JPS62154608A - Shielded unit - Google Patents

Abstract

PURPOSE:To reduce or eliminate a variation in the inductance of a coil due to the displacement of a shielding unit with respect to the coil by integrally composing a magnetic unit for increasing the inductance value of the coil at a part of the coil of a shielding metal where a magnetic flux exists. CONSTITUTION:A printed coil 4 is formed on an insulator 1. A magnetic unit 5 for increasing the inductance value of the coil is composed integrally inside a ceiling portion where the magnetic flux of the coil 4 of a shielding metal 3 exists. A shielding unit composed in this manner can be readily controlled at distance of height direction with respect to the coil (the thickness of an insulator 2), and even if the distance is increased or decreased, the reduction in the inductance value of the coil due to the shielding metal and the increase in the inductance value due to the magnetic unit cancel each other. Thus, the variation in the inductance value of the coil can be reduced or eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a shield device that can be used in transmitters and receivers of radios, televisions, etc., and other communication equipment in general.

Conventional technology In recent years, the number of radio and television broadcast waves and communication waves from various communication devices has increased, and the performance of the tuner that selects the frequency of the radio waves you wish to receive requires high stability and reliability. It is said that The tuner requires a shielding device, and a fundamental approach to shielding devices is necessary to improve the performance and downsize the equipment.

Examples of conventional shielding devices will be described below with reference to the drawings.

FIG. 8 shows a sectional view of a conventional shield device.

In FIG. 8, 100 is a circuit board.

101 is a printed coil, which is formed on the surface of the circuit board 100. 102 and 103 are shield devices, which cover the printed coil 101 with the circuit board 10.
It is connected to the ground part of 0. Here, the shield devices 102 and 103 have conventionally been made of iron plated with tin or the like.

The operation of the shield device configured as described above will be explained below.

As described above, by covering the printed coil with a grounded shield, the printed coil is electrostatically or electromagnetically shielded from the outside.

Problems to be Solved by the Invention However, in the above configuration, the inductance value of the printed coil changes greatly depending on the position of the shield device with respect to the printed coil, so the inductance value must be adjusted after the shield device is fixed. This has the problem of preventing the thickness of the shield device from being made thinner. In addition, since iron was used as the material for the shield, the Q value of the printed coil was significantly reduced.

In view of the above-mentioned problems, the present invention provides a shield device that reduces or eliminates variations in the inductance value of a printed coil due to the position of the shield device with respect to the printed coil, and further streamlines manufacturing by laminating layers.

Means for Solving the Problems In order to solve the above problems, the shield device of the present invention includes the printed coil or the printed coil disposed in the vicinity of the printed coil or an electric circuit including the printed coil on a laminated board. A shielding metal layer that shields an electric circuit, and a magnetic layer that increases the inductance value of the printed coil, which is placed in a predetermined part of the metal layer where the magnetic flux of the printed coil exists. be.

Operation According to the present invention, the decrease in inductance value of the printed coil due to the proximity of the shielding metal and the increase in the inductance value due to the proximity of the magnetic material cancel each other out. As a result, variations in the inductance value of the printed coil due to misalignment of the shield with respect to the printed coil can be reduced or eliminated. In addition, the overall laminated structure makes it easier to maintain a uniform spacing between the printed coil and the shielding metal layer, and at the same time, streamlines manufacturing.

EXAMPLE Hereinafter, a shield device according to an example of the present invention will be described with reference to the drawings.

FIG. 1 shows a sectional view of a shield device in a first embodiment of the present invention. In FIG. 1, 1 and 2 are insulators. 3 is a shielding metal. 4 is a printed coil, which is formed on the surface of the insulator l. 5
is a magnetic material that increases the inductance value of the printed coil, and is integrally formed inside the ceiling portion of the shielding metal 3 where the magnetic flux of the printed coil 4 exists.

The shield device configured as described above can easily control the distance in the height direction (thickness of the insulator 2) with respect to the printed coil, and even if the distance increases or decreases, The decrease in the inductance value of the coil and the increase in the inductance value due to the magnetic material operate so as to cancel each other out, making it possible to reduce or eliminate fluctuations in the inductance value of the printed coil.

A second embodiment of the present invention will be described below with reference to the drawings.

FIG. 2 is a sectional view of a shield device in a second embodiment of the present invention. In FIG. 2, 6 and 7 are insulators. 8 and 9 are shielding metals. 10 is a printed coil, which is formed on the surface of the insulator 6. 1
) and 12 are magnetic bodies that increase the inductance value of the printed coil, and are integrally formed inside the side portions of the shielding metals 8 and 9 where the magnetic flux of the printed coil exists, respectively.

The shielding device configured as described above can be constructed by providing shielding metal on both sides of the printed coil.
In addition to the effect of the embodiment, the shielding effect is further increased.

A third embodiment of the present invention will be described below with reference to the drawings.

FIG. 3 shows a sectional view of a shield device in a third embodiment of the present invention. In Figure 3, 13 and 1
4 is an insulator. A printed coil 16 is formed on the surface of the insulator 13. 15 is a shielding metal, and a window is opened in a portion where the magnetic flux of the printed coil 16 exists. Reference numeral 17 denotes a magnetic material that increases the inductance value of the printed coil, and is integrally formed outside the ceiling portion of the shielding metal 15 where the magnetic flux of the printed coil 16 exists.

In addition to the effects of the first embodiment, the shield device configured as described above achieves further rationalization of manufacturing by forming a magnetic material, which is difficult to stack, in the outermost layer.

A fourth embodiment of the present invention will be described below with reference to the drawings.

FIG. 4 shows a sectional view of a shield device in a fourth embodiment of the present invention. In Figure 4, 18 and 1
9 is an insulator. A printed coil 22 is formed on the surface of the insulator 18. 20 and 21 are shielding metals, and a window is opened in a portion where the magnetic flux of the printed coil 22 exists. 23 and 24 are magnetic materials that increase the inductance value of the printed coil;
The shielding metals 20 and 21 are integrally formed on the outside of the ceiling portion where the magnetic flux of the printed coils exists.

The shielding device configured as above can be constructed by providing shielding metal on both sides of the printed coil.
In addition to the effect of the embodiment, the shielding effect is further increased.

The fifth and sixth embodiments of the present invention will be described below with reference to the drawings.

FIG. 5 shows a sectional view of a shield device in a fifth embodiment of the present invention. In Figure 5, 25 and 2
6 is an insulator. 29 to 31 are printed coils, which are formed on the surface of the insulator 25.

27th and 2nd are shielding metals. 32 to 37 are magnetic bodies that increase the inductance value of the printed coils, and are integrally formed inside the ceiling portion where the magnetic flux of the printed coils 29 to 31 of the shielding metals 27 and 28 exists.

FIG. 6 shows a sectional view of a shield device in a sixth embodiment of the present invention. In FIG. 6, 38 to 41 are insulators. 45 and 46 are printed coils, which are formed on the surfaces of the insulators 38 and 40. 42
~44 is metal for shielding. 47 to 50 are magnetic materials that increase the inductance value of the printed coil,
The printed coils 45 and 46 of the shielding metals 42 to 44 are integrally formed in the portion where the magnetic flux is present.

The shielding device configured as described above can shield multiple printed coils at once, and at the same time can apply section shielding to any necessary location between each printed coil. In addition to the effects of the first and second embodiments, manufacturing can be further streamlined.

A seventh embodiment of the present invention will be described below with reference to the drawings.

FIG. 7 shows a sectional view of a shield device in a seventh embodiment of the present invention. In FIG. 7, 51 to 54 are insulators. 58 and 59 are printed coils, which are formed on the surfaces of the insulators 51 and 53. 55
57 is a shielding metal, and a window is provided in a portion of the shielding metal 55 where the magnetic flux of the printed coils 58 and 59 exists. 60 to 62 are magnetic materials that increase the inductance value of the printed coils, and the printed coils 58 and 59 are made of shielding metals 55 to 57.
It is integrated in the part where the magnetic flux is present.

Since the shield device configured as described above can reduce the number of magnetic materials compared to the sixth embodiment, the sixth embodiment can further streamline manufacturing.

In the above seven embodiments, ferrite or the like can be used as the magnetic material that increases the inductance of the printed coil. Further, as the laminated substrate constituting the whole, a metal-clad laminated substrate, a thick film N substrate, a thin film laminated substrate, etc. can be used.

Furthermore, if a metal such as copper with high electrical conductivity and low magnetic permeability is used as the shielding metal, shielding can be achieved without deteriorating the Q value of the printed coil.

In the present invention, the magnetic material that increases the inductance value of the coil may be integrally formed anywhere on the shielding metal depending on the purpose as long as the magnetic flux of the coil is present, and the size, shape, and thickness of the magnetic material may also be determined.

The number is also free. Furthermore, regarding the installation of the shield device of the present invention, it is possible to target not only the coil portion but also a part or all of the electric circuit including the coil, and it is not necessarily necessary to install it on both sides of the printed coil.
You can use only one of them. Further, the configuration, shape, etc. of the printed coil to be shielded are also arbitrary.

Effects of the Invention As described above, the present invention prevents the positional deviation of the shielding device relative to the coil (the thickness of the insulator It is possible to reduce or eliminate fluctuations in the inductance value of the coil due to variations in the inductance of the coil. Further, by forming the layered structure, manufacturing can be rationalized.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a shield device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of a shield device according to a second embodiment of the present invention, and FIG. 3 is a cross-sectional view of a shield device according to a second embodiment of the present invention. 4 is a sectional view of the shielding device according to the fourth embodiment of the present invention, FIG. 5 is a sectional view of the shielding device according to the fifth embodiment of the present invention, and FIG. invention number 6
FIG. 7 is a cross-sectional view of a shield device according to a seventh embodiment of the present invention, and FIG. 8 is a cross-sectional view of a conventional shield device. l, 2. 6. 7.13.14.18.19.25.
26.38°39, 40. 41. 51. 52.
53. 54...3-color frame, 4, 10゜16, 22.29.30.31.45.46.58.5
9.101... Printed coil, 3. 8.
9.15.20.21.27゜28, 42.43.44
．． 55.56.57.102.103...Shield metal, 5.1). 12.17.23.2/l,
32.33°34, 35.36. '37.47.4B,
49.50.60.61.62...Magnetic material,
100...Circuit board. Name of agent: Patent attorney Toshio Nakao Haka 1 person 1- Zetsuha tai 2-・ ◆ 5-Bots J company body 61-- Zetsu J1 body 7--- 1) - 11 magnets and body 12-1 -La l3-Insulator! 6~--Plutocoil t'7---*This

Claims (9)

[Claims] (1) A shielding metal layer that shields the printed coil or the electric circuit including the printed coil, which is placed near the printed coil or the electric circuit including the printed coil in a laminated board, and the magnetic flux of the printed coil in the metal layer. and a magnetic layer that increases the inductance value of the printed coil, which is placed in a predetermined portion where the printed coil exists. (2) The shield device according to claim (1), wherein the predetermined portion is the side of the metal layer facing the printed coil. (3) The shield device according to claim 1, wherein the predetermined portion is a side of the metal layer opposite to the side facing the printed coil. (4) Claim No. 1 in which ferrite is used in the magnetic layer that increases the inductance value of the printed coil.
Shield device as described in section. (5) The shielding device according to claim (1), wherein a metal having high electrical conductivity and low magnetic permeability, such as copper, is used as the shielding metal layer. (6) The shield device according to claim (1), which uses a metal-clad laminate substrate as the laminate substrate. (7) The shield device according to claim (1), which uses a thick film laminated substrate as the laminated substrate. (8) The shield device according to claim (1), using a thin film laminated substrate as the laminated substrate. (9) The shielding device according to claim (1), wherein the shielding metal layer and the magnetic layer are provided for a plurality of printed coils or an electric circuit including printed coils.