JPS62152671U - - Google Patents
Info
- Publication number
- JPS62152671U JPS62152671U JP3962186U JP3962186U JPS62152671U JP S62152671 U JPS62152671 U JP S62152671U JP 3962186 U JP3962186 U JP 3962186U JP 3962186 U JP3962186 U JP 3962186U JP S62152671 U JPS62152671 U JP S62152671U
- Authority
- JP
- Japan
- Prior art keywords
- flat coil
- motor
- winding
- soldering
- insert
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004804 winding Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Windings For Motors And Generators (AREA)
- Dc Machiner (AREA)
Description
第１図、第２図は本考案の一実施例を示す構成
説明図、第３図は本考案の応用例を示す説明図で
ある。
３…プリント基板、４…コイル。
1 and 2 are configuration explanatory diagrams showing one embodiment of the present invention, and FIG. 3 is an explanatory diagram showing an application example of the present invention. 3... Printed circuit board, 4... Coil.
Claims (1)
向する磁石とで磁気回路を形成する偏平コイルを
使用したモータにおいて、 前記偏平コイルは所定の導体パターンが形成さ
れたプリント基板上に銅線またはアルミニウム線
から成る巻き線を接着固定しかつ、巻線両端が前
記導体パターンに半田付け接続されることを特徴
とする偏平コイルを使用したモータ。[Claims for Utility Model Registration] In a motor using a flat coil that forms a magnetic circuit with a flat coil and opposing magnets arranged so as to insert the flat coil, the flat coil is a printed circuit board on which a predetermined conductive pattern is formed. 1. A motor using a flat coil, characterized in that a winding made of copper wire or aluminum wire is adhesively fixed on a substrate, and both ends of the winding are connected to the conductor pattern by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3962186U JPS62152671U (en) | 1986-03-18 | 1986-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3962186U JPS62152671U (en) | 1986-03-18 | 1986-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62152671U true JPS62152671U (en) | 1987-09-28 |
Family
ID=30852961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3962186U Pending JPS62152671U (en) | 1986-03-18 | 1986-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62152671U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09145793A (en) * | 1995-11-27 | 1997-06-06 | Nec Corp | Surface mount type semiconductor integrated circuit device and socket for connecting emulator socket to it |
-
1986
- 1986-03-18 JP JP3962186U patent/JPS62152671U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09145793A (en) * | 1995-11-27 | 1997-06-06 | Nec Corp | Surface mount type semiconductor integrated circuit device and socket for connecting emulator socket to it |
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