JPS62151777U - - Google Patents

Info

Publication number
JPS62151777U
JPS62151777U JP4036486U JP4036486U JPS62151777U JP S62151777 U JPS62151777 U JP S62151777U JP 4036486 U JP4036486 U JP 4036486U JP 4036486 U JP4036486 U JP 4036486U JP S62151777 U JPS62151777 U JP S62151777U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
test coupon
cut groove
passing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4036486U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4036486U priority Critical patent/JPS62151777U/ja
Publication of JPS62151777U publication Critical patent/JPS62151777U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
JP4036486U 1986-03-18 1986-03-18 Pending JPS62151777U (US07993877-20110809-P00003.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4036486U JPS62151777U (US07993877-20110809-P00003.png) 1986-03-18 1986-03-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4036486U JPS62151777U (US07993877-20110809-P00003.png) 1986-03-18 1986-03-18

Publications (1)

Publication Number Publication Date
JPS62151777U true JPS62151777U (US07993877-20110809-P00003.png) 1987-09-26

Family

ID=30854392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4036486U Pending JPS62151777U (US07993877-20110809-P00003.png) 1986-03-18 1986-03-18

Country Status (1)

Country Link
JP (1) JPS62151777U (US07993877-20110809-P00003.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019069709A1 (ja) * 2017-10-05 2019-04-11 ソニー株式会社 基板、製造方法、及び、電子機器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019069709A1 (ja) * 2017-10-05 2019-04-11 ソニー株式会社 基板、製造方法、及び、電子機器
US11757053B2 (en) 2017-10-05 2023-09-12 Sony Corporation Package substrate having a sacrificial region for heat sink attachment

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