JPS6214737U - - Google Patents

Info

Publication number
JPS6214737U
JPS6214737U JP10565585U JP10565585U JPS6214737U JP S6214737 U JPS6214737 U JP S6214737U JP 10565585 U JP10565585 U JP 10565585U JP 10565585 U JP10565585 U JP 10565585U JP S6214737 U JPS6214737 U JP S6214737U
Authority
JP
Japan
Prior art keywords
electronic component
envelope
sealing resin
molded
mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10565585U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10565585U priority Critical patent/JPS6214737U/ja
Publication of JPS6214737U publication Critical patent/JPS6214737U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP10565585U 1985-07-12 1985-07-12 Pending JPS6214737U (US20020193084A1-20021219-M00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10565585U JPS6214737U (US20020193084A1-20021219-M00002.png) 1985-07-12 1985-07-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10565585U JPS6214737U (US20020193084A1-20021219-M00002.png) 1985-07-12 1985-07-12

Publications (1)

Publication Number Publication Date
JPS6214737U true JPS6214737U (US20020193084A1-20021219-M00002.png) 1987-01-29

Family

ID=30980292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10565585U Pending JPS6214737U (US20020193084A1-20021219-M00002.png) 1985-07-12 1985-07-12

Country Status (1)

Country Link
JP (1) JPS6214737U (US20020193084A1-20021219-M00002.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11031313B2 (en) 2019-06-27 2021-06-08 Mitsubishi Electric Corporation Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11031313B2 (en) 2019-06-27 2021-06-08 Mitsubishi Electric Corporation Semiconductor device
DE102020116361B4 (de) 2019-06-27 2022-12-01 Mitsubishi Electric Corporation Halbleitervorrichtung

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