JPS62147345U - - Google Patents

Info

Publication number
JPS62147345U
JPS62147345U JP3588286U JP3588286U JPS62147345U JP S62147345 U JPS62147345 U JP S62147345U JP 3588286 U JP3588286 U JP 3588286U JP 3588286 U JP3588286 U JP 3588286U JP S62147345 U JPS62147345 U JP S62147345U
Authority
JP
Japan
Prior art keywords
beam lead
type semiconductor
semiconductor element
lead type
bonding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3588286U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3588286U priority Critical patent/JPS62147345U/ja
Publication of JPS62147345U publication Critical patent/JPS62147345U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP3588286U 1986-03-12 1986-03-12 Pending JPS62147345U (US07179912-20070220-C00144.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3588286U JPS62147345U (US07179912-20070220-C00144.png) 1986-03-12 1986-03-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3588286U JPS62147345U (US07179912-20070220-C00144.png) 1986-03-12 1986-03-12

Publications (1)

Publication Number Publication Date
JPS62147345U true JPS62147345U (US07179912-20070220-C00144.png) 1987-09-17

Family

ID=30845774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3588286U Pending JPS62147345U (US07179912-20070220-C00144.png) 1986-03-12 1986-03-12

Country Status (1)

Country Link
JP (1) JPS62147345U (US07179912-20070220-C00144.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010251374A (ja) * 2009-04-10 2010-11-04 Renesas Electronics Corp 半導体装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010251374A (ja) * 2009-04-10 2010-11-04 Renesas Electronics Corp 半導体装置およびその製造方法

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