JPS62153780U - - Google Patents
Info
- Publication number
- JPS62153780U JPS62153780U JP4209486U JP4209486U JPS62153780U JP S62153780 U JPS62153780 U JP S62153780U JP 4209486 U JP4209486 U JP 4209486U JP 4209486 U JP4209486 U JP 4209486U JP S62153780 U JPS62153780 U JP S62153780U
- Authority
- JP
- Japan
- Prior art keywords
- cable
- shield
- folded
- soldered
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007769 metal material Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図は本考案に係るシールド接地構造の正面
図、第２図は組み立て工程を説明するための斜視
図、第３図は従来のシールド接地構造の正面図で
ある。
１，１１……Ｉ／Ｏケーブル、２，１２……銅
編組線、３，１３……シース層、４……アース線
、１２ａ……折り返し編組線部、１４……金属材
、１５ａ……点状半田付け部。
FIG. 1 is a front view of a shield grounding structure according to the present invention, FIG. 2 is a perspective view for explaining the assembly process, and FIG. 3 is a front view of a conventional shield grounding structure. 1, 11... I/O cable, 2, 12... Copper braided wire, 3, 13... Sheath layer, 4... Earth wire, 12a... Folded braided wire portion, 14... Metal material, 15a... Dotted soldering area.
Claims (1)
られているＩ／Ｏケーブルにおいて、該Ｉ／Ｏケ
ーブルの端末で露出し、前記シース層の周面上に
折り返されている折り返しシールド部と、アース
線の端末が半田付けされ、かつ前記折り返しシー
ルド部上に被着されて点状に半田付けされる薄肉
の金属材とを含むことを特徴とするＩ／Ｏケーブ
ルのシールド接地構造。 In an I/O cable in which a shield layer and a sheath layer are provided on a plurality of cores, a folded shield portion exposed at the terminal of the I/O cable and folded back onto the circumferential surface of the sheath layer, and a ground A shield grounding structure for an I/O cable, characterized in that the terminal of the wire is soldered, and a thin metal material is attached to the folded shield part and soldered in dots.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4209486U JPS62153780U (en) | 1986-03-21 | 1986-03-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4209486U JPS62153780U (en) | 1986-03-21 | 1986-03-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62153780U true JPS62153780U (en) | 1987-09-29 |
Family
ID=30857687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4209486U Pending JPS62153780U (en) | 1986-03-21 | 1986-03-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62153780U (en) |
-
1986
- 1986-03-21 JP JP4209486U patent/JPS62153780U/ja active Pending
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