JPS62157041U - - Google Patents
Info
- Publication number
- JPS62157041U JPS62157041U JP4473986U JP4473986U JPS62157041U JP S62157041 U JPS62157041 U JP S62157041U JP 4473986 U JP4473986 U JP 4473986U JP 4473986 U JP4473986 U JP 4473986U JP S62157041 U JPS62157041 U JP S62157041U
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- point metal
- fuse
- low melting
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008018 melting Effects 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Landscapes
- Fuses (AREA)
Description
第１図は本考案ヒユーズの代表例を示す平面図
、第２図イ〜ニはその作用状態説明図、第３図は
本考案の説明に供する過度電流波形図、第４図は
同じく溶断特性図、第５図および第６図は従来例
の説明図である。
１……可溶体、１ａ……溶断部、１ｂ……ノリ
代、２……低融点金属。
Fig. 1 is a plan view showing a typical example of the fuse of the present invention, Fig. 2 A to D are explanatory diagrams of its operating state, Fig. 3 is a transient current waveform diagram used to explain the present invention, and Fig. 4 is also the fusing characteristics. 5 and 6 are explanatory diagrams of conventional examples. 1... Fusible body, 1a... Fusing part, 1b... Gluing allowance, 2... Low melting point metal.
Claims (1)
付着させたヒユーズにおいて、前記低融点金属を
可溶体に設けられた溶断部と直接接触させること
なく該溶断部の近傍に付着させたことを特徴とす
るヒユーズ。 (2) 前記低融点金属の溶断部からの付着位置を
可溶体の非溶断部における板厚の０．６〜２０倍
以内とした実用新案登録請求の範囲第１項のヒユ
ーズ。[Claims for Utility Model Registration] (1) In a fuse in which a low melting point metal is attached to a fusible body made of a high melting point metal, the fuse is blown without bringing the low melting point metal into direct contact with the fusing part provided on the fusible body. A fuse characterized by being attached near the part. (2) The fuse according to claim 1 of the utility model registration, wherein the attachment position of the low melting point metal from the fused part is within 0.6 to 20 times the thickness of the plate in the unfused part of the fusible material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4473986U JPS62157041U (en) | 1986-03-28 | 1986-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4473986U JPS62157041U (en) | 1986-03-28 | 1986-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62157041U true JPS62157041U (en) | 1987-10-06 |
Family
ID=30862830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4473986U Pending JPS62157041U (en) | 1986-03-28 | 1986-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62157041U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0714494A (en) * | 1993-06-22 | 1995-01-17 | Yazaki Corp | Fuse |
| JP2008243757A (en) * | 2007-03-29 | 2008-10-09 | Nippon Telegr & Teleph Corp <Ntt> | Fuse element |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS518417U (en) * | 1974-07-05 | 1976-01-22 | ||
| JPS51103252A (en) * | 1975-03-10 | 1976-09-11 | Hitachi Ltd | GENRYUHYUUZU |
-
1986
- 1986-03-28 JP JP4473986U patent/JPS62157041U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS518417U (en) * | 1974-07-05 | 1976-01-22 | ||
| JPS51103252A (en) * | 1975-03-10 | 1976-09-11 | Hitachi Ltd | GENRYUHYUUZU |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0714494A (en) * | 1993-06-22 | 1995-01-17 | Yazaki Corp | Fuse |
| JP2008243757A (en) * | 2007-03-29 | 2008-10-09 | Nippon Telegr & Teleph Corp <Ntt> | Fuse element |
| JP4513030B2 (en) * | 2007-03-29 | 2010-07-28 | 日本電信電話株式会社 | Fuse element |
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