JPS62147630A - Manufacture of envelope for plate type display device - Google Patents

Abstract

PURPOSE:To shorten the tie of production and improve yield by forming frits on the front and the back surfaces of the part between the side plate and the reinforcing side plate of the back plate and then fusing the baked back plate which is placed between the case and the reinforcing side plate. CONSTITUTION:Frits 5a and 5b are formed on the front and the back surfaces of the peripheral part of a back plate 5 located between a side plate 3 and a reinforcing side plate 6. Next, after a locked back plate 5 is placed on the upper surface of the side plate 3, the reinforcing side plate 6 is placed on the frit 5a. After that, a case 4 containing an electrode structure, the back plate 5 and the reinforcing side plate 5 are fused by baking at 400-500 deg.C to obtain a plate display device. The gradient of baking temperature adopted when the back plate 5 is heated to 300-400 deg.C after frits 5a and 5b are formed on the back plate 5 is about 200 deg.C/h during temperature increase and about 170 deg.C/h during temperature decrease. This baking process taken only about 5hr.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing an envelope for a flat panel display.

Conventional flat panel display devices utilize thermionic emission, and electron beams emitted from a thermionic emission source are focused, deflected, and accelerated by a group of flat electrodes with a large number of holes onto the display surface. It has a configuration that causes electron beams to collide and emit light. FIG. 2 shows an exploded perspective view of a conventional envelope 101 for a flat panel display device. However, exhaust pipes, external terminals, etc. are omitted. The envelope 101 has a container 104 formed by a front plate 102 and side plates 103, a back plate 105 made of a metal plate, and a reinforcing side plate 106. Frits 1o3b are formed on the upper surface 103a of the side plate 103, and after forming frits 300-4
An electrode assembly (not shown) is placed in a predetermined position inside the container 104 fired at 00°C, and an external lead terminal (not shown) is installed.
The back plate 105 is placed on the frit 103b formed on the upper surface 103a of the side plate 103. Reinforcement side plate 1
A reinforcing side plate 1 in which a frit 106b is formed on the lower surface 106a of 06 and fired at 300 to 400''C after forming the frit.
06 is placed on the back plate 105. A flat plate type display device is obtained by baking and sealing the container 104 in which the electrode structure is arranged, the back plate 10S, and the reinforcing side plate 106 at 400 to 500"C. After forming the frit 103b on the upper surface 103a of the side plate 103. and the lower surface 108a of the reinforcing side plate 108
After forming the frit 106b, the step of firing it to 300 to 400''C is performed to remove the binder contained in the frit, and is an essential step in order not to deteriorate the performance of the thermionic emission source.

Problems to be Solved by the Invention When a flat panel display device is manufactured using such a process, the container 1
04 and 300 to 40 to form the reinforcing side plate 106.
In particular, when forming the container 104, which is characterized by a firing process at 0° C., it is necessary to make the temperature gradient during firing gentle because the container 104 has a large capacity. In the case of a flat panel display device of about 40I, the firing temperature gradient of the container 104 is 2 when rising.
The temperature is 6°C/h or less, and 10°C/h or less when descending, and this process requires more than 50 hours. Also, during baking, container 1
The present invention aims to eliminate this drawback, shorten the process time, and improve the yield.

Means for Solving the Problems The technical means of the present invention for solving the above problems is to form frits on the front and back sides of the part of the back plate that is sandwiched between the side plate and the reinforcing side plate to form a frit. The post-fired back plate is sandwiched and sealed between the container and the reinforcing plate.

Effect The effect of this technical means is that it is no longer necessary to form a frit on the reinforcing side plate and the container and fire it at 300-400''C.

Embodiment FIG. 1 shows an envelope 1 for a flat panel display device according to an embodiment of the present invention.
An exploded perspective view is shown. However, the exhaust pipe and external outlet 1 are omitted. The envelope 1 has a container 4 formed of a front plate 2 and side plates 3, a back plate 5, and a reinforcing side plate 6. An electrode assembly (not shown) is placed at a predetermined position inside the container 4 and connected to an external lead terminal (not shown). A back plate 6 in which frits 5a and 6b are formed on the front and back sides of the part n sandwiched between the side plate 3 and the reinforcing side plate 6 of the back plate 6, and the frits are formed and fired.
is arranged on the upper surface 3a of the side plate 3, and the rear plate 5 plate 6 and the reinforced side 1
A flat panel display device is obtained by baking and sealing [6] at 400 to SOO°C. Frits 5a and 5 on the back plate 6
The firing temperature gradient in the step of firing to 300 to 400"C after forming b is about 200°C/h when rising and about 170°C/h when falling, and in this process, the temperature gradient is about 6 degrees F.
175-Not required. Here, the container 4 may have a structure in which the front plate 2 and the side plate 3 are not integrated, but are airtightly joined by a frit or the like. Furthermore, the side plate 3 may have a structure in which a plurality of side plate members are hermetically joined together using frits or the like. Further, it goes without saying that the reinforcing side plate 6 may also be divided into a plurality of pieces.

Effects of the Invention The present invention forms 7 holes on the front and back sides of the portion of the back plate that is sandwiched between the side plate and the reinforcing side plate, and after forming a frit, the baked back plate is sandwiched and sealed between the container and the reinforcing side plate to form a flat plate. By using the process of forming the frit on the back plate and then firing it, the process time for removing the binder from the frit can be significantly shortened.
However, by reducing the number of times the envelope is fired, it is possible to prevent the envelope from cracking due to thermal strain that occurs during firing, which has a great industrial effect.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view of an envelope for a flat panel display device manufactured using the manufacturing method according to the present invention, and FIG. 2 is an exploded perspective view of a conventional envelope for a flat panel display device. 1...Envelope, 2...Front plate, 3...
...Side plate, 4...Container, 5...Back plate, 5a, sb...Frit, 6...
・Reinforced side plate.

Claims (1)

[Claims] A frit is formed on the front and back sides of the portion of the back plate formed of a metal plate that is sandwiched between the side plate and the reinforcing side plate, and the back plate is fired after forming the frit, and one side including the front plate and the side plate is open. A method of manufacturing an envelope for a flat panel display device, characterized in that the container is sandwiched and sealed with the reinforcing side plate.