JPS62149193A - Manufacture of through-hole plated wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is a method for drilling holes in a substrate having conductive metal layers on both sides, such as a double-sided copper-clad board or a double-sided printed wiring board. After through-hole plating is applied to the hole wall of the through hole, the copper plating layer, etc. of the hole wall is exposed in order to form a wiring pattern of another conductive metal layer on the board. After forming an alkali-removable resist coating layer so that the copper plating layer and the conductive metal layer exposed by the removal of the resist coating layer are removed by etching, and finally the resin layer formed by the electrodeposition coating is removed. The present invention relates to an improved method of manufacturing a printed wiring board j.

[Description of prior art]

Conventionally, in manufacturing wiring boards in which the walls of through-holes are plated with copper, hole-filling methods, solder stripping methods, tenting methods, and the like have been employed.

The hole-filling method involves embedding curable resin into the copper-plated through-hole to protect the copper-plated layer on the hole wall.
This is a method that requires very little equipment for subsequent etching operations.
It requires extremely complicated manual operations such as heat curing), chiseling, and polishing, and gas is generated during baking of the curable resin filled in the holes, resulting in minute holes, and There was a problem that the cured resin was chipped in the chisel J.

Solder stripping methods, tenting methods, and the like have extremely complicated processes, are difficult to handle, require the use of expensive materials, and are not necessarily effective methods.

In addition, after drilling through holes in a substrate having conductive metal layers on both sides and applying copper plating to the holes, at least the hole walls of the through holes and the surrounding areas of the hole walls, The area other than the copper plating layer is covered with a resist layer with a reverse pattern, and then the copper plating layer such as the hole wall is chemically treated with a specific resin solution to form a resin coating layer (e.g. , imidazole-based resin layer), and finally remove the resist layer with the reverse pattern as well as the copper plating layer and conductive metal layer below the resist layer to obtain a through-hole plated wiring board. Some industrial methods have been implemented.

However, in the above-mentioned known method, a resin solution is applied onto the copper plating layer on the hole wall of the through hole, the applied layer is dried, and a resin coating layer is formed on the copper plating layer on the hole wall. When covering, the hole wall of the through hole is narrow, so
It is difficult to form a coating layer of resin solution with a uniform thickness on the copper plating layer of the hole wall, so the coating layer is dried to form a uniform resin coating with a specific target thickness. As a result, pinholes are likely to be formed in the resin coating layer, and for this reason, during the etching operation of the conductive metal layer in the subsequent process, the pore walls are It often happens that the copper plating layer in the parts is eroded, and the product defect rate is not satisfactory. In addition, the above-mentioned known method
Formation of the above-mentioned coating layer and resin coating layer takes an extremely long time, resulting in insufficient productivity.Furthermore, the resin (?8 liquid) used to form the resin coating layer is a special resin. However, it had problems such as being expensive.

Further, Japanese Patent Publication No. 55-361.98 describes a method for manufacturing a through-hole printed wiring board from an insulating substrate having through-holes and whose entire surface including the inside of the through-holes is coated with a conductive layer. A step of forming an alkali-removable ink layer on unnecessary parts of the conductive layer ■ A step of electrodepositing and coating a water-soluble electrodeposition paint on the necessary parts of the conductive layer, and further curing the paint ■ The alkali-removable ink layer A step of removing the ink layer with an alkaline aqueous solution. A step of etching away unnecessary parts of the exposed conductive layer after the ink layer has been removed. A method for manufacturing a printed wiring board is described, which is characterized by comprising five steps, including a step of removing.

However, in the above method, when the alkali-removable ink layer is removed with an alkaline aqueous solution, the electrodeposition paint layer may be removed at the same time, or even if only the ink layer is removed, the subsequent conductive layer may be removed. It often happens that the electrodeposition paint layer cannot be easily removed after etching, and this method has not been practically usable industrially.

Furthermore, in the above-mentioned known method, since the electrodeposited paint layer is removed using a solvent such as petroleum thinner, the disposal or recovery of the removal solution poses a serious problem in terms of deterioration of the working environment and pollution.

[Requirements of the present invention and its effects]

As a result of intensive research into a method for solving the problems of the above-mentioned known methods in manufacturing wiring boards with through-hole plating using electrodeposition paint, the inventors found that the hole walls of through-holes in wiring boards After copper plating is applied to the hole wall, an alkali-removable resist coating layer with a reverse pattern is formed so that the copper plating layer on the hole wall is exposed, and then the exposed hole wall is covered with an alkali-removable resist coating layer. A cationic electrodeposition coating resin layer is coated on the copper plating layer by electrodeposition using a cationic electrodeposition paint, and only the resist coating layer is coated with basic water. The exposed copper plating layer and the conductive metal layer are removed with 8 liquid (alkaline water solution/&), and the exposed copper plating layer and conductive metal layer are etched, and finally acidic water/8? A method of removing the cationic electrodeposition coating resin layer with &, or after forming a resist coating layer as described above, coating the anionic electrodeposition coating resin layer by electrodeposition coating using an anionic electrodeposition paint. Then, only the resist coating layer is removed with a low concentration basic compound aqueous solution, the exposed copper plating layer and the conductive metal layer are etched, and finally anionic electrodeposition is performed using a basic compound aqueous solution with a high temperature of 4 degrees. The inventors have discovered that high-performance through-hole plated wiring boards can be manufactured with good reproducibility and a low defective rate by a method of removing the painted resin layer, and have completed this invention.

That is, the present invention provides the following methods: +a+ After drilling a hole and applying through ball plating to a hole having a conductive metal layer on both sides, copper plating is applied to at least the hole wall of the through hole and the peripheral portion of the hole wall. An alkali-removable resist coating layer with a reverse pattern is formed over the entire surface of the substrate so that the layer is exposed. A cationic electrodeposition resin layer is coated on the exposed portion of the layer by electrodeposition using a cationic electrodeposition paint, and (C) only the resist coating layer is removed with a basic aqueous solution. (dl) Further, the copper plating layer and the conductive metal layer exposed by the removal of the resist coating layer are removed by etching, and [el]Finally, the cationic electrodeposition coating resin layer is removed with an acidic aqueous solution. A method for manufacturing a through-hole plating wiring board characterized by the following steps: (ao) After forming a T1 layer of alkali-removable resist with a reverse pattern over the entire surface of the board as described above, (b') At least the through-holes An anionic electrocoating resin layer is coated on the hole wall and the exposed portion of the copper plating layer around the hole wall by electrocoating using an anionic electrocoat. C゛) Then, only the resist coating layer is removed with an aqueous solution of a low-grade basic compound of 3.4% by weight or less, and (d゛) the copper plating layer and conductive layer exposed by the removal of the resist coating layer are removed. (e) Finally, the anionic electrodeposited resin layer is removed by etching.
The present invention relates to a method for manufacturing a through-hole plated wiring board, which is characterized in that removal is performed using a highly concentrated basic compound aqueous solution of 5% or more.

The manufacturing method of the present invention allows wiring boards with through-hole plating to be manufactured industrially with high yield and high productivity, and is also a method that can be mechanically automated.

In particular, the manufacturing method of the present invention uses either a cationic or anionic electrodeposition paint on at least the hole wall of the through hole and the exposed portion of the copper plating layer around the hole wall. Even if the electrodeposition coating resin layer is coated with the electrodeposition coating, the electrodeposition coating resin layer is not removed together with the resist coating layer when the resist coating layer is removed. This is an industrially usable method that can be easily removed.

The manufacturing method of this invention is to coat the copper plating layer on the wall of a narrow through-hole with an extremely uniform thickness, no defects such as pinholes, and chemical resistance. It has the advantage that the layer J can be easily formed in a very short time and that the thickness of the resin coating layer can be easily controlled.

The manufacturing method of the present invention has an extremely low product defect rate compared to the generally known manufacturing method of through-hole plating wiring boards that does not use electrodeposition paint.

[Detailed explanation of each requirement of the present invention]

Hereinafter, the manufacturing method of the present invention will be explained in more detail with reference to the drawings.

FIG. 1 is a flow diagram showing an outline of an example of the steps of the manufacturing method of the present invention.

In this invention, first, as shown in steps (1) to (4) in FIG. A suitable hole diameter (hole diameter: preferably about 100 μm or more, particularly 500 μm or more
A through-hole 4 with a diameter of μm or more is drilled, and copper plating (through-hole plating) is applied to the board 1 with the hole formed, and a copper-plated layer 5 is formed on the wall of the through-hole. After forming the through hole 4, at least the hole wall portion of the through hole 4 and the copper plating layer 5 around the hole wall portion are exposed (the first
(See step (4) in the figure), an alkali-removable resist coating layer 6 is formed in a reverse pattern over the entire surface of the substrate 1 to cover the portion to be etched.

[) Formation of a resist coating layer with a reverse pattern as described in Section II can be performed, for example, by superimposing silk screen J or the like that can form a reverse pattern on the copper-plated substrate described above. A hardenable or curable resin paint (thermoplastic resin paint, heat-curable resin paint, photo-curable resin paint, etc.) is printed in a reverse pattern through the wafer, and then subjected to appropriate hardening or curing processes such as drying, thermosetting, photocuring, etc. "Printing method" that directly forms a resist coating layer using a curing method
can be preferably mentioned.

Further, the formation of the resist coating layer with the above-mentioned reverse pattern can be carried out by, for example, applying a photosensitive resin solution to the copper-plated substrate and drying it to form a film made of the photosensitive resin, and then forming the resist coating layer with the reverse pattern. By irradiating light through a patterned mask to perform reverse pattern photocuring of the film made of photosensitive resin and removing the uncured portions, the hole walls of the through holes in the substrate and the hole walls are formed. This can also be done by exposing the copper plating layer around the area.

In addition, a dry film made of a photosensitive resin is laminated on a substrate, and the dry film is irradiated with light and developed in the same manner as in the case of the film made of a photosensitive resin, thereby forming a resist with the above-mentioned reverse pattern. It is also possible to form a covering layer.

The material forming the reverse pattern alkali-removable resist coating layer exhibits sufficient electrical insulation properties in electrolytic coating, and is compatible with basic aqueous solutions (preferably pH 9811 or higher, particularly preferably pH 12 or higher). It is preferable that the material is alkaline water soluble* and can be easily removed or peeled.

In the manufacturing method of this invention, a resist coating r with a reverse pattern is used.
Using a substrate on which a gI layer is formed, at least the hole wall of the through hole and the copper plating layer around the hole wall are exposed, as shown in (5) in FIG. A cationic or anionic electrodeposition coating is applied to the surface of the area by "electrodeposition painting" in which a cationic or anionic electrodeposition paint is used and the copper plating layer 5 is used as one of the electrodes. The resin layer 7 is coated uniformly.

The above-mentioned electrodeposition coating uses the fact that the water-soluble resin paint is electrically charged in water, and electrophores the resin paint components.
This invention relates to a method of depositing and coating the resin component on the surface of an object to be covered.

The resin components in the electrodeposition paint used for the electrodeposition coating include fat, anionic electrodeposition coating resin (charged (-) in water), which is electrodeposited using the object to be coated as an anode, and fbl.
There is an r-cationic electrodeposition coating resin [charged (+) in water] which is electrodeposited on the object to be coated as a cathode, and both can be used in the respective manufacturing methods of the present invention.

As the cationic electrodeposition coating resin used in the first method of the present invention, for example, the epoxy groups of an epoxy resin (evoquinated polybutadiene, etc.) are
Examples include resins made water-soluble by addition and ring-opening with a grade amine and neutralization with an organic acid, and resins made by partially ring-opening the epoxy resin with an amine and then reacting it with an organic acid.

Further, the anionic electrodeposition coating resin used in the second method of the present invention has a carboxyl group in its molecule and has a high acid value, and is compatible with salt methods such as ammonia, organic amines, and caustic alkali. Any water-soluble polymer compound that has the property of reacting to form a salt may be used, for example,
Maleated oils (such as maleated castor oil), maleated liquid polybutadiene, maleated resins such as epoxy resins with ring-opened epoxy groups with carboxylic acid and added maleic anhydride, phenolic resin-modified maleated resins, maleated resins Examples include resins obtained by halfestering with alcohol, alkyd resins, liquid polybutadiene resins having carboxyl groups at the terminals, styrene-allyl alcohol resins, acrylic resins, and the like.

The resin liquid (electrodeposition paint) used for electrodeposition coating preferably has a resin component concentration of 1 to 20% by weight, particularly about 5 to 15% by weight, and a suitable solvent having a hydrophilic group. It is preferable that the material is added with a solvent to give it fluidity that is easy to handle. For example, it is appropriate that an alcoholic solvent such as isopropanol or methyl cellosolve is blended in an amount of about 2 to 10% by weight. In order to improve water dispersion of the contained resin, it is also preferable to add a neutralizing agent such as ammonia or diethylene amine in an appropriate proportion.

The electrodeposition coating in the manufacturing method of the present invention can be performed by a known method, and the coating temperature is about 70°C or less, especially 10 to 60°C, and the applied voltage is about 1 to 80V, especially 2 to 60°C. It is preferable that the voltage is about 60V.

In this invention, the electrodeposited resin layer formed by electrodeposition on the hole wall of the through hole of the substrate and the surrounding area of the hole wall is further washed with water and dried, and then heated at a temperature of about 60 to 150°C. Heat treatment to form a resist with a reverse pattern as described below.
It is preferable that the adhesion strength is sufficient to prevent the electrodeposition coating resin layer from peeling off during the f1 layer removal process.

In the first method of the present invention, after forming the cationic electrodeposition coating resin layer, only the resist coating layer 6 of the reverse pattern is applied, as shown in steps (6) to (7) in FIG. The copper plating layer 5 and the conductive metal layer 2 exposed by removing the resist coating layer 6 of the reverse pattern are etched with a suitable metal (copper) etching solution. As a result, as shown in step (7) in FIG.
The copper plating layer 5 protected by the cationic electrodeposited resin layer 7 remains in the through hole 4 portion.

The reverse pattern of the resist coating layer 6 can be removed from the substrate coated with the cationic electrodeposited resin layer using alkaline water?
8 liquid (e.g. about 0.1 to 10% by weight, especially 0.5 to 8% by weight)
This can be carried out by immersion, fountain washing, etc. using an aqueous solution of a strong basic compound such as caustic soda, caustic potash, or soda carbonate, or an alkaline aqueous solution containing an organic solvent (wt%).

In the first method of the present invention, after performing the etching step, the etched wiring board is treated with an acidic aqueous solution (for example, a low concentration sulfuric acid aqueous solution of 10% by weight or less, particularly preferably 5% by weight or less). , acetic acid aqueous solution, etc.).
0~100'C1 Especially at a temperature of about 5~50℃, about 1
By treating for 60 minutes, especially 2 to 30 minutes, the cationic electrodeposition coating resin layer is removed, as shown in step (8) in FIG.

Further, when the electrodeposition coating resin layer in the second method of the present invention is formed of anionic electrodeposition==resin, 3
．． Low 7 of 4 weight% or less, preferably 3.0 weight% or less;
An aqueous solution of a basic compound at pH (or preferably pH
An aqueous solution of a basic compound having a concentration of about 12.0 to 13.6) is used to remove the resist coating layer so that the anionic electrodeposition coating resin layer is substantially removed without stagnation.

The removal temperature is preferably about 0 to 60°C, particularly about 5 to 55°C.

In the second method of the present invention, after performing the etching step, at least 3.5% by weight, preferably from 3.6% to
10% by weight highly concentrated basic compound aqueous solution (e.g. pH
is higher than 13.6 (and in addition, an aqueous solution of a basic compound with a high concentration of 3.5% by weight or more, especially an aqueous solution of caustic soda, caustic potash, soda carbonate, etc. with a high concentration of 3.5% by weight or more)
, ) etc., preferably at a temperature of 0 to 80 °C,
The anionic electrodeposition coating resin layer is completely removed as shown in step (8) in FIG.

In the second method of the present invention, the highly concentrated aqueous basic compound solution used to remove the anionic electrodeposition coating resin layer contains about 1 to 30% by weight, particularly 5 to 25% by weight of a suitable organic polar solvent. % of the anionic electrodeposition coating resin layer is suitable because it can further facilitate the removal of the anionic electrodeposition coating resin layer.

The organic polar solvent may be any organic solvent that has sufficient compatibility with the highly concentrated aqueous basic compound solution and is capable of dissolving or swelling the anionic electrodeposition coating resin layer. For example, the following can be mentioned.

i) Amide-based solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, and dimethylsulfoxide-based abrasive solvents.

lI) Ethylene glycol #■ forms or polymers such as ethylene glycol, diethylene glycol, triethylene glycol, and tetraethylene glycol, ethylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, ethylene glycol monomethyl ether, and polyethylene glycol monomers or ethylene glycol compounds such as dialkyl ethers.

111) Alcohol compounds such as monohydric water-soluble lower alcohols such as methanol, ethanol, isopropyl alcohol, and butanol, and polyhydric alcohols such as pentaerythritol and glycerin.

〔Example〕

The manufacturing method of the present invention will be explained in more detail with reference to Examples below.

Reference Example 1 Production method of cationic electronic material 12 g of lath-1,4-polybutadiene was added to 108 g of n-hexane together with 48 g of an aqueous solution of iM hydrogenide (?H degree; 31% by weight) and 1 g of formic acid. The solution is 5
The reaction was carried out at 0°C for 3 hours to obtain epoxylated polybutadiene having an evoquinization rate of 3.7 mol%.

To 5 g of this epoxidized polybutadiene, 15 g of morpholine was added.
Add 0 ml and 0.16 g of phenol as a catalyst,
The mixture was reacted at 120°C for 5 hours to open the epoxy groups, and neutralized with lactic acid to obtain a water-soluble polybutadiene cationic electrodeposition paint.

Reference Example 2 Maleated polybutadiene produced by Anion Nisaki S (manufactured by Nippon Raidatsu Co., Ltd.; Nl
5SO-PB BN-1015) 20g, 1.4-
Dissolved in 40 ml of dioxane, and further added 50 ml of ethylene glycol butyl ether to the solution.
The reaction was carried out at 0° C. for 3 hours to open the ring of maleic anhydride to obtain polybutadiene monoester carboxylic acid (water-soluble polybutadiene). This polymer was neutralized with ammonia to obtain an anionic electrodeposition paint.

Reference example 3 Anion 7, elm? Using an anti-stick alkyd resin liquid (properized by Nippon Shokubai Kagaku Kogyo Co., Ltd., Prolats 1271), a solution with a non-volatile content of 70% by weight of an ethylene glycol solvent was made, and this solution was further diluted with water to make a solution with a non-volatile content of 15% by weight. The solution was made into 7 volumes of water, and further triethylamine was added to neutralize it to prepare an anionic electrodeposition paint.

Example 1 A through hole with a diameter of 500μ was opened in a double-sided copper-clad board, and copper plating was applied as through-hole plating.
A resist coating layer (material: manufactured by Sanei Kagaku Co., Ltd.; etching resist) with a reverse pattern is applied over the entire surface of the board so that at least the hole wall of the through hole and the copper plating layer around the hole wall are exposed. 5EP-400B
L) was formed by screen printing.

The cationic electrodeposition paint containing the water-soluble polybutadiene produced in Reference Example 1 (rotational viscosity at 25°C; 100 centivoise, pH: 6.0) was placed in a beaker, and while being gently stirred, the carbon The anode and the substrate side on which a resist coating layer is formed on the double-sided copper-clad substrate and the copper plating layer on the hole wall of the through hole and the peripheral area of the hole wall are exposed are used as the cathode, distance 2
0 fl, and then applied a voltage of 5μ and passed the current for 2 minutes to perform electrodeposition coating, and the cationic electrodeposition resin layer made of the above-mentioned modified polybutadiene was applied to the hole wall of the through hole. and the copper plating layer around the hole wall.

The substrate on which the electrodeposited resin layer was formed on the copper plating layer of the through-hole portion as described above was washed under running tap water for 3 minutes and dried in a hot air dryer at 60° C. for 30 minutes. Thereafter, only the resist coating layer on the substrate was removed using a 5% by weight aqueous solution of caustic soda.

The substrate on which the copper plating layer was exposed due to the above-mentioned removal of the resist coating layer was etched with an alkaline etching solution (manufactured by Yamatoya Shokai ■, product name: Alkali Etch) at 40°C for 10 minutes to remove the copper plating layer under the resist coating layer. The conductive metal layer consisting of the copper plating layer and the copper clad layer exposed from the plate was removed.

Furthermore, after washing the substrate subjected to the above-mentioned etching treatment with water, it was immersed in a 2% sulfuric acid aqueous solution at 25°C for 5 minutes to remove the cationic electrodeposition coating resin layer made of modified polybutadiene, and to remove the through-etching. A double-sided printed wiring board was manufactured in which the hole wall portion was electrically conductive by a copper plating layer.

Example 2 10 g of water-soluble polybutadiene produced in Reference Example 2 was
Using an anionic electrodeposition paint dissolved in Qmf water, neutralized with ammonia, and adjusted to pH 8, electrodeposition was carried out using a stainless steel plate as a cathode and the substrate side manufactured in the same manner as in Example 1 as an anode. The coating conditions were a voltage of 30 V and a current application time of 3 minutes to form an anionic electrodeposition coating resin layer on the exposed copper layer of the substrate, and then drying the anionic electrodeposition coating resin layer formed on the substrate. This was carried out at 100° C. for 15 minutes to form an anionic electrodeposition coating resin layer on the hole wall of the through hole of the substrate and the copper plating layer on the periphery of the hole wall.

The substrate having the anionic electrodeposition coating resin layer produced as described above was treated with a 2% by weight aqueous caustic soda solution (pH 1
3, 51), was immersed at 40° C. for 25 seconds to peel off only the resist coating layer of the reverse pattern and expose the underlying copper plating layer.

This substrate was treated with a 40° Baume ferric chloride aqueous solution for 50°C.
The conductive metal layer consisting of the copper plating layer and the copper clad layer was removed by etching at .degree. C. for 3 minutes.

Furthermore, after washing the substrate subjected to the above-mentioned etching treatment with water, a 5% by weight caustic soda aqueous solution (pi(13,82)
The double-sided printed wiring board, in which the through-hole walls are electrically conductive by the copper plating layer, was immersed for 10 minutes at 40°C to remove the anionic electrodeposition coating resin layer made of modified polybutadiene. Manufactured.

Example 3 5% by weight aqueous caustic soda solution (pH 13,82) 80
Example 2 except that a mixed solution of 20 parts by weight and diethylene glycol-monoethyl ether was used to remove the anionic electrodeposition coating resin layer, and the immersion time of the substrate in the mixed solution was 5 minutes. Similarly, a double-sided printed wiring board was manufactured in which the wall portions of the through holes were electrically connected by the copper coating layer.

In this method, the removal time of the anionic electrodeposition coating resin layer could be reduced to about half that of Example 2.

Example 4 The anionic electrodeposition paint prepared in Reference Example 3 was used as the electrodeposition material, and the drying conditions for the anionic electrodeposition coating resin layer formed on the substrate were set at 130°C for 10 minutes. Otherwise, the same procedure as in Example 3 was carried out to produce a double-sided printed wiring board in which the wall portions of the through holes were electrically connected by the copper plating layer.

In this method, the removal time of the anionic electrodeposition coating resin layer was about 2 minutes.

Example 5 In forming a resist coating layer with a reverse pattern, a resist ink made of a photocurable resin (Toyobo side type, ultraviolet curable resist ink EP 110) was screen printed, and then the resist ink layer was coated with 8Q W / am U
In the same manner as in Example 1, except that it was photocured by light irradiation with an ultra-high pressure mercury lamp for 1.5 minutes at V.
Using a cationic electrodeposition paint, a double-sided printed wiring board was manufactured in which the walls of the through holes were electrically conductive with a copper plating layer.

[Brief explanation of drawings]

FIG. 1 is a flow diagram showing an outline of an example of the steps of the manufacturing method of the present invention. +11 Board (epoxy-impregnated glass material clad with copper foil) (2) Hole drilling (3) Panel copper plating (through-hole plating) (4
) Reverse pattern printing (ink or photosensitive material) (5) Electrodeposition coating (formation of electrodeposition coating resin layer) (6) Removal of resist coating layer (7) Etching (removal of copper outside the circuit) (8) Electrodeposition Removal of painted resin layer 1; substrate; 2; conductive metal layer; 3; base material; 4; through hole; 5; copper plating layer; 6; resist coating layer; 7; electrodeposited resin layer. Patent applicant Ube Industries Co., Ltd. Meiko Electronics Industry Co., Ltd. (5th page 1 -

Claims (3)

[Claims] (1) After drilling holes in a substrate having conductive metal layers on both sides and applying through-hole plating, at least the hole wall of the through-hole and the copper plating layer around the hole wall are exposed. An alkali-removable resist coating layer with a reverse pattern is formed over the entire surface of the substrate so that at least the hole wall of the through hole and the copper plating layer around the hole wall are exposed. A cationic electrodeposition resin layer is coated on the portion by electrodeposition using a cationic electrodeposition paint, and only the resist coating layer is removed with a basic aqueous solution. A method for producing a through-hole plated wiring board, which comprises removing the copper plating layer and the conductive metal layer exposed by the removal by etching, and finally removing the cationic electrodeposited resin layer with an acidic aqueous solution. (2) After drilling holes in a substrate having conductive metal layers on both sides and applying through-hole plating, at least the hole wall of the through-hole and the copper plating layer around the hole wall are exposed. An alkali-removable resist coating layer with a reverse pattern is formed over the entire surface of the substrate so that at least the hole wall of the through hole and the copper plating layer around the hole wall are exposed. An anionic electrodeposition resin layer is coated on the part by electrodeposition using an anionic electrodeposition paint, and only the resist coating layer is coated with a low concentration basic compound aqueous solution of 3.4% by weight or less. Further, the copper plating layer and the conductive metal layer exposed by the removal of the resist coating layer are removed by etching, and finally, the anionic electrodeposition coating resin layer is coated with a high A method for producing through-hole plating wiring boards characterized by removal using a concentrated basic compound aqueous solution. (3) The method for manufacturing a through-hole plated wiring board according to claim (2), wherein the highly concentrated aqueous basic compound solution for removing the anionic electrodeposition coating resin layer contains an organic polar solvent.