986-03-31
Filing date: 1986-03-31
Publication date: 1987-10-07

Description

[Brief explanation of drawings]

第１図はこの考案の実施例を示す側面図、第２
図はハーフカツト部の拡大平面図、第３図および
第４図は、それぞれ被加工材を示す斜視図である
。図中、１０はテープレツトオフ部、１３は両面
粘着テープ、１３ａは粘着層、１３ｂは離型紙、
１５はハーフカツト部、２６は貼合わせ部、２８
は巻取り部、３０は被加工材、ＡおよびＢは、そ
れぞれ貼合わせ部のテープ案内面の後端位置およ
び前端位置、Ｃはハーフカツト部のハーフカツト
位置である。 Figure 1 is a side view showing an embodiment of this invention, Figure 2 is a side view showing an embodiment of this invention.
The figure is an enlarged plan view of the half-cut portion, and FIGS. 3 and 4 are perspective views showing the workpiece, respectively. In the figure, 10 is a tape let-off part, 13 is a double-sided adhesive tape, 13a is an adhesive layer, 13b is a release paper,
15 is a half cut part, 26 is a pasting part, 28
30 is the winding part, 30 is the workpiece, A and B are the rear and front end positions of the tape guide surface of the bonding part, respectively, and C is the half-cut position of the half-cut part.

Claims

[Scope of utility model registration request]

A tape let-off part where double-sided adhesive tape is wound, a half-cut part that cuts only the adhesive layer to a fixed length, leaving the release paper of the double-sided adhesive tape pulled out from the tape-let-off part, and a double-sided adhesive tape pulled out from the half-cut part. The half-cut includes a bonding section that guides the adhesive tape and attaches the adhesive layer cut to a regular length to a workpiece, and a winding section that winds up the release paper of the double-sided adhesive tape pulled out from the bonding section. Cutting and pasting of double-sided adhesive tape, characterized in that the half-cut position of the part is set at a position where the length is the same as the length between the half-cut position and the front end position and rear end position of the tape guide surface of the pasting part. Device.