JPS62154658U - - Google Patents
Info
- Publication number
- JPS62154658U JPS62154658U JP1986041167U JP4116786U JPS62154658U JP S62154658 U JPS62154658 U JP S62154658U JP 1986041167 U JP1986041167 U JP 1986041167U JP 4116786 U JP4116786 U JP 4116786U JP S62154658 U JPS62154658 U JP S62154658U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- substrate
- filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
第１図ａ，ｂ及びｃは本発明の固体撮像装置の
平面図、そのＹ―Ｙ線断面図、及びそのＸ―Ｘ線
断面図、第２図ａ，ｂ，及びｃは従来の固体撮像
装置の平面図、そのＹ′―Ｙ′線断面図、及びそ
のＸ′―Ｘ′線断面図である。 １……パツケージ、２……固体撮像素子基板、
３……光学フイルタ、４，４′……接着剤。
平面図、そのＹ―Ｙ線断面図、及びそのＸ―Ｘ線
断面図、第２図ａ，ｂ，及びｃは従来の固体撮像
装置の平面図、そのＹ′―Ｙ′線断面図、及びそ
のＸ′―Ｘ′線断面図である。 １……パツケージ、２……固体撮像素子基板、
３……光学フイルタ、４，４′……接着剤。
Claims (1)
- 光学像を受光してその電荷像を得る撮像領域を
備えた固体撮像素子基板に対し光学フイルタを接
着してなる固体撮像装置に於いて、該フイルタと
基板との間に介在する接着剤を撮像領域外に局在
せしめた事を特徴とする固体撮像装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986041167U JPS62154658U (ja) | 1986-03-20 | 1986-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986041167U JPS62154658U (ja) | 1986-03-20 | 1986-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62154658U true JPS62154658U (ja) | 1987-10-01 |
Family
ID=30855917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986041167U Pending JPS62154658U (ja) | 1986-03-20 | 1986-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62154658U (ja) |
-
1986
- 1986-03-20 JP JP1986041167U patent/JPS62154658U/ja active Pending