JPS62155958U - - Google Patents
Info
- Publication number
- JPS62155958U JPS62155958U JP4430486U JP4430486U JPS62155958U JP S62155958 U JPS62155958 U JP S62155958U JP 4430486 U JP4430486 U JP 4430486U JP 4430486 U JP4430486 U JP 4430486U JP S62155958 U JPS62155958 U JP S62155958U
- Authority
- JP
- Japan
- Prior art keywords
- silver paste
- outlet
- tank
- dan
- closes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000008188 pellet Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4430486U JPS62155958U (US06174465-20010116-C00003.png) | 1986-03-25 | 1986-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4430486U JPS62155958U (US06174465-20010116-C00003.png) | 1986-03-25 | 1986-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62155958U true JPS62155958U (US06174465-20010116-C00003.png) | 1987-10-03 |
Family
ID=30861986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4430486U Pending JPS62155958U (US06174465-20010116-C00003.png) | 1986-03-25 | 1986-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62155958U (US06174465-20010116-C00003.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63100970A (ja) * | 1986-05-30 | 1988-05-06 | Nordson Kk | 微量精密液体吐出用ディスペンサ |
-
1986
- 1986-03-25 JP JP4430486U patent/JPS62155958U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63100970A (ja) * | 1986-05-30 | 1988-05-06 | Nordson Kk | 微量精密液体吐出用ディスペンサ |
